AMD XCV50-5CS144C

Overview

XCV50-5CS144C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells, 94 user I/O pins, and four dedicated delay-locked loops (DLLs). It operates at -5 speed grade (typical 160 MHz system performance), uses a 0.22 μm 5-layer metal CMOS process, and targets high-speed digital logic implementation in PCI-compliant embedded control and communications interfaces.

For engineers reviewing the XCV50-5CS144C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, CLB and IOB configuration capabilities, SelectIO™ interface support, block RAM mapping, and obsolescence-aware supply guidance for legacy Virtex design continuity.

Technical Context

The XCV50-5CS144C implements a hierarchical FPGA architecture centered on configurable logic blocks (CLBs) arranged in a 16×24 array and surrounded by programmable input/output blocks (IOBs). Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice - enabling high-speed arithmetic and pipelined logic.

Its CS144 chip-scale package supports 94 user I/O pins distributed across eight I/O banks, each with independent VCCO and shared VREF routing. The device integrates two columns of block SelectRAM (8 × 4,096-bit dual-ported RAMs), four DLLs for clock deskew, and IEEE 1149.1 boundary-scan test logic - all configured via SRAM bitstream loading in master serial, slave serial, JTAG, or SelectMAP™ modes.

Key Specifications

Pinout & Package

The XCV50-5CS144C is housed in a 144-ball Chip-Scale Package (CS144) with 94 user I/O pins, 4 dedicated global clock inputs (GCLK0–GCLK3), 4 VCCINT, 8 VCCO (grouped by bank), 8 VREF, 4 GND, and 4 VSS. Pin functions follow Xilinx DS003-4 (v4.0) Module 4 pinout tables.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic implementation applications.

Compared with XCV50-5CS144C, the XCV50-6CS144C offers higher timing performance within identical footprint and logic capacity, while the XCV100-5CS144C delivers 88% more logic cells at same pinout - enabling functional scalability without layout revision.

Availability

XCV50-5CS144C is available at Aetrix Electronics and suitable for legacy industrial control upgrades, telecom infrastructure spares, and test equipment repair requiring stable component supply amid obsolescence management.

Supply support for XCV50-5CS144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and established industry standards for programmable logic architecture, toolchains, and IP ecosystems.

The Virtex family - including XCV50-5CS144C - was designed for high-performance, high-density digital logic replacement of mask-programmed gate arrays in communications, computing, and industrial systems.

FAQ

Is XCV50-5CS144C still in production?

No, XCV50-5CS144C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). Aetrix Electronics maintains limited legacy inventory and supports controlled-life procurement for ongoing maintenance and repair programs with full traceability and extended warranty terms.

What development tools support XCV50-5CS144C?

XCV50-5CS144C is supported by Xilinx Foundation Series and Alliance Series software (v3.1–v5.2), including schematic entry, VHDL/Verilog simulation, automatic place-and-route, and bitstream generation. Modern Vivado does not support Virtex-1 devices; legacy ISE WebPACK is no longer distributed but may be sourced under NDA for certified users.

Can XCV50-5CS144C interface with 3.3 V and 2.5 V I/O standards simultaneously?

Yes - XCV50-5CS144C supports mixed I/O voltages via its eight independent I/O banks. Banks powered by 3.3 V VCCO can drive LVTTL or PCI 3.3 V, while 2.5 V banks support SSTL2 or LVCMOS2. However, VREF must be consistent within each bank and cannot be shared across voltage domains.

Does XCV50-5CS144C include on-chip configuration memory?

No, XCV50-5CS144C is SRAM-based and requires external configuration memory. It supports master serial mode (booting from external PROM), slave serial, SelectMAP™, and JTAG modes. Configuration bitstream must be reloaded at power-up; no non-volatile on-die storage is present.

What thermal considerations apply to XCV50-5CS144C in commercial temperature range?

XCV50-5CS144C is rated for 0°C to +85°C junction temperature (Commercial grade 'C'). Its 0.22 μm process yields moderate power dissipation, but thermal design must account for VCCINT current draw (up to 1.2 A typical), localized heating near I/O banks, and die-temperature sensor diode output used for system-level thermal monitoring.