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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV50E-8CS144C

Name: XCV50E-8CS144C
Brand: AMD
SKU: XCV50E-8CS144C
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV50E-8CS144C

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 144-TFBGA, CSPBGA

Datasheet:: XCV50E-8CS144C.pdf

Description:: IC FPGA 94 I/O 144CSBGA

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Product details

Overview

XCV50E-8CS144C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 20,736 logic cells, 16 × 24 CLB array, and 94 user I/O pins in a 144-pin CSOP (Chip-Scale Package). It features eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates 65,536 bits of block RAM and 24,576 bits of distributed RAM. It is used in high-speed communication interface design and embedded signal processing systems requiring reconfigurable logic with PCI-compliant 3.3 V I/O.

For engineers reviewing the XCV50E-8CS144C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, speed-grade–specific timing (–8 grade), package-mapped I/O banking rules, and real-world FPGA implementation constraints - including VCCO/VREF bank partitioning, DLL clock domain control, and SelectI/O+ standard compatibility for LVTTL, SSTL, HSTL, and differential signaling.

Technical Context

The XCV50E-8CS144C implements a regular array architecture with Configurable Logic Blocks (CLBs) containing four logic cells each, dual-slice organization, dedicated carry chains for arithmetic, and F5/F6 multiplexers enabling 5- and 6-input logic functions. Each CLB includes two 3-state BUFTs and local routing via VersaBlock™.

Its I/O subsystem uses SelectI/O+™ technology with per-bank VCCO and VREF supply domains; input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO (not VCCINT); all IOBs support IEEE 1149.1 boundary scan and include programmable delay, weak keeper, and independent polarity controls for inputs/outputs.

Key Specifications

Parameter	Value and Actual Design Meaning
Logic Cells	20,736 - defines maximum combinational and sequential logic capacity for synthesis and place-and-route.
User I/O Pins	94 - confirmed maximum usable I/O count for CS144 package; excludes dedicated clock pins and power/ground.
Block RAM Bits	65,536 - organized as sixteen 4096-bit true dual-port synchronous RAM blocks for independent read/write access.
Distributed RAM Bits	24,576 - implemented in LUTs across CLBs; supports 16×1, 16×2, or 32×1 synchronous RAM configurations.
Speed Grade	-8 - guarantees worst-case internal register-to-register delay ≤ 4.3 ns and address decoder delay ≤ 3.8 ns at 240 MHz system clock.
DLL Count	8 - fully digital delay-locked loops for zero-delay clock distribution, duty-cycle correction, and frequency multiplication/division.
I/O Standards	LVTTL, LVCMOS2, SSTL3/I-II, HSTL I/III/IV, LVDS, BLVDS, LVPECL - supported with per-bank VCCO/VREF constraints.

Pinout & Package

The XCV50E-8CS144C uses a 144-pin Chip-Scale Package (CSOP) with 0.8 mm pitch, 12 × 12 array, and thermal pad. I/O banks are assigned per edge: Bank 0 (top), Bank 1 (right), Bank 2 (bottom), Bank 3 (left), each with dedicated VCCO and optional VREF pins.

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Dedicated low-skew clock inputs routed to all DLLs; require external termination and VCCO-compatible signaling.
VCCO_0–VCCO_3	I/O Bank Power Supply	Separate 1.5–3.3 V supplies per bank; determines compatible output standards (e.g., VCCO=3.3 V enables LVTTL/PCI).
VREF_0–VREF_3	Input Threshold Reference	Required for SSTL/HSTL/GTL standards; must be stable and shared across all pins in same bank.
IO_Lxx	Configurable I/O Pad	Supports bidirectional single-ended or differential signaling; direction controlled by OCE/TS signals in IOB.
VCCINT	Core Logic Supply	1.8 V ± 3% required for CLBs, RAM, and DLLs; decoupling critical for jitter-sensitive clock paths.
TCK/TMS/TDI/TDO	JTAG Boundary Scan	IEEE 1149.1 compliant test interface; enables in-system configuration and post-configuration verification.

Key Features

Feature	Design Value
Eight Digital DLLs	Enables precise clock deskew, 50% duty cycle synthesis for DDR interfaces, and 4× frequency multiplication without external PLL.
SelectI/O+™ Banking	Allows mixed-voltage I/O on single device: e.g., 3.3 V LVTTL outputs and 1.5 V HSTL inputs coexist when isolated in separate banks.
True Dual-Port Block RAM	Permits simultaneous read and write to same memory block at independent addresses - essential for FIFOs and ping-pong buffering.
SRAM-Based In-System Reconfiguration	Supports dynamic partial reconfiguration via SelectMAP or JTAG; no external PROM required for development.
Die-Temperature Sensor Diode	On-die diode enables real-time thermal monitoring via external ADC; critical for thermal-aware clock scaling in industrial environments.

Applications

High-Speed Serial Interface Bridge	PCI Bus Accelerator
Use Scenario: Bridging between legacy parallel bus (e.g., PCI) and modern serial protocols (e.g., SATA or PCIe root complex) in telecom line cards. IC Role / Device Role / Timing Role: XCV50E-8CS144C acts as protocol translator and timing adapter, using DLLs to align PCI clock domains with source-synchronous SerDes clocks. Use Value: Achieves 622 Mb/s LVDS link throughput while maintaining PCI 33/66 MHz compliance - eliminating need for discrete clock buffers or level shifters.	Use Scenario: Offloading packet classification, header parsing, and DMA arbitration from host CPU in network interface controllers. IC Role / Device Role / Timing Role: XCV50E-8CS144C serves as PCI target endpoint with custom register map, handling burst-mode data transfers and interrupt generation. Use Value: Delivers sub-5 ns register-to-register timing for address decode and parity tree logic - meeting PCI timing closure requirements without gate-count penalty.
Industrial Motion Control Encoder Interface	Medical Imaging Data Aggregator
Use Scenario: Real-time capture and preprocessing of quadrature encoder signals from servo motors in CNC machines. IC Role / Device Role / Timing Role: XCV50E-8CS144C implements high-speed counter logic with asynchronous reset, using dedicated carry chains for 32-bit position accumulation. Use Value: Sustains >200 MHz internal counting rate with deterministic latency - enabling 100 ns resolution for closed-loop feedback control loops.	Use Scenario: Consolidating parallel ADC streams (e.g., from ultrasound transducer arrays) into a unified DDR SDRAM buffer before DSP processing. IC Role / Device Role / Timing Role: XCV50E-8CS144C manages 200 Mb/s DDR SDRAM interface using block RAM for pipeline staging and DLL-synchronized write clocks. Use Value: Provides 1.66 Tb/s aggregate memory bandwidth via distributed + block RAM hierarchy - sustaining 8-channel 40 MSPS ADC aggregation without frame loss.

High-Speed Serial Interface Bridge

PCI Bus Accelerator

Use Scenario: Bridging between legacy parallel bus (e.g., PCI) and modern serial protocols (e.g., SATA or PCIe root complex) in telecom line cards.

IC Role / Device Role / Timing Role: XCV50E-8CS144C acts as protocol translator and timing adapter, using DLLs to align PCI clock domains with source-synchronous SerDes clocks.

Use Value: Achieves 622 Mb/s LVDS link throughput while maintaining PCI 33/66 MHz compliance - eliminating need for discrete clock buffers or level shifters.

Use Scenario: Offloading packet classification, header parsing, and DMA arbitration from host CPU in network interface controllers.

IC Role / Device Role / Timing Role: XCV50E-8CS144C serves as PCI target endpoint with custom register map, handling burst-mode data transfers and interrupt generation.

Use Value: Delivers sub-5 ns register-to-register timing for address decode and parity tree logic - meeting PCI timing closure requirements without gate-count penalty.

Industrial Motion Control Encoder Interface

Medical Imaging Data Aggregator

Use Scenario: Real-time capture and preprocessing of quadrature encoder signals from servo motors in CNC machines.

IC Role / Device Role / Timing Role: XCV50E-8CS144C implements high-speed counter logic with asynchronous reset, using dedicated carry chains for 32-bit position accumulation.

Use Value: Sustains >200 MHz internal counting rate with deterministic latency - enabling 100 ns resolution for closed-loop feedback control loops.

Use Scenario: Consolidating parallel ADC streams (e.g., from ultrasound transducer arrays) into a unified DDR SDRAM buffer before DSP processing.

IC Role / Device Role / Timing Role: XCV50E-8CS144C manages 200 Mb/s DDR SDRAM interface using block RAM for pipeline staging and DLL-synchronized write clocks.

Use Value: Provides 1.66 Tb/s aggregate memory bandwidth via distributed + block RAM hierarchy - sustaining 8-channel 40 MSPS ADC aggregation without frame loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV50E-7CS144C	Slower speed grade (–7): 4.6 ns register-to-register delay vs. 4.3 ns for –8; identical logic density, I/O count, and package.	Suitable for non-critical timing paths where 240 MHz system clock is not required; lower static/dynamic power at same VCCINT.	Select when design meets timing with margin and thermal/power budget is constrained.
XCV100E-8CS144C	Higher density: 32,400 logic cells (+56%), same –8 speed grade, identical CS144 package and pinout.	Enables larger state machines or multi-channel implementations without PCB redesign; requires updated bitstream and toolchain license.	Choose when future scalability or additional logic resources are needed within same footprint.

Compared with XCV50E-8CS144C, the –7 variant trades 7% timing margin for reduced power, while the XCV100E-8CS144C offers direct pin-compatible upgrade path with 56% more logic cells - both retain identical I/O banking structure, DLL count, and memory architecture.

Availability

XCV50E-8CS144C is available at Aetrix Electronics and suitable for high-reliability industrial motion control, medical imaging data aggregation, and telecom serial interface bridge applications requiring stable component supply and long-term obsolescence management.

Supply support for XCV50E-8CS144C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance reconfigurable computing in communications infrastructure and industrial systems - emphasizing speed, I/O flexibility, and embedded memory hierarchy over cost-optimized logic density.

FAQ

What is the maximum operating junction temperature for XCV50E-8CS144C?

The XCV50E-8CS144C is rated for commercial temperature range (0 °C to +85 °C junction). Its on-die temperature sensor diode enables real-time thermal monitoring, but sustained operation above +85 °C requires derating per DS022-3 DC characteristics and may violate warranty conditions. Thermal design must ensure VCCINT stability under worst-case ambient and power dissipation.

Does XCV50E-8CS144C support partial reconfiguration?

Yes, XCV50E-8CS144C supports partial reconfiguration via SelectMAP and JTAG interfaces, enabled by its SRAM-based configuration architecture. However, official Xilinx Foundation and Alliance Series tools for the Virtex-E generation do not provide automated partial reconfiguration flow - manual bitstream editing and frame-level verification are required per XAPP151 guidelines.

Can XCV50E-8CS144C drive 5 V tolerant loads directly?

No, XCV50E-8CS144C I/O pins are not 5 V tolerant by default. They support 3.3 V LVTTL/PCI and 2.5 V LVCMOS2 standards, but 5 V operation requires external 100 Ω series resistors per I/O pin as specified in DS022-1 Section "I/O Pin Voltage Tolerance". Direct 5 V connection risks permanent damage to the IOB circuitry.

How many DLLs are available in XCV50E-8CS144C and what are their primary functions?

XCV50E-8CS144C contains eight fully digital Delay-Locked Loops (DLLs). Their primary functions include zero-delay clock distribution across the die, 50% duty cycle synthesis for DDR applications, clock frequency multiplication (up to 4×), and conversion of high-speed LVPECL/LVDS inputs to any supported I/O standard without external clock conditioning.

Is XCV50E-8CS144C pin-compatible with other Virtex-E devices in the CS144 package?

Yes, all Virtex-E devices offered in the CS144 package - including XCV50E, XCV100E, and XCV200E variants - share identical pinouts and mechanical footprint. This allows hardware reuse across density upgrades, though I/O banking constraints and VCCO/VREF assignments must be validated per device-specific pin tables in DS022-4.

XCV50E-8CS144C Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®-E

Package/Case:: 144-TFBGA, CSPBGA

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 384

Number of Logic Elements/Cells:: 1728

Total RAM Bits:: 65536

Number of I/O:: 94

Number of Gates:: 71693

Voltage - Supply:: 1.71V ~ 1.89V

Mounting Type:: Surface Mount

Operating Temperature:: 0°C ~ 85°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 144-LCSBGA (12x12)

XCV50E-8CS144C FAQ

1.How can I place an order for XCV50E-8CS144C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV50E-8CS144C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV50E-8CS144C reliable?

The price and inventory of XCV50E-8CS144C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50E-8CS144C is usually 5 days.

3.What payment methods are accepted for XCV50E-8CS144C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50E-8CS144C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV50E-8CS144C?

XCV50E-8CS144C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV50E-8CS144C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV50E-8CS144C?

For technical support, including XCV50E-8CS144C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50E-8CS144C requirements.

6.How does Aetrix verify that XCV50E-8CS144C is sourced from the original manufacturer or authorized distributors?

All XCV50E-8CS144C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50E-8CS144C meets industry standards.

7.What is the process for return or replacement of XCV50E-8CS144C?

All XCV50E-8CS144C units undergo pre-shipment inspection (PSI). If there is an issue with XCV50E-8CS144C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV50E-8CS144C part is unused and in its original packaging.

Return procedure for XCV50E-8CS144C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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