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AMD XCV50E-6FG256I
- Part No.:
- XCV50E-6FG256I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XCV50E-6FG256I.pdf
- Description:
- IC FPGA 176 I/O 256FBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XCV50E-6FG256I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 20,736 logic cells, 176 user I/O pins in a 256-ball Fine-Pitch BGA (FG256) package, and industrial temperature range (–40°C to +100°C). It integrates eight digital Delay-Locked Loops (DLLs), 65,536 bits of true dual-port block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V interfaces for high-speed data acquisition systems.
For engineers reviewing the XCV50E-6FG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and industrial-grade thermal validation - all specific to the XCV50E-6FG256I speed grade and FG256 package.
Technical Context
The XCV50E-6FG256I implements a regular array architecture with configurable logic blocks (CLBs) containing four 4-input LUTs per slice, dedicated carry chains for arithmetic, and F5/F6 multiplexers enabling up to 6-input logic functions. Each CLB includes two BUFTs for internal bus driving and supports synchronous/asynchronous set/reset with independent polarity control.
I/O functionality is organized into eight banks, each requiring shared VCCO and (where applicable) a single VREF voltage. Input buffers for LVTTL, LVCMOS2, and PCI standards are powered by VCCO-not VCCINT-enabling mixed-voltage I/O operation within bank constraints. The device uses IEEE 1149.1 boundary-scan and includes a die-temperature sensor diode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,736 - defines maximum combinational and sequential logic capacity for synthesis and place-and-route |
| User I/O Pins | 176 - available in FG256 package; supports up to 83 differential I/O pairs or 176 single-ended signals |
| Block RAM Bits | 65,536 - organized as sixteen 4096-bit true dual-port RAM blocks, enabling independent read/write on each port |
| Delay-Locked Loops | 8 DLLs - provide zero-delay clock conversion, 50% duty cycle generation for DDR, and clock multiply/divide |
| Internal Voltage | VCCINT = 1.8 V - reduces dynamic power vs. 2.5 V Virtex family; I/O pins are 3.3 V tolerant |
| Speed Grade | -6 - guarantees worst-case register-to-register delay ≤ 4.3 ns and address decoder delay ≤ 3.8 ns at industrial temperature |
| Process Technology | 0.18 μm 6-layer metal CMOS - enables higher density and lower static power than prior Virtex generations |
Pinout & Package
Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, industrial temperature rating (–40°C to +100°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Dedicated Global Clock Inputs | Four low-skew clock inputs routed directly to DLLs; require external termination for LVPECL/LVDS |
| VCCINT | Core Logic Supply | 1.8 V supply for CLBs, RAM, and routing; must be decoupled locally per Xilinx recommendations |
| VCCO_0–VCCO_7 | I/O Bank Power Supplies | Eight independent VCCO pins (one per bank); voltage sets output drive level and input threshold compatibility |
| VREF_0–VREF_7 | I/O Threshold Reference | Bank-specific reference voltage for SSTL, HSTL, GTL; internally tied within bank; must be externally sourced |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | IEEE 1149.1 compliant; used for configuration, debugging, and in-system programming |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Block RAM | 16 × 4096-bit blocks with independent address/data/control per port - enables simultaneous read/write for FIFOs and ping-pong buffering |
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s), LVPECL, SSTL3, and PCI - allows direct interfacing to memory, SERDES, and backplane drivers |
| Digital DLLs | 8 fully digital DLLs with 4× frequency multiplication and clock mirroring - eliminates external PLLs for DDR clocking and source-synchronous timing |
| Distributed RAM | 24,576 bits of LUT-based RAM - provides shallow, fast memory for registers, shift registers, and small lookup tables without consuming block RAM |
| Configurable I/O Banking | 8 independent I/O banks with per-bank VCCO/VREF - enables mixed-voltage operation (e.g., 3.3 V PCI + 2.5 V SSTL) on same device |
Applications
| High-Speed Data Acquisition | PCI Bus Interface Card |
|---|---|
Use Scenario: Real-time digitization of analog sensor streams at >100 MSPS using parallel ADCs and time-stamping logic. IC Role / Device Role / Timing Role: FPGA acts as real-time preprocessing engine, synchronizing ADC clocks via DLL-generated 100 MHz LVDS, buffering samples in block RAM, and formatting packets for host transfer. Use Value: On-chip DLLs eliminate external clock jitter; 176 I/O pins support full-width parallel ADC bus plus PCIe/PCI interface; dual-port RAM enables concurrent capture and readout. | Use Scenario: Industrial control card connecting PLC I/O modules to host PC via 32-bit/33 MHz PCI slot. IC Role / Device Role / Timing Role: XCV50E-6FG256I implements PCI target interface logic, DMA controller, and custom I/O mapping logic with precise setup/hold timing compliance. Use Value: Native PCI 3.3 V compliance ensures plug-and-play operation; -6 speed grade meets PCI timing margins at 100°C; 176 I/Os accommodate address/data multiplexing and interrupt signaling. |
| LVDS Camera Interface | Protocol Translation Bridge |
Use Scenario: Aggregating four 8-bit LVDS camera links (each 622 Mb/s) into a unified parallel video stream for image processing ASIC. IC Role / Device Role / Timing Role: FPGA receives serialized pixel data on dedicated LVDS inputs, deserializes using DLL-synchronized sampling, aligns frames, and outputs parallel 32-bit RGB data. Use Value: LVDS input support at 622 Mb/s per pair enables direct connection to CMOS image sensors; DLLs lock to incoming pixel clock for sub-nanosecond skew control across lanes. | Use Scenario: Converting legacy RS-422 serial commands to SPI-configured DACs and GPIO-controlled relays in test equipment. IC Role / Device Role / Timing Role: XCV50E-6FG256I serves as protocol-aware bridge: parses command packets, generates precise SPI timing (with DLL-derived clocks), and manages isolation-safe relay drive sequencing. Use Value: Configurable I/O banks allow 3.3 V RS-422 receivers and 5 V-tolerant relay drivers on same device; distributed RAM stores command lookup tables; logic cells implement state machines with deterministic latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV50E-6PQ240C | Same logic cell count and block RAM, but PQ240 package (240-pin plastic quad flatpack) and commercial temperature range (0°C to +85°C) | Lacks industrial thermal rating and has only 158 user I/O pins; no FG256 ball-grid mechanical compatibility | Select only for cost-sensitive, non-industrial environments where PCB space permits larger footprint and thermal margin is sufficient |
| XCV100E-6FG256I | Higher density (32,400 logic cells), same FG256 package and industrial rating, but 196 user I/O pins and 81,920 block RAM bits | Provides 56% more logic resources and 25% more I/O; requires updated pin assignment and timing closure due to increased routing complexity | Choose when design scalability is required and additional CLBs/RAM justify higher unit cost and potential layout revision |
Compared with XCV50E-6FG256I, the XCV50E-6PQ240C sacrifices thermal robustness and I/O count for lower cost and simpler assembly, while the XCV100E-6FG256I offers headroom for logic expansion without changing package or thermal qualification - both require explicit pin mapping and timing revalidation.
Availability
XCV50E-6FG256I is available at Aetrix Electronics and suitable for high-reliability industrial control, test instrumentation, and embedded vision systems requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for XCV50E-6FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGAs and advanced system-on-chip integration tools.
The Virtex-E product line was designed for high-performance, high-density digital logic implementation in applications demanding multi-standard I/O, embedded memory, and deterministic clock management - particularly where industrial temperature operation and PCI/LVDS interoperability are critical.
FAQ
What is the maximum supported LVDS data rate for XCV50E-6FG256I?
The XCV50E-6FG256I supports LVDS signaling at up to 622 Mb/s per differential pair, as confirmed in DS022-1 Table 2 and validated by its DLL-synchronized input capture capability. This rate applies to both input and output directions and is achievable under industrial temperature conditions when using proper PCB layout practices for controlled impedance and termination.
Does XCV50E-6FG256I support true dual-port block RAM operation?
Yes, the XCV50E-6FG256I contains 16 block RAM units, each providing true dual-port functionality: independent read/write addresses, data buses, and control signals for Port A and Port B. This enables concurrent access patterns essential for FIFOs, frame buffers, and data coalescing without arbitration logic - a feature explicitly documented in DS022-2 Module 2.
How many DLLs does XCV50E-6FG256I include, and what are their key capabilities?
The XCV50E-6FG256I integrates eight fully digital Delay-Locked Loops (DLLs). Each supports clock multiply (up to 4×), divide, 50% duty cycle correction for DDR applications, and zero-delay conversion of high-speed LVPECL/LVDS clocks to any I/O standard - all without external components, as specified in DS022-1 Features section and Module 2 architectural description.
Can XCV50E-6FG256I operate with mixed I/O voltages on the same device?
Yes, the XCV50E-6FG256I supports mixed I/O voltages through its eight independent I/O banks. Each bank has dedicated VCCO and (if needed) VREF pins, allowing simultaneous use of LVTTL (3.3 V), SSTL2 (2.5 V), and LVCMOS18 (1.8 V) standards - provided compatible standards share the same VCCO per bank, as defined in DS022-2 Table 2 and I/O Banking section.
Is XCV50E-6FG256I pin-compatible with other Virtex-E devices in the FG256 package?
Yes, XCV50E-6FG256I is pin-compatible with other Virtex-E devices offered in the FG256 package, including XCV100E-6FG256I and XCV200E-6FG256I, as stated in DS022-1 "Virtex-E Compared to Virtex Devices" section. However, unused pins may differ, and I/O bank assignments must be verified against the specific device's pinout table in DS022-4.
XCV50E-6FG256I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 65536
- Number of I/O:
- 176
- Number of Gates:
- 71693
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XCV50E-6FG256I FAQ
1.How can I place an order for XCV50E-6FG256I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV50E-6FG256I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV50E-6FG256I reliable?
The price and inventory of XCV50E-6FG256I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50E-6FG256I is usually 5 days.
3.What payment methods are accepted for XCV50E-6FG256I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50E-6FG256I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV50E-6FG256I?
XCV50E-6FG256I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV50E-6FG256I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV50E-6FG256I?
For technical support, including XCV50E-6FG256I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50E-6FG256I requirements.
6.How does Aetrix verify that XCV50E-6FG256I is sourced from the original manufacturer or authorized distributors?
All XCV50E-6FG256I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50E-6FG256I meets industry standards.
7.What is the process for return or replacement of XCV50E-6FG256I?
All XCV50E-6FG256I units undergo pre-shipment inspection (PSI). If there is an issue with XCV50E-6FG256I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV50E-6FG256I part is unused and in its original packaging.
Return procedure for XCV50E-6FG256I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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