AMD XCV50E-7CS144I

Overview

XCV50E-7CS144I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 20,736 logic cells, 176 user I/Os in a 144-pin CSOP package, and eight digital Delay-Locked Loops (DLLs). It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates 65,536 bits of block RAM and 24,576 bits of distributed RAM for high-speed signal processing and memory-intensive embedded applications.

For engineers reviewing the XCV50E-7CS144I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, CLB-level resource mapping, and industrial-temperature (-40°C to +100°C) operation guidance - all specific to the -7 speed grade in the CS144 package.

Technical Context

The XCV50E-7CS144I implements a regular array architecture with 16 × 24 CLBs, each containing four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice. Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and frequency multiplication up to 4× - critical for synchronizing high-speed source-synchronous interfaces like LVDS and HSTL.

I/O resources are organized into eight banks with independent VCCO and VREF supply domains; the CS144 package allocates 94 user I/O pins across Banks 0–3, supporting mixed standards only when sharing VCCO (e.g., LVTTL and PCI33_3 at 3.3 V), while LVCMOS18 and SSTL2 require separate 1.8 V and 2.5 V banks respectively.

Key Specifications

Pinout & Package

Package: 144-pin Ceramic Staggered Pin Grid Array (CS144), 0.8 mm pitch, 22.0 × 22.0 mm body size, with 94 user I/O pins distributed across four I/O banks (Bank 0–3) and dedicated power/ground pins per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV50E-7CS144I, the -6 variant trades speed for cost in thermally stable environments, while the XCV100E-7CS144I extends logic and I/O capacity within identical mechanical constraints - enabling incremental design upgrades without board redesign.

Availability

XCV50E-7CS144I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, medical imaging, and avionics applications requiring stable component supply, long-term lifecycle management, and industrial-temperature-grade programmable logic.

Supply support for XCV50E-7CS144I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density embedded systems demanding advanced I/O flexibility, integrated memory, and deterministic clocking - targeting communications infrastructure, test equipment, and mission-critical control systems.

FAQ

What is the maximum differential I/O data rate supported by XCV50E-7CS144I?

XCV50E-7CS144I supports LVDS and BLVDS differential signaling at up to 622 Mb/s, as confirmed in DS022-1 (v2.3) Section "Differential Signalling Support". This rate applies to source-synchronous interfaces with proper PCB termination and matched trace lengths; actual achievable throughput depends on board layout and signal integrity validation.

Does XCV50E-7CS144I support PCI 66 MHz operation?

Yes, XCV50E-7CS144I is PCI 3.3 V compliant and supports both 33 MHz and 66 MHz bus operation, as stated in the "Fast, High-Density 1.8 V FPGA Family" feature list (DS022-1 p.1). It requires LVTTL I/O standard with 3.3 V VCCO and meets PCI specification timing margins under -7 speed grade conditions.

How many DLLs does XCV50E-7CS144I include, and what are their key capabilities?

XCV50E-7CS144I integrates eight fully digital Delay-Locked Loops (DLLs), as specified in DS022-1 (v2.3) Section "High-Performance Built-In Clock Management Circuitry". Each supports clock multiply/divide, 50% duty-cycle correction for DDR, and zero-delay conversion of LVPECL/LVDS inputs to any I/O standard - enabling multiple independent clock domains.

Can XCV50E-7CS144I operate with mixed I/O standards in the same bank?

No - XCV50E-7CS144I enforces strict I/O banking rules: only standards sharing the same VCCO voltage (e.g., LVTTL and PCI33_3 at 3.3 V) may coexist in one bank. Standards requiring different VCCO (e.g., LVCMOS18 at 1.8 V and SSTL2 at 2.5 V) must be assigned to separate banks, as detailed in DS022-2 Table 2.

Is XCV50E-7CS144I pin-compatible with other Virtex-E devices in the CS144 package?

Yes - XCV50E-7CS144I shares identical pinout and package dimensions with other Virtex-E devices offered in CS144 (e.g., XCV100E-7CS144I), as confirmed in DS022-1 Table 3 and Module 4 pinout documentation. However, I/O count differs: XCV50E provides 94 user I/Os, while XCV100E offers 158 - unused pins on XCV50E must be left unconnected or tied off per design requirements.