AMD XCV50-5BG256C

Overview

XCV50-5BG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells in a 16×24 CLB array, 180 user I/O pins, and four dedicated delay-locked loops (DLLs) for clock management. It supports 66-MHz PCI compliance, hot-swappable operation in Compact PCI systems, and multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, and HSTL Class IV.

For engineers reviewing the XCV50-5BG256C datasheet, pinout, applications, or equivalent options, key selection considerations include its -5 speed grade (guaranteed 180 MHz LVTTL I/O performance), BG256 ball grid array package with 256 balls, commercial temperature range (0°C to +85°C), and support for in-system reprogramming via JTAG, SelectMAP™, or slave serial modes.

Technical Context

The XCV50-5BG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock™ interconnect, and peripheral VersaRing™ I/O routing. Its CLBs contain four logic cells each-each with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, dual-ported RAM, or shift registers-and two dedicated carry chains per slice for high-speed arithmetic.

Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and IEEE 1149.1 boundary-scan. Eight I/O banks enable mixed-voltage operation, with VCCO and VREF pins assigned per bank to support concurrent LVTTL (3.3 V), LVCMOS2 (2.5 V), and HSTL Class IV (1.5 V) signaling standards.

Key Specifications

Pinout & Package

Package: 256-ball Ball Grid Array (BG256), 1.27 mm pitch, body size 27 mm × 27 mm, RoHS-compliant, commercial temperature grade (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV50-5BG256C, the XCV50-6BG256C offers higher guaranteed performance without changing footprint or power profile, while the XCV100-5BG256C retains identical timing and packaging but doubles logic capacity-making both viable alternatives depending on whether speed or density is the limiting constraint.

Availability

XCV50-5BG256C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging data pipelines, telecom line card interfaces, and PCI bridge controller applications requiring stable component supply and long-term obsolescence management.

Supply support for XCV50-5BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGA architectures and advanced design toolchains.

The Virtex family, including XCV50-5BG256C, was designed for high-performance, high-density logic implementation in communications infrastructure, industrial automation, and test & measurement systems where reconfigurability and deterministic timing are critical.

FAQ

Is XCV50-5BG256C still in production or supported by Xilinx?

No, XCV50-5BG256C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured or supported with new silicon, but Aetrix Electronics maintains legacy inventory with full traceability and provides obsolescence mitigation services including cross-reference analysis and migration path guidance for XCV50-5BG256C users.

What development tools are compatible with XCV50-5BG256C?

XCV50-5BG256C is fully supported by Xilinx Foundation™ Series and Alliance Series™ design environments, including Foundation F1.5 through F3.x releases. These tools provide schematic entry, VHDL/Verilog simulation, automatic place-and-route, bitstream generation, and JTAG programming for XCV50-5BG256C. Later ISE versions do not support this device.

Can XCV50-5BG256C operate with 3.3 V I/O while using 2.5 V core voltage?

Yes, XCV50-5BG256C supports mixed-voltage operation: VCCINT = 2.5 V for core logic and VCCO = 3.3 V for I/O banks. This configuration enables direct interfacing with LVTTL and PCI-compliant peripherals while maintaining lower core power consumption and improved noise margin for internal logic.

Does XCV50-5BG256C support hot-swap functionality in Compact PCI systems?

Yes, XCV50-5BG256C is explicitly designed for hot-swappable Compact PCI applications. Its I/O structure includes programmable weak-keeper circuits, controlled slew-rate drivers, and robust ESD protection-meeting PICMG 2.1 requirements for insertion/removal under power without damaging the host backplane or adjacent cards.

What is the maximum operating frequency of the DLLs in XCV50-5BG256C?

The four dedicated DLLs in XCV50-5BG256C operate up to 200 MHz, matching the device's maximum system clock rating. Each DLL locks to an external reference clock (e.g., GCLK0–GCLK3) and generates phase-aligned, low-jitter outputs for internal clock distribution, with typical jitter <150 ps peak-to-peak under nominal conditions.