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AMD XCV50E-6PQ240C
- Part No.:
- XCV50E-6PQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV50E-6PQ240C.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,418
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Product details
Overview
XCV50E-6PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 20,736 logic cells, 176 user I/O pins in PQ240 package, and eight digital Delay-Locked Loops (DLLs) supporting 240 MHz system clock operation and LVPECL/LVDS clock inputs up to 300+ MHz - deployed in high-speed communications infrastructure and embedded signal processing systems.
For engineers reviewing the XCV50E-6PQ240C datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade timing (4.3 ns register-to-register delay), 1.8 V core voltage, PCI-compliant 3.3 V I/O, and support for differential standards including LVDS at 622 Mb/s and BLVDS.
Technical Context
The XCV50E-6PQ240C implements a regular CLB array (16 × 24) with four logic cells per CLB, each containing dual 4-input LUTs, dedicated carry chains, and configurable flip-flops/latches with independent clock enable and synchronous/asynchronous set/reset. Its eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and 4× frequency multiplication.
I/O architecture uses SelectI/O+™ with banked VCCO-supplied input buffers (LVTTL, LVCMOS2, PCI), supporting 20 interface standards. Each of its 176 user I/Os can be configured as single-ended or differential (up to 83 differential pairs), with programmable drive strength, slew rate, weak keeper, and optional pull-up/down.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,736 - determines maximum combinational and sequential logic capacity for RTL implementation |
| System Gates | 71,693 - silicon-equivalent gate count metric aligned with ASIC comparison benchmarks |
| User I/O Pins | 176 - supports high-pin-count parallel interfaces such as DDR SDRAM, ZBT SRAM, and PCI 32-bit/33 MHz |
| Block RAM Bits | 65,536 - enables 16 × 4096-bit true dual-port synchronous memory blocks for FIFOs and buffering |
| DLL Count | 8 - provides independent clock domain management for multi-clock designs and jitter reduction |
| Max System Clock | 240 MHz - achievable synchronous performance with I/O included, verified under worst-case timing |
| Core Voltage (VCCINT) | 1.8 V - reduces dynamic power vs. 2.5 V Virtex family while enabling 0.18 μm process density |
Pinout & Package
PQ240 refers to a 240-pin Plastic Quad Flat Package (PQFP) with 0.5 mm pitch, 32.5 mm × 32.5 mm body size, and exposed thermal pad - suitable for industrial PCB assembly and thermal management without ball-grid complexity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew clock routing inputs tied to DLLs for synchronous domain control |
| VCCINT | Core Power Supply | 1.8 V supply for internal logic and memory; requires local decoupling near power pins |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 3.3 V / 2.5 V / 1.8 V supplies enabling mixed-voltage I/O standards per bank |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL, HSTL, GTL standards; must be externally sourced |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for configuration, debug, and production testing |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port BlockRAM | 4096-bit blocks with independent read/write clocks and widths - enables simultaneous producer/consumer access without arbitration logic |
| SelectI/O+™ Banking | Eight independent I/O banks with separate VCCO/VREF - allows concurrent LVTTL, SSTL2, and LVDS signaling on same device |
| Dedicated Carry Logic | Two-bit-per-CLB carry chains - accelerates arithmetic pipelines and wide adders without LUT resource consumption |
| Configurable IOB Flip-Flops | Three per IOB with independent CE, SR/BY, and polarity control - supports retiming, setup/hold optimization, and I/O register alignment |
| SRAM-Based In-System Config | Unlimited reprogramming via JTAG, SelectMAP, or serial PROM - enables field firmware updates and design iteration |
Applications
| High-Speed Communications Backplane | PCI Bridge Interface |
|---|---|
Use Scenario: Line card in telecom switching fabric handling 622 Mb/s SONET/SDH data streams with source-synchronous capture. IC Role / Device Role / Timing Role: FPGA acts as protocol mapper and elastic buffer between framer IC and backplane PHY, using LVDS I/O and DLL-synchronized sampling. Use Value: 622 Mb/s LVDS support and 8 DLLs enable deterministic clock domain crossing and jitter-tolerant data recovery without external PLLs. | Use Scenario: Add-in card bridging legacy PCI 32-bit/33 MHz peripheral to modern processor bus with burst-mode DMA. IC Role / Device Role / Timing Role: Configurable PCI target/master interface implementing address decoding, parity generation, and posted write buffering. Use Value: PCI-compliant 3.3 V I/O, 176 pins, and 240 MHz internal clock allow full-width 32-bit transfers at 132 MB/s sustained bandwidth. |
| DDR SDRAM Memory Controller | Real-Time Signal Processing Engine |
Use Scenario: Embedded controller managing 200 Mb/s DDR SDRAM for video frame buffering in broadcast equipment. IC Role / Device Role / Timing Role: Timing-critical DDR controller with DQS strobe alignment, write leveling, and refresh scheduling logic implemented in CLBs and IOBs. Use Value: DLL-generated 50% duty cycle clocks and programmable IOB delays meet DDR setup/hold requirements across process/voltage/temperature corners. | Use Scenario: Radar baseband processor performing real-time FFT and pulse compression on digitized IF samples. IC Role / Device Role / Timing Role: High-throughput datapath accelerator using distributed LUT RAM for coefficient storage and carry-chain arithmetic for fixed-point math. Use Value: 20,736 logic cells and dedicated multiplier support deliver >311 MHz internal arithmetic throughput for pipelined DSP kernels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV50E-7PQ240C | Slower -7 speed grade (4.6 ns register-to-register), identical logic count, I/O, and package | Suitable for cost-sensitive designs where 240 MHz system clock is not required | Select when timing margin allows relaxed speed grade to reduce cost and power |
| XCV100E-6PQ240C | Higher density (32,400 logic cells), same -6 speed grade and PQ240 package footprint | Required when design exceeds 20K LC capacity but retains same board layout and I/O count | Choose for design scalability without PCB redesign; shares pinout and voltage domains |
Compared with XCV50E-6PQ240C, the -7 variant trades 30 MHz peak clock capability for lower cost, while XCV100E-6PQ240C extends logic capacity by 56% within identical mechanical and electrical constraints - enabling seamless migration paths for evolving system requirements.
Availability
XCV50E-6PQ240C is available at Aetrix Electronics and suitable for high-speed communications infrastructure, PCI-based industrial controllers, and DDR SDRAM memory subsystems requiring stable component supply across extended product lifecycles.
Supply support for XCV50E-6PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGAs and advanced system-on-chip integration tools.
The Virtex-E family was designed for high-performance, high-density digital system integration - targeting applications demanding both speed (240 MHz system clock) and flexibility (reconfigurable logic, mixed I/O standards, embedded memory) in communications and computing.
FAQ
What is the maximum operating temperature range for XCV50E-6PQ240C?
XCV50E-6PQ240C is rated for commercial temperature operation from 0 °C to +85 °C (Tj). This is indicated by the 'C' suffix in the part number and aligns with JEDEC JESD22-A104 reliability testing for plastic packages under steady-state conditions.
Does XCV50E-6PQ240C support LVDS I/O standards?
Yes, XCV50E-6PQ240C supports LVDS I/O with data rates up to 622 Mb/s. It provides dedicated differential I/O pairs, programmable termination, and DLL-synchronized clocking - confirmed in DS022-1 Table 1 and DS022-2 Section "Differential Signalling Support".
How many block RAM resources does XCV50E-6PQ240C contain?
XCV50E-6PQ240C contains 16 block RAM units totaling 65,536 bits (16 × 4096-bit true dual-port blocks), as specified in Table 4 of DS022-2 and Table 1 of DS022-1 - sufficient for dual-clock FIFOs, coefficient tables, or small instruction memories.
Is XCV50E-6PQ240C pin-compatible with other Virtex-E devices in PQ240 package?
XCV50E-6PQ240C shares the same PQ240 pinout with XCV100E-6PQ240C and XCV200E-6PQ240C per DS022-1 page 3, though I/O bank assignments and VCCO/VREF pin allocations differ - requiring careful review of Module 4 pinout tables before substitution.
What configuration modes are supported by XCV50E-6PQ240C?
XCV50E-6PQ240C supports master serial (via external SPROM), slave serial, SelectMAP™ parallel, and IEEE 1149.1 JTAG boundary-scan configuration - all detailed in DS022-1 Section "Configuration Data Loading" and DS022-2 Section "Configuration Architecture".
XCV50E-6PQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 65536
- Number of I/O:
- 158
- Number of Gates:
- 71693
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV50E-6PQ240C FAQ
1.How can I place an order for XCV50E-6PQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV50E-6PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV50E-6PQ240C reliable?
The price and inventory of XCV50E-6PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50E-6PQ240C is usually 5 days.
3.What payment methods are accepted for XCV50E-6PQ240C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50E-6PQ240C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV50E-6PQ240C?
XCV50E-6PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV50E-6PQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV50E-6PQ240C?
For technical support, including XCV50E-6PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50E-6PQ240C requirements.
6.How does Aetrix verify that XCV50E-6PQ240C is sourced from the original manufacturer or authorized distributors?
All XCV50E-6PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50E-6PQ240C meets industry standards.
7.What is the process for return or replacement of XCV50E-6PQ240C?
All XCV50E-6PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV50E-6PQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV50E-6PQ240C part is unused and in its original packaging.
Return procedure for XCV50E-6PQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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