AMD XCV50E-6CS144C

Overview

XCV50E-6CS144C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 20,736 logic cells, 176 user I/O pins in a 144-ball CSOP package, and eight digital Delay-Locked Loops (DLLs) for clock management. It delivers up to 240 MHz system performance and supports LVDS, LVPECL, and PCI-compliant 3.3 V interfaces - deployed in high-speed communications infrastructure and industrial control systems requiring reconfigurable logic with deterministic timing.

For engineers reviewing the XCV50E-6CS144C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL configuration limits, block RAM allocation, and speed-grade–specific timing parameters directly extracted from DS022-1 (v2.3) and DS022-2 (v2.8) production specifications.

Technical Context

The XCV50E-6CS144C implements a regular array of Configurable Logic Blocks (CLBs), each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its routing hierarchy includes a General Routing Matrix (GRM) and VersaRing I/O interconnect, enabling high routability for complex synchronous designs.

It integrates 16 block SelectRAM+™ modules (65,536 bits total), each configured as true dual-port 4096-bit RAM with independent width/depth settings, and supports distributed RAM (24,576 bits) via LUTs. All I/O banks are powered by VCCO (not VCCINT), enforcing strict voltage segregation between LVTTL/LVCMOS2 and differential standards like LVDS.

Key Specifications

Pinout & Package

Package: 144-pin Ceramic Staggered Pin Grid Array (CS144), 0.8 mm pitch, 20.32 mm × 20.32 mm body size, with 8 I/O banks (Bank 0–7) and dedicated global clock pins (GCLK0–GCLK3).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV50E-6CS144C, the -7 variant improves maximum operating frequency by ~12% with no architectural change, while the XCV100E-6CS144C offers scalable logic density within identical mechanical and thermal constraints - both preserve the same DLL count, block RAM structure, and I/O banking rules.

Availability

XCV50E-6CS144C is available at Aetrix Electronics and suitable for high-reliability communications infrastructure, industrial motion control, and medical imaging equipment requiring stable component supply across extended product lifecycles.

Supply support for XCV50E-6CS144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was engineered for high-speed, high-density reconfigurable logic in telecom infrastructure and industrial automation - emphasizing low-power 1.8 V core operation, advanced I/O flexibility, and deterministic clock management.

FAQ

What is the maximum supported LVDS data rate for XCV50E-6CS144C?

XCV50E-6CS144C supports LVDS signaling at up to 622 Mb/s, as confirmed in DS022-1 Section "Features" and validated by its DLL capability to handle 300+ MHz LVPECL/LVDS clock inputs. This rate applies to source-synchronous interfaces using dedicated differential I/O pairs; actual achievable throughput depends on PCB layout quality and termination matching.

Does XCV50E-6CS144C support true dual-port block RAM?

Yes, XCV50E-6CS144C includes 16 block SelectRAM+™ modules, each configurable as true dual-port 4096-bit RAM with independent read/write addresses, enables, and clocks per port. This is documented in DS022-2 Module 2, Figure 6 and Table 4, allowing concurrent access for applications like video line buffering or packet header parsing.

Can XCV50E-6CS144C operate with 5 V tolerant I/Os?

No, XCV50E-6CS144C I/O pins are not 5 V tolerant. They are 3 V tolerant, and can be made compatible with 5 V signals only with external 100 Ω series resistors - as stated in DS022-1 page 2. PCI 5 V operation is explicitly unsupported; use LVTTL or PCI33_3 (3.3 V) standards instead.

How many DLLs does XCV50E-6CS144C contain, and what are their key capabilities?

XCV50E-6CS144C contains eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 "Features" and DS022-2 "Architectural Description". Each supports clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of high-speed LVPECL/LVDS clocks to any I/O standard - critical for memory controller timing closure.

Is XCV50E-6CS144C pin-compatible with other Virtex-E devices in the CS144 package?

Yes, XCV50E-6CS144C shares identical pinout with XCV100E-6CS144C and XCV200E-6CS144C per DS022-1 Table 3 and pinout documentation. However, higher-density variants allocate more pins to VCCO/VREF and may repurpose certain I/Os - verify bank-specific voltage assignments before migration.