AMD XCV50E-7CS144C

Overview

XCV50E-7CS144C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 20,736 logic cells, 176 user I/Os in a 144-pin CSOP package, and eight digital Delay-Locked Loops (DLLs). It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates 65,536 bits of block RAM and 24,576 bits of distributed RAM for high-speed signal processing and memory-intensive embedded control.

For engineers reviewing the XCV50E-7CS144C datasheet, pinout, applications, or equivalent options, this device serves as a high-density, low-power reprogrammable logic solution for PCI-compliant 33/66 MHz interfaces, source-synchronous data capture, and DDR memory controller implementation - with confirmed support for LVTTL, LVCMOS2, SSTL3, HSTL, and differential standards within banked I/O architecture.

Technical Context

The XCV50E-7CS144C implements a regular array architecture of Configurable Logic Blocks (CLBs), each containing four 4-input Look-Up Tables (LUTs), dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4×.

I/O functionality is organized into eight banks with voltage-referenced signaling: input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO (not VCCINT), enabling mixed-voltage operation; VREF is required for SSTL/HSTL inputs and shared per bank; LVDS/LVPECL inputs accept 300+ MHz clocks and operate at 2.5 V or 3.3 V VCCO respectively.

Key Specifications

Pinout & Package

Package: 144-pin Ceramic Staggered Pin Grid Array (CSOP), 0.8 mm pitch, body size 22.2 mm × 22.2 mm, RoHS-compliant lead finish. Thermal resistance θ_JA = 35°C/W typical.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV50E-7CS144C, the -6 variant trades speed for reduced power and improved timing margin, while the XCV100E-7CS144C retains full pin compatibility but doubles logic and memory resources - making it a direct upgrade path for designs approaching capacity limits.

Availability

XCV50E-7CS144C is available at Aetrix Electronics and suitable for PCI-compliant interface development, DDR memory controller implementation, LVDS camera interface design, and high-speed protocol analysis requiring stable component supply across extended production lifecycles.

Supply support for XCV50E-7CS144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, SoCs, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed specifically for high-performance, high-density reconfigurable logic in communications infrastructure, test equipment, and embedded vision systems - emphasizing I/O flexibility, clock management, and memory hierarchy.

FAQ

What is the maximum differential I/O capability of the XCV50E-7CS144C?

The XCV50E-7CS144C supports up to 83 differential I/O pairs in the CS144 package, enabling >100 Gb/s aggregate bandwidth. Each pair operates at up to 622 Mb/s using LVDS or BLVDS signaling, with dedicated routing to minimize skew. This capability is confirmed in Table 1 and Table 3 of DS022-1 (v2.3), and applies specifically to the XCV50E-7CS144C variant.

Does the XCV50E-7CS144C support 5 V-tolerant I/O?

The XCV50E-7CS144C does not natively support 5 V-tolerant I/O. Its I/O pins are 3.3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin - as explicitly stated in the "Virtex-E Compared to Virtex Devices" section of DS022-1 (v2.3). PCI 5 V operation is not supported.

How many DLLs are integrated into the XCV50E-7CS144C, and what are their key functions?

The XCV50E-7CS144C integrates eight fully digital Delay-Locked Loops (DLLs), as documented in the Features section of DS022-1 (v2.3). These DLLs provide clock multiply/divide, 50% duty-cycle synthesis for DDR applications, zero-delay conversion of high-speed LVPECL/LVDS clocks, and easier clock mirroring - all confirmed for the XCV50E device family.

Is the XCV50E-7CS144C pin-compatible with other Virtex-E devices in the CS144 package?

Yes, the XCV50E-7CS144C shares identical pinout with other Virtex-E devices offered in the CS144 package, including XCV100E-7CS144C and XCV50E-6CS144C. The "Virtex-E Device/Package Combinations" table in DS022-1 (v2.3) confirms CS144 supports only XCV50E and XCV100E, both with 94 user I/Os and identical pin assignments for power, clock, and configuration signals.

What memory resources are available on the XCV50E-7CS144C?

The XCV50E-7CS144C provides 65,536 bits of synchronous block RAM (16 × 4096-bit true dual-port blocks) and 24,576 bits of distributed RAM implemented in LUTs. This memory hierarchy is specified in Table 1 of DS022-1 (v2.3) and enables simultaneous read/write operations for applications like FIFO buffering and coefficient storage without CLB resource consumption.