AMD XCV50-5BG256I

Overview

XCV50-5BG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells in a 16×24 CLB array, and 180 user I/O pins in a 256-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (LUTs as 16-bit RAM/shift register/dual-port RAM, plus 32,768-bit block RAM), and supports 66-MHz PCI compliance for high-speed interface applications in industrial control and communications infrastructure.

For engineers reviewing the XCV50-5BG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (200 MHz system performance), industrial temperature range (–40°C to +100°C), 0.22 μm 5-layer metal CMOS process, IEEE 1149.1 boundary-scan support, and SelectIO™ compatibility with LVTTL, LVCMOS2, PCI, HSTL, and SSTL standards.

Technical Context

The XCV50-5BG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling efficient place-and-route for complex synchronous designs. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5-/6-input functions, and dual-port block RAMs configured as 4k-bit synchronous dual-ported memory.

Each IOB supports independent input/output flip-flops with programmable clock enable, synchronous/asynchronous set/reset, and configurable polarity. I/O banking enforces VCCO and VREF voltage grouping across eight banks, supporting mixed signaling standards only when sharing compatible supply voltages (e.g., 3.3 V for LVTTL/PCI/SSTL3).

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (BG256), 1.27 mm pitch, body size 17 mm × 17 mm, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV50-5BG256I, the XCV50-6BG256I offers higher guaranteed clock frequency at the cost of increased power and reduced timing margin, while the XCV100-5BG256I retains identical speed and packaging but doubles logic capacity - making it ideal for incremental feature upgrades without layout revision.

Availability

XCV50-5BG256I is available at Aetrix Electronics and suitable for industrial control systems, PCI-compliant instrumentation, and avionics interface modules requiring stable component supply throughout extended product lifecycles.

Supply support for XCV50-5BG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex family was designed as high-performance, high-capacity SRAM-based FPGAs targeting demanding applications in wired/wireless communications, aerospace, and industrial automation - emphasizing place-and-route efficiency and silicon utilization via hierarchical architecture and advanced 0.22 μm process.

FAQ

What is the maximum operating frequency supported by XCV50-5BG256I?

The XCV50-5BG256I has a -5 speed grade specifying guaranteed system performance up to 200 MHz, including I/O timing under worst-case voltage and temperature conditions. This is validated through Xilinx's characterization across representative logic paths such as register-to-register, adder, and multiplier circuits - not a theoretical limit but a production-tested timing guarantee.

Does XCV50-5BG256I support hot-swap operation in Compact PCI systems?

Yes, XCV50-5BG256I is explicitly designed for hot-swappable Compact PCI applications. Its I/O architecture meets PCI electrical specifications, and its configuration logic includes robust power-on reset behavior and INIT_B status signaling to coordinate safe insertion/removal sequences with system management controllers.

How many block RAMs does XCV50-5BG256I contain, and what are their configurations?

XCV50-5BG256I contains eight 4,096-bit block SelectRAMs totaling 32,768 bits. Each block is a fully synchronous dual-ported RAM with independent address/data/control per port, supporting configurable aspect ratios (e.g., 1×4096, 2×2048, 4×1024, up to 16×256) and built-in bus-width conversion - all without consuming CLB resources.

Can XCV50-5BG256I interface directly with 5 V TTL devices?

XCV50-5BG256I supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, allowing direct connection to 5 V logic outputs. However, its outputs are not 5 V capable - they operate at 3.3 V or 2.5 V (VCCO-dependent), so level-shifting is required for driving 5 V inputs unless external pull-up schemes are used per I/O banking rules.

Is boundary-scan testing supported on XCV50-5BG256I?

Yes, XCV50-5BG256I includes full IEEE 1149.1-compliant boundary-scan logic with TCK, TMS, TDI, and TDO pins. This enables board-level interconnect testing, in-system programming, and debug visibility without requiring physical probe access - verified and documented in DS003-4 Pinout Tables and DS003-2 Functional Description.