AMD XCV50E-6FG256C

Overview

XCV50E-6FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 20,736 logic cells, 176 user I/O pins in a 256-ball Fine-Pitch BGA package, and eight digital Delay-Locked Loops (DLLs). It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates 65,536 bits of true dual-port block RAM for high-speed memory interfacing in telecom line cards.

For engineers reviewing the XCV50E-6FG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (4.3 ns register-to-register delay), 1.8 V core voltage with 3.3 V I/O tolerance, PCI-compliant 32-bit/33–66 MHz interface capability, and support for synchronous external memories including 200 MHz ZBT SRAMs and 200 Mb/s DDR SDRAMs.

Technical Context

The XCV50E-6FG256C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four 4-input LUTs with dedicated carry logic, arithmetic XOR/AND gates, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset, and programmable polarity.

Its IOBs support 20 I/O standards-including LVTTL, LVCMOS2, SSTL3, HSTL, PCI, LVDS, and LVPECL-with banked VCCO (1.5–3.3 V) and optional VREF inputs. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication (up to 4×), enabling precise timing control for source-synchronous interfaces.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, thermal performance optimized for industrial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV50E-6FG256C, the XCV50E-7FG256C trades 13% lower maximum clock frequency for reduced dynamic power, while the XCV100E-6FG256C offers 56% more logic cells and 25% more I/O in the same package-enabling scalable architecture without changing PCB layout.

Availability

XCV50E-6FG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, medical imaging, and automated test equipment requiring stable component supply over extended production lifecycles.

Supply support for XCV50E-6FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and ACAPs for high-performance computing and signal processing.

The Virtex-E family was designed for high-speed, high-density applications demanding advanced I/O flexibility, integrated memory, and precise clock management-targeting telecom, military, and industrial systems where reconfigurability and deterministic timing are critical.

FAQ

What is the maximum operating frequency of the XCV50E-6FG256C?

The XCV50E-6FG256C achieves a guaranteed 232 MHz system clock frequency (4.3 ns register-to-register delay) at 1.8 V and 85°C, based on worst-case timing analysis. Internal logic can operate beyond 311 MHz in optimized designs, and its eight DLLs support LVPECL/LVDS clock inputs exceeding 300 MHz for high-speed I/O domains. The actual frequency depends on design topology and place-and-route efficiency.

Does the XCV50E-6FG256C support PCI 66 MHz operation?

Yes, the XCV50E-6FG256C is fully compliant with PCI 3.3 V, 32-bit, 33/66 MHz specifications. Its I/O buffers meet PCI electrical requirements including drive strength, slew rate, and input thresholds. Implementation requires proper termination and adherence to PCI timing budgets; the -6 speed grade ensures sufficient margin for 66 MHz synchronous transfers with setup/hold compliance.

How many differential I/O pairs does the XCV50E-6FG256C support?

The XCV50E-6FG256C supports up to 83 differential I/O pairs in the FG256 package, as confirmed in Table 1 of DS022-1. This enables high-bandwidth interfaces such as LVDS camera links or source-synchronous memory buses. Each pair consumes two adjacent pins within the same I/O bank and requires matched trace lengths and controlled impedance routing per Xilinx layout guidelines.

Can the XCV50E-6FG256C interface directly with 200 MHz ZBT SRAMs?

Yes, the XCV50E-6FG256C is explicitly designed to interface with 200 MHz ZBT SRAMs, as stated in the SelectRAM+™ Memory Hierarchy section. Its high-performance I/O structure, DLL-based clock deskewing, and programmable output delays allow precise timing alignment for burst-mode ZBT read/write cycles. Reference designs and timing constraints are provided in Xilinx Application Note XAPP130.

Is the XCV50E-6FG256C pin-compatible with other Virtex-E devices in the FG256 package?

Yes, the XCV50E-6FG256C shares the same FG256 pinout with XCV100E-6FG256C and XCV200E-6FG256C, as documented in DS022-4 Pinout Tables. All three devices have identical ball assignments for power, ground, clocks, configuration, and boundary scan. However, unused pins may differ, and I/O bank voltage assignments must be verified per device density to ensure VCCO/VREF compatibility.