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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV50-6FG256C

Name: XCV50-6FG256C
Brand: AMD
SKU: XCV50-6FG256C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV50-6FG256C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 256-BGA

Datasheet:: XCV50-6FG256C.pdf

Description:: IC FPGA 176 I/O 256FBGA

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Product details

Overview

XCV50-6FG256C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 57,906 system gates, 1,728 logic cells, 176 user I/O pins in a 256-ball fine-pitch BGA package, and four dedicated delay-locked loops (DLLs) for clock management - deployed in high-speed industrial control and PCI-compliant data acquisition systems.

For engineers reviewing the XCV50-6FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (200 MHz system performance), 4k-bit synchronous dual-ported block RAM per memory block, 0.22 μm 5-layer metal CMOS process, and support for 16 SelectIO™ interface standards including LVTTL, HSTL Class IV, and SSTL2.

Technical Context

The XCV50-6FG256C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLB array (16×24) contains 1,728 logic cells, each with dual-slice structure, 4-input LUTs configurable as 16-bit RAM/shift register, and dedicated carry logic for arithmetic acceleration.

Each IOB supports independent input/output flip-flops with synchronous/asynchronous set/reset, programmable slew rate and drive strength (up to 24 mA source / 48 mA sink), and IEEE 1149.1 boundary-scan. The device uses eight I/O banks with bank-specific VCCO and VREF requirements, enabling mixed-voltage signaling within defined compatibility groups.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	57,906 - defines total combinational logic capacity for gate-equivalent synthesis targeting.
Logic Cells	1,728 - provides count of basic programmable units, each containing LUT + flip-flop + carry chain.
User I/O Pins	176 - maximum number of configurable bidirectional signal interfaces, constrained by FG256 package layout.
Block RAM Bits	32,768 - distributed across eight 4k-bit dual-ported synchronous RAM blocks for on-chip data buffering.
Speed Grade	-6 - guarantees worst-case register-to-register timing of ≤5.0 ns and 200 MHz system clock operation.
Supply Voltage	2.5 V core (VCCINT), 3.3 V/2.5 V/1.5 V I/O (VCCO) - requires separate regulated supplies per I/O bank voltage group.
Process Technology	0.22 μm 5-layer metal CMOS - enables high density and low static power vs. prior FPGA generations.

Pinout & Package

Package: 256-ball Fine-pitch Ball Grid Array (FG256), 1.0 mm ball pitch, 17 mm × 17 mm body size, RoHS-compliant lead-free finish.

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Dedicated low-skew inputs feeding four DLLs; must be driven by clean, low-jitter clocks for timing-critical paths.
CCLK	Configuration Clock	Drives internal configuration shift register during master serial mode; not usable as general-purpose clock post-configuration.
DIN / DOUT	Configuration Data I/O	Serial configuration interface pins; DIN receives bitstream, DOUT outputs readback data during JTAG verification.
TCK / TMS / TDI / TDO	JTAG Boundary-Scan	IEEE 1149.1 test access port; enables in-system programming, debug visibility, and production test without physical probes.
VCCINT	Core Power Supply	2.5 V supply for internal logic and CLBs; requires low-noise decoupling near package corners to maintain timing margins.
VCCO_0–VCCO_7	I/O Bank Power	Eight independent VCCO supplies (one per I/O bank); each must match output standard voltage (e.g., 3.3 V for LVTTL).
VREF_0–VREF_7	I/O Threshold Reference	Bank-specific reference voltage for input standards requiring threshold (e.g., HSTL Class I at 0.75 V); shared internally per bank.

Key Features

Feature	Design Value
Four DLLs	Enables zero hold-time clock domain crossing, phase alignment of multiple clocks, and jitter reduction for high-speed I/O interfaces.
Configurable LUT RAM	Each 4-input LUT operates as 16×1-bit synchronous RAM or combines with adjacent LUT for 16×2-bit dual-port RAM - eliminates external SRAM in small-buffer applications.
SelectIO™ Interface Support	Hardware-level compatibility with 16 standards (LVTTL, SSTL2, HSTL Class IV, GTL+) - allows direct connection to DDR SDRAM, ZBT SRAM, and PCI bus without level translators.
Dedicated Carry Chain	Two-bit-per-CLB fast carry propagation enables >100 MHz adder/subtractor pipelines and efficient multiplier accumulation.
IEEE 1149.1 Boundary Scan	Full scan-chain coverage of all I/Os and internal registers - supports automated PCB test, fault isolation, and in-field reconfiguration verification.

Applications

PCI Data Acquisition Card	Industrial Motion Controller
Use Scenario: Real-time analog-to-digital sampling at 66 MHz with DMA transfer over 32-bit PCI bus. IC Role / Device Role / Timing Role: XCV50-6FG256C acts as PCI target interface, sample buffer manager, and timing sequencer - synchronizing ADC clocks, managing FIFO pointers, and generating PCI transaction handshakes. Use Value: On-chip 32k-bit block RAM stores 8K samples pre-DMA; DLLs align PCI clock (66 MHz) with internal logic clock (100 MHz), eliminating external clock buffers and reducing board-level skew.	Use Scenario: Closed-loop servo control with 100 kHz PWM generation and encoder feedback decoding. IC Role / Device Role / Timing Role: XCV50-6FG256C implements PID computation engine, quadrature decoder, and PWM generator - executing control law in <500 ns with deterministic latency. Use Value: Dedicated carry chains accelerate 32-bit arithmetic; 176 I/O pins route 16-axis encoder signals, PWM outputs, and safety interlocks without external glue logic.
Communications Protocol Bridge	Test Equipment Pattern Generator
Use Scenario: Translation between RS-422 serial protocol and parallel LVDS backplane interface in base station equipment. IC Role / Device Role / Timing Role: XCV50-6FG256C serves as protocol state machine, serializer/deserializer, and voltage-level translator - handling framing, error detection, and clock domain crossing. Use Value: SelectIO™ supports both 2.5 V LVDS and 5 V-tolerant RS-422 drivers; on-chip dual-ported RAM buffers protocol packets across asynchronous domains.	Use Scenario: High-speed digital stimulus generation for ASIC validation at 100+ MHz vector rates. IC Role / Device Role / Timing Role: XCV50-6FG256C functions as pattern sequencer, timing controller, and output driver - storing test vectors in distributed LUT RAM and driving 64-bit wide parallel bus. Use Value: -6 speed grade ensures <5 ns path delays for setup/hold compliance; 176 I/Os support full-width bus drive with programmable slew control to minimize SI issues.

PCI Data Acquisition Card

Industrial Motion Controller

Use Scenario: Real-time analog-to-digital sampling at 66 MHz with DMA transfer over 32-bit PCI bus.

IC Role / Device Role / Timing Role: XCV50-6FG256C acts as PCI target interface, sample buffer manager, and timing sequencer - synchronizing ADC clocks, managing FIFO pointers, and generating PCI transaction handshakes.

Use Value: On-chip 32k-bit block RAM stores 8K samples pre-DMA; DLLs align PCI clock (66 MHz) with internal logic clock (100 MHz), eliminating external clock buffers and reducing board-level skew.

Use Scenario: Closed-loop servo control with 100 kHz PWM generation and encoder feedback decoding.

IC Role / Device Role / Timing Role: XCV50-6FG256C implements PID computation engine, quadrature decoder, and PWM generator - executing control law in <500 ns with deterministic latency.

Use Value: Dedicated carry chains accelerate 32-bit arithmetic; 176 I/O pins route 16-axis encoder signals, PWM outputs, and safety interlocks without external glue logic.

Communications Protocol Bridge

Test Equipment Pattern Generator

Use Scenario: Translation between RS-422 serial protocol and parallel LVDS backplane interface in base station equipment.

IC Role / Device Role / Timing Role: XCV50-6FG256C serves as protocol state machine, serializer/deserializer, and voltage-level translator - handling framing, error detection, and clock domain crossing.

Use Value: SelectIO™ supports both 2.5 V LVDS and 5 V-tolerant RS-422 drivers; on-chip dual-ported RAM buffers protocol packets across asynchronous domains.

Use Scenario: High-speed digital stimulus generation for ASIC validation at 100+ MHz vector rates.

IC Role / Device Role / Timing Role: XCV50-6FG256C functions as pattern sequencer, timing controller, and output driver - storing test vectors in distributed LUT RAM and driving 64-bit wide parallel bus.

Use Value: -6 speed grade ensures <5 ns path delays for setup/hold compliance; 176 I/Os support full-width bus drive with programmable slew control to minimize SI issues.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV50-5FG256C	Same architecture and pinout, but -5 speed grade (≤5.4 ns register-to-register delay, 180 MHz max clock).	Suitable for cost-sensitive designs where 200 MHz timing margin is unnecessary; lower power consumption at same frequency.	Select when system timing budget allows 10–15% lower performance; identical PCB layout and firmware compatibility.
XCV100-6FG256C	Higher density (108,904 gates, 2,700 logic cells), same FG256 package and -6 speed grade, but 180 I/O pins.	Required when design expands beyond 1,728 logic cells or needs additional block RAM (40,960 bits vs. 32,768).	Choose for future-proofing or incremental design growth; same footprint enables drop-in upgrade if board layout reserves space for extra I/O routing.

Compared with XCV50-6FG256C, the XCV50-5FG256C trades 200 MHz capability for lower cost and power, while the XCV100-6FG256C retains full speed compliance but doubles logic capacity and block RAM - making it ideal for scalable architectures where gate count may increase post-validation.

Availability

XCV50-6FG256C is available at Aetrix Electronics and suitable for industrial motion control, PCI-compliant data acquisition, and communications protocol bridging requiring stable component supply through extended product lifecycles.

Supply support for XCV50-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it delivers FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex family was engineered for high-performance, high-density logic implementation in wired infrastructure, test & measurement, and industrial automation - emphasizing clock integrity, I/O flexibility, and place-and-route efficiency.

FAQ

Is XCV50-6FG256C still in production or obsolete?

XCV50-6FG256C is officially obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). However, Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle management support, including obsolescence forecasting and cross-reference guidance for migration paths.

What development tools support XCV50-6FG256C?

XCV50-6FG256C is fully supported by Xilinx Foundation Series and Alliance Series software (v3.1–v5.2), including schematic entry, VHDL/Verilog synthesis, place-and-route, and bitstream generation. It is not compatible with ISE or Vivado toolchains, which target later FPGA families.

Does XCV50-6FG256C support hot-swap operation in Compact PCI systems?

Yes, XCV50-6FG256C meets Compact PCI hot-swap requirements per its specification: it features power-up sequencing control, I/Os in high-impedance state prior to configuration, and robust ESD protection - enabling safe insertion/removal while the backplane remains powered.

Can XCV50-6FG256C interface directly with 3.3 V PCI bus signals?

Yes, XCV50-6FG256C supports 3.3 V PCI signaling via its SelectIO™ interface: LVTTL I/O standard with 3.3 V VCCO and 24 mA drive strength meets PCI Local Bus Specification Rev. 2.2 electrical requirements for target-mode operation.

What is the maximum operating junction temperature for XCV50-6FG256C?

The XCV50-6FG256C has a commercial temperature range of 0°C to +85°C (TJ). Its thermal resistance θJA is 22.5°C/W in the FG256 package; sustained operation above +85°C junction requires derating or active cooling to prevent configuration loss or timing violation.

XCV50-6FG256C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®

Package/Case:: 256-BGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 384

Number of Logic Elements/Cells:: 1728

Total RAM Bits:: 32768

Number of I/O:: 176

Number of Gates:: 57906

Voltage - Supply:: 2.375V ~ 2.625V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 256-FBGA (17x17)

XCV50-6FG256C FAQ

1.How can I place an order for XCV50-6FG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV50-6FG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV50-6FG256C reliable?

The price and inventory of XCV50-6FG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50-6FG256C is usually 5 days.

3.What payment methods are accepted for XCV50-6FG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50-6FG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV50-6FG256C?

XCV50-6FG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV50-6FG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV50-6FG256C?

For technical support, including XCV50-6FG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50-6FG256C requirements.

6.How does Aetrix verify that XCV50-6FG256C is sourced from the original manufacturer or authorized distributors?

All XCV50-6FG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50-6FG256C meets industry standards.

7.What is the process for return or replacement of XCV50-6FG256C?

All XCV50-6FG256C units undergo pre-shipment inspection (PSI). If there is an issue with XCV50-6FG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV50-6FG256C part is unused and in its original packaging.

Return procedure for XCV50-6FG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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