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AMD XCV50-5FG256C
- Part No.:
- XCV50-5FG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XCV50-5FG256C.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,050
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Product details
Overview
XCV50-5FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells in a 16×24 CLB array, and 176 user I/O pins in a 256-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), 4k-bit configurable dual-ported block RAMs, and supports 66-MHz PCI-compliant interfaces - deployed in high-reliability industrial control and legacy telecom baseband processing systems.
For engineers reviewing the XCV50-5FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (guaranteed 160 MHz system clock), 2.5 V core voltage with 3.3 V I/O tolerance, hot-swap capability for Compact PCI, and support for LVTTL, SSTL2, and HSTL Class I/III signaling standards.
Technical Context
The XCV50-5FG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and dedicated horizontal bus lines per CLB row. Its CLBs contain four logic cells each, with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, or 16-bit shift registers - enabling efficient DSP data capture and pipeline staging.
Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate, and drive strength up to 24 mA source / 48 mA sink. Eight I/O banks enforce VCCO and VREF voltage segregation - permitting mixed-standard operation only within compatible voltage domains (e.g., 2.5 V bank supports SSTL2 and LVCMOS2).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 57,906 - defines total combinational logic capacity for gate-equivalent synthesis targeting ASIC replacement |
| Logic Cells | 1,728 - provides register+LUT pairs for synchronous logic implementation with full clock enable and dual reset |
| User I/O Pins | 176 - usable bidirectional pins distributed across eight voltage-isolated I/O banks for mixed-signaling designs |
| Block RAM | 32,768 bits (8 × 4,096-bit dual-port blocks) - enables on-chip FIFOs, coefficient storage, or protocol buffering without external memory |
| Speed Grade | -5 - guarantees 160 MHz maximum system clock frequency under worst-case commercial temperature (0°C to +85°C) |
| Core Voltage | 2.5 V ± 5% - powers CLB and routing logic; requires tight regulation to maintain timing closure at 160 MHz |
| I/O Standards | LVTTL, LVCMOS2, SSTL2 Class I/II, HSTL Class I/III, PCI 3.3 V - supports interoperability with DDR SDRAM, microprocessors, and backplane transceivers |
Pinout & Package
Package: Fine-pitch Ball Grid Array (FG256) with 256 solder balls, 1.0 mm pitch, body size 17 mm × 17 mm, JEDEC MO-207AC compliant. Thermal pad exposed on underside for enhanced heat dissipation in industrial environments.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Dedicated global clock inputs | Low-skew primary clock distribution paths tied directly to DLLs; bypass general routing for deterministic timing |
| CCLK | Configuration clock input | Drives master serial configuration mode; must be stable before INIT_B deassertion during power-up |
| DIN | Serial configuration data input | Accepts bitstream from external PROM in master serial mode; latched on rising CCLK edge |
| PROGRAM_B | Active-low configuration reset | Forces FPGA into configuration reinitialization state; asynchronous, overrides all internal logic |
| INIT_B | Configuration status output | Open-drain signal indicating configuration memory readiness; pulled high externally during valid configuration |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification |
| VCCINT | Core supply voltage pin | Supplies 2.5 V to CLBs, DLLs, and routing; requires local 10 µF + 0.1 µF decoupling per power domain |
| VCCO_0–VCCO_7 | I/O bank supply voltage pins | Eight independent VCCO rails - each powers one I/O bank; must match selected output standard voltage (e.g., 2.5 V for SSTL2) |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated carry chains | Two per CLB slice - enables sub-5 ns propagation for 16-bit adders and arithmetic-intensive datapaths |
| Configurable LUT RAM | Each 4-LUT acts as 16×1-bit synchronous RAM or combines with adjacent LUT for 16×2-bit dual-port RAM - eliminates need for small external SRAM |
| On-die temperature sensor | Diode-based analog output - enables real-time thermal monitoring for fan control or throttling in sealed industrial enclosures |
| Hot-swap ready I/O | IOBs support power sequencing compliance per Compact PCI specification - allows safe insertion/removal while backplane remains live |
| SRAM-based reprogrammability | Unlimited in-system configuration cycles via JTAG or SelectMAP™ - supports field firmware updates without hardware change |
Applications
| Industrial Motion Control | Legacy Telecom Baseband |
|---|---|
|
Use Scenario: Real-time servo loop execution in CNC machine controllers requiring deterministic sub-microsecond latency between encoder input sampling and PWM output update. IC Role / Device Role / Timing Role: XCV50-5FG256C serves as the real-time logic engine - implementing PID computation, quadrature decoding, and synchronized 3-phase PWM generation using dedicated carry chains and fast local routing. Use Value: Achieves 200 ns worst-case path delay between encoder capture and PWM edge placement, meeting IEC 61800-3 functional safety timing constraints without external ASIC assistance. |
Use Scenario: Channel bonding and framing logic in E1/T1 line cards where multiple DS0 streams are aggregated into a single TDM bus for upstream transport. IC Role / Device Role / Timing Role: XCV50-5FG256C implements HDLC framer, CRC-6 generator, and timeslot mapper - leveraging block RAM for buffer management and DLLs for jitter-tolerant clock recovery from recovered line clock. Use Value: Supports simultaneous processing of 32 E1 channels (2.048 Mbps each) with <1 ppm frame slip rate, validated per ITU-T G.823 jitter transfer requirements. |
| PCI-Based Data Acquisition | Avionics Sensor Interface |
|
Use Scenario: High-throughput analog-to-digital acquisition card for test equipment, capturing 16-bit samples at 10 MS/s and streaming over 33/66 MHz PCI bus. IC Role / Device Role / Timing Role: XCV50-5FG256C acts as PCI target interface and DMA controller - using SelectIO™ to meet PCI timing margins and block RAM as ping-pong buffers for zero-wait-state transfers. Use Value: Delivers sustained 52 MB/s PCI throughput (66 MHz × 64-bit) with guaranteed setup/hold compliance across temperature, eliminating external glue logic. |
Use Scenario: ARINC 429 receiver/transmitter module in flight data recorders, converting discrete aircraft sensor signals to serial avionics bus format. IC Role / Device Role / Timing Role: XCV50-5FG256C implements dual ARINC 429 transceivers with Manchester encoding/decoding, parity generation, and label filtering - using LUT-based shift registers for bit-level serialization. Use Value: Meets DO-254 Level A design assurance for airborne systems with full traceability from VHDL to place-and-route, verified via Xilinx Alliance tools. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA logic and I/O applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV50-6FG256C | Faster -6 speed grade (180 MHz max clock); identical logic density, I/O count, and package | Better suited for designs requiring tighter timing margins or higher-frequency PLL outputs | Select when timing closure fails at -5 grade or when migrating from prototype to production with margin headroom |
| XCV100-5FG256C | Higher density: 108,904 system gates, 2,700 logic cells, 40,960 block RAM bits - same FG256 package footprint | Enables larger state machines, deeper FIFOs, or multi-channel protocol stacks without PCB redesign | Choose when logic utilization exceeds 85% in XCV50-5FG256C or when future scalability is required |
Compared with XCV50-5FG256C, the -6 variant offers higher clock frequency headroom at identical cost and footprint, while XCV100-5FG256C delivers 88% more logic resources within pin-compatible packaging - making both viable for incremental performance scaling or design growth without layout revision.
Availability
XCV50-5FG256C is available at Aetrix Electronics and suitable for industrial motion control, legacy telecom baseband processing, PCI-based data acquisition, avionics sensor interface, and Compact PCI hot-swap systems requiring stable component supply throughout extended product lifecycles.
Supply support for XCV50-5FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures that enabled reconfigurable computing across aerospace, telecom, and industrial markets.
The Virtex family - including XCV50-5FG256C - was engineered for high-performance, high-density logic replacement in systems demanding 200 MHz operation, PCI compliance, and flexible I/O interfacing, targeting applications where ASIC development cost and time were prohibitive.
FAQ
Is XCV50-5FG256C still in active production?
No, XCV50-5FG256C is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is no longer manufactured, but Aetrix Electronics maintains legacy inventory with full traceability and extended lifecycle support for existing designs requiring last-time buys or repair spares.
What configuration modes does XCV50-5FG256C support?
XCV50-5FG256C supports four configuration modes: master serial (via external PROM), slave serial, SelectMAP™ (parallel 8-/16-bit bus), and JTAG boundary-scan. Configuration bitstream is loaded into internal SRAM; power loss erases configuration, requiring reload at next power-on.
Can XCV50-5FG256C interface directly with 3.3 V PCI slots?
Yes, XCV50-5FG256C is fully 66-MHz PCI compliant and supports 3.3 V signaling. Its IOBs meet PCI electrical specifications for setup/hold time, drive strength, and noise immunity - verified in DS003-3 DC and switching characteristics tables.
Does XCV50-5FG256C include on-chip memory beyond LUT-based RAM?
Yes, XCV50-5FG256C contains eight 4,096-bit block SelectRAM modules (32,768 total bits), each configurable as synchronous dual-ported RAM with independent address/data buses - distinct from distributed LUT RAM and optimized for larger buffer or lookup table needs.
What thermal management considerations apply to XCV50-5FG256C in industrial use?
XCV50-5FG256C includes an integrated die-temperature sensor diode. For continuous operation at 85°C ambient, a 2-layer PCB with thermal vias under the FG256 package and ≥2 cm² copper pour is recommended to maintain junction temperature below 105°C per Xilinx thermal guidelines.
XCV50-5FG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 32768
- Number of I/O:
- 176
- Number of Gates:
- 57906
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XCV50-5FG256C FAQ
1.How can I place an order for XCV50-5FG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV50-5FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV50-5FG256C reliable?
The price and inventory of XCV50-5FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50-5FG256C is usually 5 days.
3.What payment methods are accepted for XCV50-5FG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50-5FG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV50-5FG256C?
XCV50-5FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV50-5FG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV50-5FG256C?
For technical support, including XCV50-5FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50-5FG256C requirements.
6.How does Aetrix verify that XCV50-5FG256C is sourced from the original manufacturer or authorized distributors?
All XCV50-5FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50-5FG256C meets industry standards.
7.What is the process for return or replacement of XCV50-5FG256C?
All XCV50-5FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV50-5FG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV50-5FG256C part is unused and in its original packaging.
Return procedure for XCV50-5FG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV50-5FG256C Tags
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