AMD XCV50E-8FG256C

Overview

XCV50E-8FG256C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 20,736 logic cells, 176 user I/O pins in a 256-ball Fine-Pitch BGA package, and eight digital Delay-Locked Loops (DLLs). It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates 65,536 bits of true dual-port block RAM for high-speed memory interfacing in telecom line cards.

For engineers reviewing the XCV50E-8FG256C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, SelectRAM+ configuration options, and validated alternative FPGAs for migration paths in legacy Virtex-E system designs.

Technical Context

The XCV50E-8FG256C implements a regular array architecture with configurable logic blocks (CLBs) containing four 4-input LUTs per slice, dedicated carry chains for arithmetic, and two BUFTs per CLB for internal bus driving. Each CLB supports synchronous/asynchronous set/reset and clock enable on all storage elements.

Its I/O subsystem uses SelectI/O+™ technology with eight independent I/O banks, each requiring shared VCCO and optionally shared VREF; input buffers for LVTTL/LVCMOS2/PCI are powered by VCCO (not VCCINT), and LVDS/LVPECL inputs support 300+ MHz clock reception. The device includes a die-temperature sensor diode and IEEE 1149.1 boundary-scan logic.

Key Specifications

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FG256), 1.0 mm pitch, RoHS-compliant, thermal pad optional. Dimensions: 17 mm × 17 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.

Compared with XCV50E-8FG256C, the -7 variant trades speed for broader temperature margin in industrial environments, while the XCV100E-8FG256C offers headroom for logic growth without changing package-but demands additional PCB routing resources and power delivery capacity.

Availability

XCV50E-8FG256C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging subsystems, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XCV50E-8FG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance programmable logic solutions for demanding communication and computing applications.

The Virtex-E product line was engineered for 0.18 µm process efficiency, targeting high-speed I/O (622 Mb/s LVDS), low-power 1.8 V core operation, and seamless migration from Virtex devices-without bitstream compatibility but with pin-compatible packaging options.

FAQ

Is XCV50E-8FG256C pin-compatible with other Virtex-E devices in the FG256 package?

Yes, XCV50E-8FG256C shares the same FG256 ball map with XCV100E-8FG256C and XCV200E-8FG256C, including identical GCLK, VCCINT, and JTAG pin locations. However, unused pins differ: XCV50E has 176 user I/O versus 196 in XCV100E, so PCBs designed for XCV50E-8FG256C can accept larger Virtex-E devices without layout change, but not vice versa.

What I/O standards does XCV50E-8FG256C support with its 176 user I/O pins?

XCV50E-8FG256C supports 20 I/O standards via SelectI/O+™, including LVTTL, LVCMOS2, LVCMOS18, SSTL3/I-II, HSTL I/III/IV, PCI33_3/66_3, LVDS, BLVDS, and LVPECL. All 176 pins are individually configurable, but I/O banking rules apply: each of the eight banks requires uniform VCCO, and VREF-dependent standards (e.g., SSTL3) must share one VREF per bank.

Does XCV50E-8FG256C require external configuration memory?

Yes, XCV50E-8FG256C is SRAM-based and requires external non-volatile memory for configuration. It supports master serial mode (via Xilinx XC18V00 series PROMs), SelectMAP™ parallel mode (for fast reconfiguration), and JTAG boundary-scan mode (for debugging and programming). No internal flash is present.

Can XCV50E-8FG256C interface directly with 200 MHz DDR SDRAM?

Yes, XCV50E-8FG256C supports 200 Mb/s DDR SDRAM through its SelectRAM+™ hierarchy and DLL-controlled clocking. Its eight DLLs enable precise 90° phase-shifted strobes for DQS capture, and the 176 I/O pins accommodate 16-bit data + address/control lines. External termination and careful PCB layout (length-matched traces) are mandatory for signal integrity.

What is the role of the die-temperature sensor diode in XCV50E-8FG256C?

The die-temperature sensor diode in XCV50E-8FG256C provides analog voltage output proportional to junction temperature, calibrated per DS022-3. It enables real-time thermal monitoring in sealed enclosures; engineers use it with external ADCs to trigger fan control or throttle logic clocks before thermal shutdown thresholds are reached.