AMD XCV50-5FG256I

Overview

XCV50-5FG256I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells in a 16×24 CLB array, and 176 user I/O pins in a 256-ball fine-pitch BGA package. It features four delay-locked loops (DLLs), supports 66-MHz PCI compliance, operates across –40°C to +100°C industrial temperature range, and delivers up to 200 MHz system performance for high-speed digital signal processing and embedded control applications.

For engineers reviewing the XCV50-5FG256I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, SelectIO™ interface compatibility, block RAM configuration options, and industrial-grade timing specifications - all confirmed against DS003-1 (v4.0) and DS003-4 pinout documentation.

Technical Context

The XCV50-5FG256I implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing. Its CLBs contain four logic cells each, with dual-slice structure supporting 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register.

It integrates eight 4,096-bit synchronous dual-ported Block SelectRAMs (32,768 total bits), four dedicated DLLs for clock deskew and domain control, and IEEE 1149.1 boundary-scan logic. I/O banks enforce strict VCCO/VREF voltage segregation: FG256 package supports eight independent banks, each requiring uniform VCCO and at most one VREF voltage.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG256) with 256 solder balls, 1.0 mm pitch, 17 mm × 17 mm body size, and eight I/O banks (Bank 0–7) arranged per device edge. Each bank requires dedicated VCCO and shared VREF connections; no mixed-voltage signaling within a bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV50-5FG256I, the -6 variant offers improved timing margin without changing footprint or power, while XCV100-5FG256I scales logic and memory for more complex systems - both retain identical FG256 packaging and industrial temperature rating.

Availability

XCV50-5FG256I is available at Aetrix Electronics and suitable for industrial motion control, avionics data concentrators, PCI-based instrumentation, and baseband signal processing requiring stable component supply across extended lifecycle planning.

Supply support for XCV50-5FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex family was designed for high-speed, high-density applications demanding ASIC-like performance with field reprogrammability - targeting communications infrastructure, defense systems, and industrial automation where flexibility and deterministic timing are critical.

FAQ

What is the maximum operating frequency of the XCV50-5FG256I?

The XCV50-5FG256I achieves up to 200 MHz system clock performance under optimal conditions, with guaranteed 10 ns clock-to-out (Tco) and 5.0 ns register-to-register delay at worst-case industrial temperature (–40°C to +100°C) and voltage. Actual frequency depends on design placement, routing, and I/O standard selection - verified in DS003-1 Table 2 and DS003-3 timing reports.

Does the XCV50-5FG256I support hot-swap operation?

Yes, the XCV50-5FG256I supports hot-swappable operation in Compact PCI systems, as explicitly stated in DS003-1 Module 1 Features section. This capability relies on its robust I/O protection circuitry, power sequencing tolerance, and IEEE 1149.1 boundary-scan test infrastructure - enabling safe insertion/removal without system shutdown.

How many block RAMs does the XCV50-5FG256I contain?

The XCV50-5FG256I contains eight 4,096-bit synchronous dual-ported Block SelectRAMs, totaling 32,768 bits of dedicated memory. Each block supports independent read/write widths (e.g., 16-bit write / 8-bit read) and is physically organized in two columns along the vertical edges of the die - confirmed in DS003-2 Table 3 and Figure 6.

Can the XCV50-5FG256I interface directly with DDR SDRAM?

Yes, the XCV50-5FG256I supports DDR SDRAM interfacing via its SSTL3 Class I/II and HSTL Class I/III/IV I/O standards, which match JEDEC DDR requirements. Its DLLs enable precise DQS-to-clock alignment, and its 176 I/O pins accommodate full 16-bit data bus plus address/control lines - detailed in DS003-2 Table 1 and I/O Banking section.

Is the XCV50-5FG256I still in production?

No, the XCV50-5FG256I is obsolete per DS003-1 v4.0 (March 2013), which states "The products listed in this data sheet are obsolete. See XCN10016 for further information." Aetrix Electronics maintains limited legacy inventory with full traceability and supports lifecycle management for existing designs requiring long-term supply continuity.