AMD XCV50E-7FG256C

Overview

XCV50E-7FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 20,736 logic cells, 176 user I/O pins in a 256-ball Fine-Pitch BGA package, and eight digital Delay-Locked Loops (DLLs). It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates 65,536 bits of true dual-port block RAM for high-speed memory interfacing in telecom infrastructure and data acquisition systems.

For engineers reviewing the XCV50E-7FG256C datasheet, pinout, applications, or equivalent options, this device serves as a production-grade, non-bitstream-compatible upgrade to Virtex with enhanced I/O voltage tolerance (3 V tolerant, 5 V tolerant with external resistor), improved DLL count and frequency multiplication, and optimized 0.18 μm 6-layer metal process for lower power and higher density.

Technical Context

The XCV50E-7FG256C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, PCI33_3, LVDS, and LVPECL-with banked VCCO and VREF management. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and up to 4× frequency multiplication, enabling precise timing control for source-synchronous interfaces.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, thermal pad optional.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV50E-7FG256C, the -6 variant trades timing margin for cost, while the XCV100E-7FG256C offers headroom for logic expansion without board redesign-making the XCV50E-7FG256C optimal for fixed-function, volume-optimized implementations where resource utilization is tightly controlled.

Availability

XCV50E-7FG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, high-speed data acquisition, and PCI-based test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCV50E-7FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic solutions for demanding communications and computing applications.

The Virtex-E product line was engineered to deliver higher speed, greater density, and lower power than prior Virtex devices-targeting next-generation telecom infrastructure, high-end instrumentation, and real-time embedded systems.

FAQ

What is the maximum operating junction temperature for XCV50E-7FG256C?

The XCV50E-7FG256C is rated for commercial temperature range (0 °C to +85 °C junction temperature). This specification is defined in the DS022-1 Production Product Specification and applies to continuous operation under specified VCCINT = 1.8 V and VCCO ≤ 3.3 V conditions with appropriate thermal management.

Does XCV50E-7FG256C support JTAG boundary scan for production testing?

Yes, XCV50E-7FG256C includes full IEEE 1149.1 boundary scan logic integrated into its IOBs. The TCK, TMS, TDI, and TDO pins are dedicated for this purpose, enabling structural testing, in-system programming, and debug visibility without requiring additional test circuitry.

Can XCV50E-7FG256C interface directly with 200 MHz DDR SDRAM?

Yes, XCV50E-7FG256C supports 200 Mb/s DDR SDRAM interfaces through its SelectRAM+™-optimized I/O and DLL-controlled clocking. The device's LVDS-capable I/O and DLL-generated 100 MHz DDR clock with 50% duty cycle meet JEDEC timing requirements for data capture and command strobing.

Is XCV50E-7FG256C pin-compatible with earlier Virtex devices?

No, XCV50E-7FG256C is not pin-compatible with original Virtex devices. While some packages share ball counts (e.g., FG256), banking rules, VCCO/VREF pin assignments, and global clock pin locations differ significantly-requiring PCB redesign for migration from Virtex to Virtex-E.

What configuration modes does XCV50E-7FG256C support?

XCV50E-7FG256C supports master serial (via external SPROM), slave serial, SelectMAP™ parallel, and JTAG configuration modes. All modes load the same bitstream format, and JTAG remains active post-configuration for debugging and partial reconfiguration.