My Inquiry
My Account
AMD XCV50E-7PQ240I
- Part No.:
- XCV50E-7PQ240I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV50E-7PQ240I.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,389
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCV50E-7PQ240I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 20,736 logic cells, 176 user I/O pins in PQ240 package, and industrial temperature range (–40°C to +100°C). It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops for clock management - used in high-speed communication interface design and embedded signal processing.
For engineers reviewing the XCV50E-7PQ240I datasheet, pinout, applications, or equivalent options, key selection criteria include its 1.8 V core voltage, PCI-compliant 3.3 V I/O, 8 DLLs, 65,536-bit block RAM, and support for source-synchronous data transmission at up to 240 MHz system clock rate.
Technical Context
The XCV50E-7PQ240I implements a regular CLB array (16 × 24) with four logic cells per CLB, each containing dual 4-input LUTs, dedicated carry chains, and configurable flip-flops/latches with independent clock enable and synchronous/asynchronous set/reset. Its IOBs support 20 I/O standards including LVTTL, SSTL, HSTL, and differential LVDS, with VCCO-supplied input buffers and banked VREF routing.
It features eight fully digital DLLs enabling zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×. The device uses a 0.18 μm 6-layer metal CMOS process, includes die-temperature sensor diode, IEEE 1149.1 boundary scan, and supports master serial, slave serial, SelectMAP™, and JTAG configuration modes.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,736 - determines maximum combinational and sequential logic capacity for RTL implementation |
| User I/O Pins | 176 - available single-ended I/Os in PQ240 package, supporting mixed-voltage banking |
| Block RAM Bits | 65,536 - organized as sixteen 4096-bit true dual-port synchronous RAM blocks |
| Internal Performance | 130 MHz (4-LUT level) - worst-case register-to-register timing for critical path synthesis |
| DLL Count | 8 - enables independent clock domain management, jitter reduction, and DDR clock synthesis |
| Core Voltage (VCCINT) | 1.8 V - reduces dynamic power vs. 2.5 V Virtex, requires dedicated low-noise regulation |
| I/O Standards | LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, BLVDS, LVPECL - enables direct interfacing to memory, processors, and SERDES without level shifters |
Pinout & Package
PQ240 is a 240-pin Plastic Quad Flatpack (PQFP) package with 0.5 mm lead pitch, JEDEC MS-026 compliant, suitable for industrial PCB assembly and thermal cycling reliability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew clock inputs routed to all DLLs and CLBs; required for synchronous system timing |
| VCCINT | Core Power Supply | 1.8 V supply for logic and RAM; must be decoupled locally to meet noise and transient current requirements |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 1.5–3.3 V supplies enabling mixed-standard I/O; each bank requires independent regulation |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference voltage for SSTL/HSTL/LVCMOS inputs; must be stable ±1% for timing compliance |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1 test access port; enables in-system programming and post-configuration verification |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and initiates reconfiguration sequence |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s) and LVPECL (300+ MHz clocks) with banked VCCO/VREF |
| SelectRAM+™ Hierarchy | 65,536-bit block RAM + 24,576-bit distributed RAM - enables on-chip FIFOs, cache, and protocol buffering |
| SelectLink™ DDR Interface | Hardened DDR link architecture - reduces routing congestion and timing closure effort for memory controllers |
| Digital DLLs | Eight independent DLLs with 4× multiplication and duty-cycle correction - eliminates external clock ICs in DDR/SDRAM designs |
| Die Temperature Sensor | On-die diode for thermal monitoring - enables dynamic thermal throttling in industrial environments |
Applications
| High-Speed Communication Interface | Industrial Motion Control |
|---|---|
Use Scenario: Implementing PCIe Gen1 endpoint logic with custom DMA engine and packet parsing in factory automation gateways. IC Role / Device Role / Timing Role: Configurable protocol bridge between microcontroller and high-speed serial PHY, managing 240 MHz source-synchronous data capture and 133 MHz internal processing. Use Value: 176 I/O pins allow parallel bus interfacing to legacy controllers while LVDS transceivers handle 622 Mb/s backplane links - eliminating need for external serializer/deserializer chips. | Use Scenario: Real-time servo loop controller in CNC machine drives requiring deterministic sub-microsecond interrupt response. IC Role / Device Role / Timing Role: Hardware-accelerated PID computation engine with 130 MHz register-to-register timing, synchronized to encoder feedback via LVDS inputs. Use Value: Eight DLLs provide phase-aligned clocks for ADC sampling, PWM generation, and encoder counting - ensuring <1 ns skew across control loops. |
| Medical Imaging Data Acquisition | Avionics Sensor Fusion Hub |
Use Scenario: High-resolution ultrasound beamformer aggregating 128-channel analog front-end data at 40 MSPS per channel. IC Role / Device Role / Timing Role: Time-critical data concentrator with distributed RAM for pipeline buffering and block RAM for FIR filter coefficient storage. Use Value: 65,536-bit block RAM configured as dual-port memory enables simultaneous write from ADC interface and read by DSP core - sustaining 1.66 Tb/s memory bandwidth. | Use Scenario: DO-254-compliant sensor fusion unit combining inertial measurement unit (IMU), GPS, and radar inputs in unmanned aerial systems. IC Role / Device Role / Timing Role: Safety-critical reconfigurable logic implementing ARINC 429 receivers, MIL-STD-1553 bus controllers, and time-stamped data merging. Use Value: Industrial temperature rating (–40°C to +100°C) and 100% factory-tested reliability ensure operation in extended environmental envelopes without derating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV50E-6PQ240I | Slower speed grade (–6 vs –7); 4.3 ns register-to-register delay vs 4.6 ns | Suitable for lower-frequency control logic where 130 MHz internal performance is not required | Select when cost sensitivity outweighs timing margin needs; same pinout and configuration interface |
| XCV100E-7PQ240I | Higher density (32,400 logic cells), same speed grade and package | Required for larger state machines or multi-channel protocols exceeding XCV50E capacity | Choose when design scalability or future feature expansion is prioritized over BOM cost |
Compared with XCV50E-7PQ240I, the –6 variant trades 7% timing margin for cost reduction, while XCV100E-7PQ240I doubles logic capacity without changing footprint - enabling seamless migration paths within the same PCB layout and thermal envelope.
Availability
XCV50E-7PQ240I is available at Aetrix Electronics and suitable for high-reliability industrial motion control, avionics sensor hubs, medical imaging acquisition, and factory automation gateways requiring stable component supply across extended product lifecycles.
Supply support for XCV50E-7PQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined platforms for high-performance computing and embedded systems.
The Virtex-E family was designed for high-speed, high-density system integration in communications infrastructure and industrial applications - delivering optimized place-and-route efficiency and aggressive 0.18 μm process advantages over prior Virtex generations.
FAQ
What is the maximum supported clock frequency for XCV50E-7PQ240I using its internal DLLs?
XCV50E-7PQ240I supports input clock frequencies up to 300+ MHz on LVPECL/LVDS inputs, with DLLs capable of 4× frequency multiplication. The device achieves synchronous system clock rates up to 240 MHz including I/O, verified under worst-case timing conditions per DS022-3 switching characteristics tables.
Does XCV50E-7PQ240I support PCI 66 MHz operation?
Yes, XCV50E-7PQ240I is PCI-compliant for both 32/64-bit, 33 MHz and 66 MHz operation at 3.3 V. Its I/O structure meets PCI specification requirements, and the –7 speed grade ensures timing closure for 66 MHz address/data strobe cycles in master and target roles.
How many differential I/O pairs does XCV50E-7PQ240I support in the PQ240 package?
XCV50E-7PQ240I supports 83 differential I/O pairs in the PQ240 package, as confirmed in Table 1 of DS022-1. This enables up to 166 pins dedicated to LVDS, BLVDS, or LVPECL signaling - critical for high-bandwidth point-to-point links.
Is XCV50E-7PQ240I pin-compatible with earlier Virtex devices?
No, XCV50E-7PQ240I is not pin-compatible with original Virtex devices. While same-package Virtex-E and Virtex parts share physical pin locations, differences in banking rules, VCCO/VREF assignment, and I/O buffer power domains require PCB redesign. Migration must follow Xilinx's Virtex-E pinout tables, not legacy Virtex layouts.
What configuration modes are supported by XCV50E-7PQ240I?
XCV50E-7PQ240I supports master serial (via external SPROM), slave serial, SelectMAP™ parallel, and IEEE 1149.1 JTAG configuration modes. All modes load SRAM-based configuration bitstream; JTAG is used for boundary scan testing and in-system programming without requiring external PROM.
XCV50E-7PQ240I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 65536
- Number of I/O:
- 158
- Number of Gates:
- 71693
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV50E-7PQ240I FAQ
1.How can I place an order for XCV50E-7PQ240I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV50E-7PQ240I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV50E-7PQ240I reliable?
The price and inventory of XCV50E-7PQ240I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50E-7PQ240I is usually 5 days.
3.What payment methods are accepted for XCV50E-7PQ240I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50E-7PQ240I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV50E-7PQ240I?
XCV50E-7PQ240I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV50E-7PQ240I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV50E-7PQ240I?
For technical support, including XCV50E-7PQ240I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50E-7PQ240I requirements.
6.How does Aetrix verify that XCV50E-7PQ240I is sourced from the original manufacturer or authorized distributors?
All XCV50E-7PQ240I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50E-7PQ240I meets industry standards.
7.What is the process for return or replacement of XCV50E-7PQ240I?
All XCV50E-7PQ240I units undergo pre-shipment inspection (PSI). If there is an issue with XCV50E-7PQ240I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV50E-7PQ240I part is unused and in its original packaging.
Return procedure for XCV50E-7PQ240I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV50E-7PQ240I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
