AMD XCV50E-7FG256I

Overview

XCV50E-7FG256I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 20,736 logic cells, 176 user I/O pins in a 256-ball Fine-Pitch BGA package, and eight digital Delay-Locked Loops (DLLs) supporting 240 MHz system clocking and 622 Mb/s LVDS I/O for high-speed communications infrastructure and embedded signal processing.

For engineers reviewing the XCV50E-7FG256I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration, and industrial-grade (-40°C to +100°C) thermal performance specific to the -7 speed grade and FG256 package.

Technical Context

The XCV50E-7FG256I implements a regular array of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains and dual flip-flops per slice, enabling high-speed arithmetic and pipelined logic. Its IOBs support 20 I/O standards-including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL-with VCCO-supplied input buffers and programmable weak-keeper circuits.

It integrates 16 block SelectRAMs (65,536 bits total), each configurable as true dual-port 4096-bit RAM with independent port widths, and features eight fully digital DLLs-each capable of 4× frequency multiplication, zero-delay clock conversion, and 50% duty-cycle synthesis-for DDR interface timing control and source-synchronous data capture.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, 17 × 17 mm body size, RoHS-compliant, industrial temperature range (–40°C to +100°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV50E-6FG256I, the XCV50E-7FG256I delivers tighter timing margins for high-frequency control loops; compared with XCV100E-7FG256I, it offers identical speed and package but reduced logic and I/O-making it optimal for cost-sensitive, mid-complexity embedded systems.

Availability

XCV50E-7FG256I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging backend, and defense radar signal processing requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XCV50E-7FG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; its FPGA portfolio enables reconfigurable computing across aerospace, communications, and industrial markets.

The Virtex-E family was designed for high-performance, low-power, mixed-signal embedded systems requiring flexible I/O, deterministic clocking, and on-chip memory hierarchy-targeting applications where ASIC development cost and time are prohibitive.

FAQ

What is the maximum operating junction temperature for XCV50E-7FG256I?

The XCV50E-7FG256I is rated for industrial temperature operation with a junction temperature range of –40°C to +100°C. This specification is validated under worst-case power dissipation conditions and requires adherence to Xilinx thermal guidelines, including minimum copper pour and via-in-pad recommendations for the FG256 package.

Does XCV50E-7FG256I support JTAG boundary scan for in-circuit testing?

Yes, the XCV50E-7FG256I includes full IEEE 1149.1-compliant boundary scan logic with dedicated TCK, TMS, TDI, and TDO pins. This enables board-level interconnect testing, configuration verification, and in-system programming without requiring external test fixtures or dedicated debug probes.

How many differential I/O pairs does XCV50E-7FG256I support?

The XCV50E-7FG256I supports up to 83 differential I/O pairs, as confirmed in Table 1 of DS022-1. Each pair uses two adjacent pins within the same I/O bank and requires matching VCCO and termination; actual usable count depends on bank allocation and signal routing constraints.

Can XCV50E-7FG256I configure from a serial PROM in master mode?

Yes, the XCV50E-7FG256I supports master serial configuration using an external serial PROM. In this mode, the FPGA drives the PROM's address lines and reads configuration data through the DIN pin, completing initialization autonomously after power-up without host processor intervention.

Is XCV50E-7FG256I pin-compatible with other Virtex-E devices in the FG256 package?

Yes, the XCV50E-7FG256I shares the same FG256 pinout with other Virtex-E devices in that package, including XCV100E-7FG256I and XCV200E-7FG256I. However, I/O bank assignments, VCCO pin allocations, and unused pin states differ-requiring PCB redesign if migrating to higher-density variants.