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AMD XCV50-6BG256C
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- Part No.:
- XCV50-6BG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BBGA
- Datasheet:
-
XCV50-6BG256C.pdf
- Description:
- IC FPGA 180 I/O 256BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,830
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Product details
Overview
XCV50-6BG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells in a 16×24 CLB array, 180 user I/O pins, and four dedicated delay-locked loops (DLLs) for clock management. It supports 66-MHz PCI compliance, hot-swappable operation in Compact PCI systems, and multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, SSTL2, and HSTL Class I/III/IV.
For engineers reviewing the XCV50-6BG256C datasheet, pinout, applications, or equivalent options, key selection considerations include its 200 MHz system performance ceiling, 32,768-bit block RAM capacity, 0.22 μm 5-layer metal CMOS process, commercial temperature range (0°C to +85°C), and BG256 ball grid array package with verified pin-to-pin compatibility across Virtex family members sharing that footprint.
Technical Context
The XCV50-6BG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain four logic cells each, with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift registers.
Each IOB supports IEEE 1149.1 boundary-scan, independent input/output polarity control, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and selectable weak-keeper circuits. I/O banking enforces VCCO and VREF voltage grouping across eight banks, with compatible standards per bank defined by shared VCCO voltage (e.g., 3.3 V for LVTTL/PCI/SSTL3).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 57,906 - defines logic density for ASIC replacement sizing and place-and-route resource estimation |
| Logic Cells | 1,728 - provides count of atomic programmable units for synthesis mapping and utilization reporting |
| User I/O Pins | 180 - determines maximum external interface count and PCB routing complexity |
| Block RAM Bits | 32,768 - enables on-chip storage for FIFOs, buffers, or lookup tables without external memory |
| Max System Clock | 200 MHz - sets synchronous timing budget for register-to-register paths and I/O interfaces |
| DLL Count | 4 - allows independent clock domain management, phase alignment, and jitter reduction per domain |
| Process Technology | 0.22 μm 5-layer metal CMOS - ensures predictable timing closure and power characteristics at 2.5 V core voltage |
Pinout & Package
The XCV50-6BG256C uses a 256-ball fine-pitch ball grid array (BG256) package with 1.27 mm pitch, designed for high-density PCB layouts and thermal reliability in commercial-grade applications. Pin functions follow Xilinx Virtex standard assignment per DS003-4 Module 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew inputs feeding four primary clock networks; required for DLL synchronization |
| PROGRAM_B | Configuration Initiate | Active-low signal triggering FPGA reconfiguration from external PROM or host controller |
| INIT_B | Configuration Status | Open-drain output indicating configuration completion or error during bitstream loading |
| CCLK | Configuration Clock | Input clock for master serial mode; drives internal configuration state machine timing |
| DIN | Configuration Data In | Serial data input for master serial programming; synchronized to CCLK edge |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1 test access port enabling in-system verification and debug without physical probes |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-based configuration | Enables unlimited in-system reprogramming via JTAG, SelectMAP™, or serial PROM - critical for field-upgradable embedded systems |
| SelectIO™ interface support | 16 I/O standards including 5 V-tolerant LVTTL and PCI, plus HSTL/SSTL for DDR memory interfacing - eliminates level-shifter components |
| Distributed LUT RAM | Each 4-input LUT configurable as 16×1-bit synchronous RAM or 16-bit shift register - provides distributed buffering for high-speed data capture |
| Dedicated carry chain | Two per CLB with two-bit height - accelerates arithmetic pipelines and reduces logic depth in counters and ALUs |
| Die-temperature sensor diode | On-die analog diode enabling real-time thermal monitoring via external ADC - supports dynamic thermal throttling in compute-intensive designs |
Applications
| High-Speed Communication Interface | Industrial Motion Control |
|---|---|
Use Scenario: Implementing PCIe Gen1 endpoint logic with custom DMA engines and protocol translation between legacy parallel buses and serial links. IC Role / Device Role / Timing Role: Configurable protocol bridge and packet processor handling 66 MHz PCI timing, DLL-synchronized clock domains, and 180-pin I/O fanout. Use Value: Eliminates need for ASIC development while meeting deterministic latency requirements via dedicated carry chains and block RAM FIFOs. | Use Scenario: Real-time closed-loop servo control in CNC machines using encoder feedback, PWM generation, and safety interlock monitoring. IC Role / Device Role / Timing Role: Deterministic logic fabric executing sub-1 μs control cycles with synchronized 200 MHz register-to-register paths and glitch-free I/O transitions. Use Value: Achieves <100 ns jitter on PWM outputs using DLL-managed clocks and eliminates external timing ICs through integrated clock management. |
| Medical Imaging Data Acquisition | Test & Measurement Equipment |
Use Scenario: High-fidelity analog-to-digital data capture from multi-channel ultrasound transducers with real-time beamforming and FIR filtering. IC Role / Device Role / Timing Role: Parallel processing engine performing 16-bit fixed-point arithmetic using dedicated multipliers and cascaded LUT-based shift registers for pipeline delay matching. Use Value: Delivers 120+ MSPS throughput using distributed LUT RAM for coefficient storage and block RAM for frame buffering - no external memory required. | Use Scenario: Modular automated test equipment (ATE) requiring reconfigurable digital pattern generators, high-speed comparators, and IEEE 1149.1 boundary-scan controllers. IC Role / Device Role / Timing Role: Reusable test platform core supporting multiple DUT interfaces via pin-swappable I/O banks and JTAG-accessible internal scan chains. Use Value: Reduces test fixture redesign time by 70% through VersaRing I/O routing and eliminates external boundary-scan controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV50-5BG256C | Slower speed grade (-5 vs. -6); 180 MHz max system clock vs. 200 MHz | Suitable for cost-sensitive designs where timing margin exceeds 10% of critical path | Select when design meets timing at -5 grade to reduce BOM cost without sacrificing functionality |
| XCV100-6BG256C | Higher density (108,904 gates, 2,700 logic cells) in identical BG256 package | Required for designs needing >1,728 logic cells but constrained by existing PCB footprint | Choose for seamless migration path when logic utilization exceeds 90% on XCV50-6BG256C |
Compared with XCV50-6BG256C, the XCV50-5BG256C trades 20 MHz peak performance for lower unit cost, while the XCV100-6BG256C retains pin compatibility and clock architecture but doubles logic capacity - enabling feature expansion without board respin.
Availability
XCV50-6BG256C is available at Aetrix Electronics and suitable for industrial motion control, medical imaging data acquisition, and high-speed communication interface applications requiring stable component supply throughout extended product lifecycles.
Supply support for XCV50-6BG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex family - including XCV50-6BG256C - was engineered for high-performance, high-capacity logic replacement in communications infrastructure, aerospace, and industrial systems demanding 200 MHz operation and multi-standard I/O flexibility.
FAQ
What is the operating temperature range for XCV50-6BG256C?
The XCV50-6BG256C is rated for commercial temperature operation from 0°C to +85°C (junction temperature). This range is specified in the ordering code suffix "C" and validated per DS003-1 Module 1. Thermal derating is not required within this envelope, and the on-die temperature sensor diode enables real-time monitoring for thermal-aware system management in the XCV50-6BG256C.
Does XCV50-6BG256C support JTAG boundary-scan testing?
Yes, XCV50-6BG256C fully implements IEEE 1149.1 boundary-scan logic as a standard feature. The TCK, TMS, TDI, and TDO pins provide full access to internal scan chains for in-system verification, fault isolation, and programming. This capability is documented in DS003-2 Module 2 and applies directly to the XCV50-6BG256C device without additional configuration.
How many block RAMs does XCV50-6BG256C contain?
The XCV50-6BG256C contains eight block SelectRAM™ memory blocks totaling 32,768 bits. Each block is a fully synchronous dual-ported 4096-bit RAM with independent address and data buses per port, supporting configurations from 1×4096 up to 16×256. This capacity is confirmed in Table 3 of DS003-2 Module 2 and is fixed for the XCV50-6BG256C device.
Can XCV50-6BG256C be configured via JTAG only, or are other modes supported?
XCV50-6BG256C supports four configuration modes: JTAG, master serial, slave serial, and SelectMAP™. JTAG is used for debugging and programming, while master serial (using external PROM) and slave serial/SelectMAP™ (using host processor) enable production-level configuration. All modes are electrically and functionally supported in the XCV50-6BG256C as specified in DS003-1 Module 1.
Is XCV50-6BG256C still in active production or obsolete?
The XCV50-6BG256C is marked as obsolete per DS003-1 v4.0 (March 2013), which states "The products listed in this data sheet are obsolete. See XCN10016 for further information." However, Aetrix Electronics maintains legacy supply channels for XCV50-6BG256C to support long-lifecycle industrial and medical programs requiring last-time buys and controlled distribution.
XCV50-6BG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 256-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 32768
- Number of I/O:
- 180
- Number of Gates:
- 57906
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-PBGA (27x27)
XCV50-6BG256C FAQ
1.How can I place an order for XCV50-6BG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV50-6BG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV50-6BG256C reliable?
The price and inventory of XCV50-6BG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50-6BG256C is usually 5 days.
3.What payment methods are accepted for XCV50-6BG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50-6BG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV50-6BG256C?
XCV50-6BG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV50-6BG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV50-6BG256C?
For technical support, including XCV50-6BG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50-6BG256C requirements.
6.How does Aetrix verify that XCV50-6BG256C is sourced from the original manufacturer or authorized distributors?
All XCV50-6BG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50-6BG256C meets industry standards.
7.What is the process for return or replacement of XCV50-6BG256C?
All XCV50-6BG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV50-6BG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV50-6BG256C part is unused and in its original packaging.
Return procedure for XCV50-6BG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV50-6BG256C Tags
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ICE40UL1K-CM36AI
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10M02DCV36C8G
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ICE5LP1K-SG48ITR
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ICE40LP1K-CM36
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LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
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