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AMD XCV50E-6PQ240I

Part No.:
XCV50E-6PQ240I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP
Datasheet:
AetrixXCV50E-6PQ240I.pdf
Description:
IC FPGA 158 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,663

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Product details

Overview

XCV50E-6PQ240I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 20,736 logic cells, 176 user I/O pins in PQ240 package, and eight digital Delay-Locked Loops (DLLs) supporting 240 MHz system clocking and 622 Mb/s LVDS I/O - deployed in high-speed communications infrastructure and industrial control systems requiring reconfigurable logic with PCI-33/66 compliance.

For engineers reviewing the XCV50E-6PQ240I datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade timing (4.3 ns register-to-register), 1.8 V core voltage with 3.3 V I/O tolerance, dual-port block RAM capability, and compatibility with Xilinx Foundation/Alliance development tools for rapid HDL synthesis and place-and-route.

Technical Context

The XCV50E-6PQ240I implements a regular array architecture of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains and arithmetic logic, enabling high-speed adders and multipliers. Its IOBs support 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL with programmable VREF and VCCO per I/O bank.

Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle correction for DDR applications, and up to 4× frequency multiplication. The device integrates 65,536 bits of synchronous block RAM (16 × 4096-bit True Dual-Port blocks) and 24,576 bits of distributed RAM, all configurable via SRAM bitstream loaded through JTAG, SelectMAP, or master serial mode.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells20,736 - defines maximum combinational and sequential logic capacity for complex state machines and datapaths
System Gates71,693 - industry-standard metric estimating equivalent ASIC gate count for design sizing
User I/O Pins176 - supports high-bandwidth parallel interfaces such as ZBT SRAM (200 MHz) and DDR SDRAM (200 Mb/s)
Block RAM Bits65,536 - organized as 16 independent 4096-bit True Dual-Port blocks for simultaneous read/write on separate ports
DLL Count8 - enables independent clock domain management, jitter reduction, and phase alignment across multiple I/O banks
Core Voltage (VCCINT)1.8 V - reduces dynamic power vs. 2.5 V Virtex family while maintaining performance via 0.18 μm 6-layer metal process
Speed Grade-6 - guarantees worst-case 4.3 ns register-to-register delay and 240 MHz synchronous operation under industrial temperature range
I/O StandardsLVTTL, LVCMOS2, SSTL3, HSTL, LVDS, LVPECL - enables direct interfacing to memory, processors, and SERDES without level-shifting

Pinout & Package

PQ240 refers to a 240-pin Plastic Quad Flat Package (PQFP) with 0.5 mm pitch, 32.5 mm × 32.5 mm body size, and exposed thermal pad - suitable for industrial PCB assembly and thermal management up to 100 °C junction temperature.

Pin/TerminalCircuit RoleDesign Meaning
GCLK0–GCLK3Global Clock InputDedicated low-skew inputs feeding DLLs; required for synchronous timing closure at >100 MHz
VCCINTCore Power Supply1.8 V supply for CLBs, RAM, and routing; must be decoupled within 1 cm of each pin
VCCO_0–VCCO_7I/O Bank PowerIndependent 1.5–3.3 V supplies per bank; determines compatible I/O standards (e.g., VCCO=3.3 V enables LVTTL/PCI)
VREF_0–VREF_7Input Threshold ReferenceRequired for SSTL/HSTL/LVCMOS input buffers; must be stable ±1% and routed with controlled impedance
TCK/TMS/TDI/TDOJTAG Boundary ScanIEEE 1149.1-compliant test access port for configuration, debugging, and in-system verification
PROGRAM_BConfiguration ResetActive-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence

Key Features

FeatureDesign Value
SelectI/O+™ TechnologySupports 20 I/O standards including LVDS (622 Mb/s) and LVPECL (300+ MHz clocks) with per-bank VCCO/VREF control
SelectRAM+™ Memory Hierarchy65,536-bit block RAM + 24,576-bit distributed RAM - enables embedded FIFOs, caches, and dual-clock buffering without external memory
Digital Delay-Locked Loops (DLLs)8 independent DLLs with 4× multiplication, duty-cycle correction, and zero-delay clock conversion for DDR and source-synchronous interfaces
Flexible CLB ArchitectureEach CLB contains 4 LUTs + carry logic + arithmetic AND/XOR - optimized for pipelined multipliers and wide adders with <4.5 ns propagation
SRAM-Based In-System ConfigurationUnlimited reprogramming via JTAG or SelectMAP; supports partial reconfiguration and remote updates in field-deployed systems

Applications

High-Speed Communications BackplaneIndustrial Motion Control System

Use Scenario: Line card in telecom switch handling 622 Mb/s OC-12 data streams with protocol translation between SONET and Ethernet.

IC Role / Device Role / Timing Role: FPGA fabric implements SERDES interface, framing logic, and packet buffer using LVDS I/O and block RAM.

Use Value: 622 Mb/s LVDS I/O and 8 DLLs enable deterministic latency and jitter-free clock recovery without external PLLs.

Use Scenario: Real-time servo controller synchronizing 8-axis motor drives with sub-microsecond position update cycles.

IC Role / Device Role / Timing Role: Configurable logic executes PID loops, PWM generation, and safety monitoring; DLLs lock to 200 MHz encoder clock.

Use Value: 240 MHz system clock and dedicated carry logic deliver <100 ns loop latency for closed-loop response.

PCI-Compliant Data Acquisition CardReconfigurable Test Equipment Platform

Use Scenario: Modular DAQ board acquiring 16-channel 14-bit ADC data at 100 kS/s and streaming via 33 MHz PCI bus.

IC Role / Device Role / Timing Role: Bridges parallel ADC outputs to PCI interface using LVTTL I/O and PCI-compliant timing; manages DMA handshaking.

Use Value: Native 3.3 V PCI compliance (32-bit, 33 MHz) eliminates level-shifters and reduces BOM cost by $1.20/unit.

Use Scenario: ATE platform supporting multiple DUT interfaces via downloadable HDL configurations for analog/digital parametric testing.

IC Role / Device Role / Timing Role: Reconfigurable I/O bank adapts to LVCMOS18, SSTL2, or HSTL standards per test fixture; block RAM stores stimulus patterns.

Use Value: Per-bank VCCO/VREF control allows mixed-voltage I/O on single PCB, reducing fixture redesign effort by 70%.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCV50E-7PQ240ISame architecture and pinout; -7 speed grade offers 3.8 ns register-to-register delay (vs. 4.3 ns for -6)Suitable for designs requiring tighter timing margins at 260+ MHz system clockSelect when worst-case path timing exceeds -6 grade margin but PCB layout and power delivery support higher speed
XCV100E-6PQ240ISame PQ240 package and speed grade; 32,400 logic cells (+56% density) and 196 user I/O (+11%)Required for larger designs with >20K logic cells or >176 I/O signalsChoose when design growth headroom is needed without changing footprint or thermal solution

Compared with XCV50E-6PQ240I, the -7 variant improves timing closure margin by 12% but increases dynamic power 8%; the XCV100E-6PQ240I doubles logic capacity while retaining identical thermal and mechanical integration - making it ideal for scalable platform designs.

Availability

XCV50E-6PQ240I is available at Aetrix Electronics and suitable for high-reliability industrial control, telecommunications infrastructure, and test equipment applications requiring stable component supply and long-term lifecycle support.

Supply support for XCV50E-6PQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and toolchains for reconfigurable computing.

The Virtex-E family was designed for high-performance, high-density applications demanding advanced I/O flexibility, integrated memory, and precise clock management - targeting communications, military, and industrial markets where reprogrammability and signal integrity are critical.

FAQ

What is the maximum operating junction temperature for XCV50E-6PQ240I?

The XCV50E-6PQ240I is rated for industrial temperature range: –40 °C to +100 °C junction temperature. This is confirmed in the DS022-1 ordering information section, where the "I" suffix explicitly denotes industrial-grade thermal specification. Thermal design must ensure VCCINT and VCCO power delivery remains within 5% regulation across this full range.

Does XCV50E-6PQ240I support PCI-X or only conventional PCI?

XCV50E-6PQ240I supports only conventional PCI (32-bit, 33/66 MHz, 3.3 V signaling) as stated in the DS022-1 Features section. It does not support PCI-X, which requires 64-bit width, 133 MHz clocking, and different electrical specifications. The device complies fully with PCI Local Bus Specification Revision 2.2 for 33/66-MHz operation.

How many DLLs are available in XCV50E-6PQ240I and what are their primary functions?

XCV50E-6PQ240I integrates eight fully digital Delay-Locked Loops (DLLs). Their primary functions include zero-delay clock conversion from LVPECL/LVDS inputs to any I/O standard, 50% duty-cycle correction for DDR interfaces, clock multiplication up to 4×, and skew compensation across global clock networks - all documented in DS022-1 Module 1 and DS022-2 architectural description.

Can XCV50E-6PQ240I be configured via JTAG in-system, and what modes are supported?

Yes, XCV50E-6PQ240I supports IEEE 1149.1 JTAG boundary-scan configuration in addition to SelectMAP™ parallel mode and slave serial mode. JTAG enables in-system programming, debugging, and verification without requiring external configuration PROMs - as specified in DS022-1 Module 1 and DS022-2 Functional Description.

Is XCV50E-6PQ240I pin-compatible with earlier Virtex family FPGAs in PQ240 package?

XCV50E-6PQ240I is pin-compatible with equivalent Virtex devices (e.g., XCV50) in the same PQ240 package, with minor exceptions documented in DS022-1 Module 1. However, it is not bitstream-compatible due to architectural differences in CLB structure, DLL implementation, and memory mapping - requiring full recompilation of HDL designs.

XCV50E-6PQ240I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-E
Package/Case:
240-BFQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
384
Number of Logic Elements/Cells:
1728
Total RAM Bits:
65536
Number of I/O:
158
Number of Gates:
71693
Voltage - Supply:
1.71V ~ 1.89V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV50E-6PQ240I FAQ

1.How can I place an order for XCV50E-6PQ240I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV50E-6PQ240I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV50E-6PQ240I reliable?

The price and inventory of XCV50E-6PQ240I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50E-6PQ240I is usually 5 days.

3.What payment methods are accepted for XCV50E-6PQ240I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50E-6PQ240I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV50E-6PQ240I?

XCV50E-6PQ240I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV50E-6PQ240I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV50E-6PQ240I?

For technical support, including XCV50E-6PQ240I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50E-6PQ240I requirements.

6.How does Aetrix verify that XCV50E-6PQ240I is sourced from the original manufacturer or authorized distributors?

All XCV50E-6PQ240I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50E-6PQ240I meets industry standards.

7.What is the process for return or replacement of XCV50E-6PQ240I?

All XCV50E-6PQ240I units undergo pre-shipment inspection (PSI). If there is an issue with XCV50E-6PQ240I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV50E-6PQ240I part is unused and in its original packaging.

Return procedure for XCV50E-6PQ240I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV50E-6PQ240I Tags

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