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AMD XCV50E-6CS144I

Part No.:
XCV50E-6CS144I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
144-TFBGA, CSPBGA
Datasheet:
AetrixXCV50E-6CS144I.pdf
Description:
IC FPGA 94 I/O 144CSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,525

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Product details

Overview

XCV50E-6CS144I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 20,736 logic cells, 176 user I/O pins in a 144-pin CSOP package, and eight digital Delay-Locked Loops (DLLs) supporting 240 MHz system clocking and 622 Mb/s LVDS I/O for high-speed communications infrastructure.

For engineers reviewing the XCV50E-6CS144I datasheet, pinout, applications, or equivalent options, this device serves as a production-grade, industrial-temperature (-40°C to +100°C) FPGA optimized for PCI-compliant 33/66 MHz interfaces, synchronous memory controllers (200 MHz ZBT SRAM, DDR SDRAM), and source-synchronous data transmission architectures requiring deterministic timing control via DLL-based clock management.

Technical Context

The XCV50E-6CS144I implements a regular array architecture of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains and dual flip-flops per slice, enabling high-speed arithmetic and wide-input logic functions. It integrates 16 block RAMs (65,536 bits total) and 24,576 bits of distributed RAM, all operating at up to 250 MHz.

Its IOB structure supports 20 I/O standards-including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL-with banked VCCO and VREF domains, independent programmable drive strength (up to 48 mA sink), slew rate control, and IEEE 1149.1 boundary-scan. All I/O pins are 3 V tolerant; 5 V tolerance requires external 100 Ω resistors.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells20,736 - defines maximum combinational and sequential logic capacity for RTL synthesis
User I/O Pins176 - supports high-pin-count parallel interfaces such as 32-bit PCI, DDR memory buses, or multi-channel LVDS links
Block RAM65,536 bits across 16 blocks - enables true dual-port memory configurations for FIFOs, buffers, or lookup tables without consuming CLB resources
Max System Clock240 MHz - achievable with DLL compensation and proper PCB layout, suitable for real-time signal processing pipelines
I/O Speed622 Mb/s LVDS - supports source-synchronous protocols like camera links or high-speed ADC/DAC interfaces
DLL Count8 - provides independent clock domain management for multiple high-speed I/O banks and internal clock networks
Supply VoltageVCCINT = 1.8 V - reduces dynamic power vs. 2.5 V Virtex devices while maintaining compatibility with 3.3 V I/O standards

Pinout & Package

Package: 144-pin Ceramic Staggered Pin Grid Array (CS144), 0.8 mm pitch, industrial temperature range (-40°C to +100°C).

Pin/TerminalCircuit RoleDesign Meaning
GCLK0–GCLK3Global Clock InputDedicated low-skew clock inputs routed to all DLLs and CLBs; required for synchronous timing closure
VCCINTCore Logic Supply1.8 V supply for CLBs, RAM, and routing; decoupling critical for jitter-sensitive applications
VCCO_0–VCCO_3I/O Bank PowerBank-specific 3.3 V / 2.5 V / 1.8 V supplies enabling mixed-voltage I/O within same device
VREF_0–VREF_3Input Threshold ReferenceExternal reference voltage for SSTL/HSTL/LVCMOS input standards; must be stable ±1% for setup/hold compliance
TCK/TMS/TDI/TDOJTAG Boundary ScanIEEE 1149.1 interface for configuration, debugging, and production test; mandatory for in-system programming

Key Features

FeatureDesign Value
SelectI/O+™ TechnologySupports 20 I/O standards including LVDS, LVPECL, SSTL3, and HSTL IV-enables direct interfacing to memory, processors, and SERDES without level-shifting ICs
SelectRAM+™ Hierarchy65,536-bit block RAM + 24,576-bit distributed RAM-provides on-chip memory bandwidth up to 1.66 Tb/s for high-throughput data buffering
Digital DLLsEight fully digital delay-locked loops with 4× frequency multiplication and zero-delay clock conversion-eliminates external clock synthesizers for DDR and source-synchronous designs
Carry Chain LogicDedicated fast-carry path per CLB slice-reduces propagation delay in arithmetic circuits (e.g., counters, accumulators) by >40% vs. LUT-based carry
SRAM-Based ConfigurationUnlimited reprogrammability with master serial, slave serial, SelectMAP™, and JTAG modes-supports field-upgradable logic and rapid design iteration

Applications

PCI Bridge ControllerHigh-Speed Camera Interface

Use Scenario: Implementing a configurable PCI-to-custom peripheral bridge in industrial motion control systems requiring real-time interrupt handling and DMA arbitration.

IC Role / Device Role / Timing Role: XCV50E-6CS144I acts as the protocol translation and register-mapped interface controller, managing 32-bit/33 MHz PCI transactions while synchronizing local peripherals via DLL-stabilized clocks.

Use Value: Eliminates ASIC development cycle; leverages native PCI compliance and 176 I/Os to route address/data/control lines without glue logic.

Use Scenario: Capturing raw image data from CMOS sensors running at 622 Mb/s LVDS output in machine vision inspection equipment.

IC Role / Device Role / Timing Role: XCV50E-6CS144I serves as the LVDS deserializer and frame buffer controller, using its 8 DLLs to recover embedded clock and align data across multiple differential pairs.

Use Value: Achieves deterministic sampling with sub-nanosecond skew control-critical for pixel-perfect alignment in multi-sensor fusion systems.

DDR SDRAM Memory ControllerProtocol Converter for Legacy Bus Systems

Use Scenario: Managing burst-mode read/write access to 200 Mb/s DDR SDRAM in embedded test instrumentation with tight timing margins.

IC Role / Device Role / Timing Role: XCV50E-6CS144I implements full DDR command decoding, DQS strobe alignment, and write-leveling logic using distributed RAM for command queues and block RAM for data buffering.

Use Value: Delivers 200 MHz effective memory bandwidth without external PHY; leverages built-in DLLs to meet tDQSS and tDQSCK specifications.

Use Scenario: Translating between proprietary 16-bit parallel bus and modern SPI/I²C peripherals in avionics maintenance tools with long product lifecycles.

IC Role / Device Role / Timing Role: XCV50E-6CS144I functions as a state-machine-based protocol mapper, converting asynchronous handshaking signals into synchronized packetized transfers using its 20,736 logic cells and dual-clock domain support.

Use Value: Extends legacy hardware usability without redesigning PCBs-uses 176 I/Os to isolate voltage domains and implement level-shifting logic in fabric.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCV50E-6PQ240C240-pin PQFP package, commercial temperature (0°C to +85°C), 158 user I/OsSuitable for lab prototypes and non-industrial environments where thermal margin is less constrainedSelect when lower cost and easier hand-soldering outweigh need for industrial temp rating and higher I/O count
XCV100E-6CS144ISame CS144 package and industrial temp grade, but 32,400 logic cells and 196 user I/OsRequired for designs exceeding 20K LC capacity or needing >176 I/Os while retaining identical footprint and thermal profileSelect when scalability within same package is prioritized over cost-no PCB change needed

Compared with XCV50E-6CS144I, the XCV50E-6PQ240C trades industrial reliability and I/O density for prototyping convenience, while the XCV100E-6CS144I delivers immediate logic and I/O headroom without altering mechanical or thermal design-making it ideal for future-proofing in fixed-form-factor systems.

Availability

XCV50E-6CS144I is available at Aetrix Electronics and suitable for PCI-compliant embedded controllers, high-speed imaging subsystems, DDR memory interface modules, and industrial protocol converters requiring stable component supply across extended lifecycle programs.

Supply support for XCV50E-6CS144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic solutions for demanding compute, connectivity, and signal processing applications.

The Virtex-E product line was designed specifically for applications requiring PCI compliance, high-bandwidth memory interfacing (ZBT/DDR), and source-synchronous I/O at speeds up to 622 Mb/s-targeting communications infrastructure, test equipment, and industrial automation.

FAQ

What is the maximum operating junction temperature for XCV50E-6CS144I?

The XCV50E-6CS144I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is defined in the DS022-1 Production Product Specification and validated across all speed grades and package variants. Thermal design must ensure sustained operation within this envelope using appropriate heatsinking and airflow for the CS144 ceramic package.

Does XCV50E-6CS144I support LVPECL clock inputs?

Yes, XCV50E-6CS144I supports LVPECL clock inputs up to 300+ MHz through dedicated global clock pins (GCLK0–GCLK3), as confirmed in DS022-1 Section "Differential Signalling Support". These inputs are compatible with standard LVPECL drivers and require AC-coupling and proper termination to 50 Ω to meet setup/hold timing requirements.

How many block RAMs does XCV50E-6CS144I contain?

XCV50E-6CS144I contains 16 block RAMs totaling 65,536 bits, as specified in Table 1 and Table 4 of DS022-2. Each block is a true dual-port 4096-bit RAM with independent read/write addressing, enabling simultaneous access for applications like ping-pong buffering or FIFO implementation without CLB resource consumption.

Is XCV50E-6CS144I pin-compatible with other Virtex-E devices in the CS144 package?

No-XCV50E-6CS144I is not pin-compatible with larger Virtex-E devices (e.g., XCV100E-6CS144I) in the same CS144 package. While both share the 144-pin footprint, Table 3 in DS022-1 shows differing I/O counts (176 vs. 196) and distinct pin assignments for VCCO/VREF banks, making direct substitution impossible without PCB revision.

What configuration modes are supported by XCV50E-6CS144I?

XCV50E-6CS144I supports master serial, slave serial, SelectMAP™, and IEEE 1149.1 JTAG configuration modes, as documented in DS022-2 Section "Configuration Data Loading". JTAG is used for boundary-scan testing and in-system programming; SelectMAP™ enables high-speed parallel configuration from microprocessors or flash memory.

XCV50E-6CS144I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
144-TFBGA, CSPBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
65536
Number of I/O:
94
Number of Gates:
71693
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
144-LCSBGA (12x12)

XCV50E-6CS144I FAQ

1.How can I place an order for XCV50E-6CS144I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV50E-6CS144I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV50E-6CS144I reliable?

The price and inventory of XCV50E-6CS144I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50E-6CS144I is usually 5 days.

3.What payment methods are accepted for XCV50E-6CS144I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50E-6CS144I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV50E-6CS144I?

XCV50E-6CS144I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV50E-6CS144I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV50E-6CS144I?

For technical support, including XCV50E-6CS144I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50E-6CS144I requirements.

6.How does Aetrix verify that XCV50E-6CS144I is sourced from the original manufacturer or authorized distributors?

All XCV50E-6CS144I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50E-6CS144I meets industry standards.

7.What is the process for return or replacement of XCV50E-6CS144I?

All XCV50E-6CS144I units undergo pre-shipment inspection (PSI). If there is an issue with XCV50E-6CS144I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV50E-6CS144I part is unused and in its original packaging.

Return procedure for XCV50E-6CS144I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV50E-6CS144I Tags

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