AMD XCV50E-8PQ240C
- Part No.:
- XCV50E-8PQ240C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 240-BFQFP
- Datasheet:
-
XCV50E-8PQ240C.pdf
- Description:
- IC FPGA 158 I/O 240QFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,910
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCV50E-8PQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 20,736 logic cells, 176 user I/O pins in PQ240 package, and eight digital Delay-Locked Loops (DLLs). It delivers 130 MHz internal performance (four LUT levels), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and targets high-speed communication and embedded control applications requiring reconfigurable logic.
For engineers reviewing the XCV50E-8PQ240C datasheet, pinout, applications, or equivalent options, key selection criteria include its -8 speed grade (guaranteed 133 MHz system clock), 1.8 V core voltage, PCI-compliant 3.3 V I/O, and support for true dual-port block RAM at 250 MHz - critical for protocol bridging, video processing pipelines, and real-time signal conditioning.
Technical Context
The XCV50E-8PQ240C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.
Its IOBs support 20 interface standards including LVTTL, LVCMOS2, SSTL3, HSTL, and differential LVDS/LVPECL, with banked VCCO and VREF constraints. Eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication - enabling precise timing control across mixed-voltage I/O domains and high-speed source-synchronous interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 20,736 - defines maximum combinational and sequential logic capacity for complex state machines or datapaths |
| System Gates | 71,693 - industry-standard metric estimating equivalent ASIC gate count for logic density comparison |
| User I/O Pins | 176 - total single-ended I/Os available in PQ240 package; supports up to 83 differential I/O pairs |
| Block RAM | 65,536 bits (16 × 4096-bit blocks) - synchronous true dual-port memory for FIFOs, buffering, or lookup tables |
| DLL Count | 8 - enables independent clock domain management, jitter reduction, and phase alignment for multiple high-speed interfaces |
| Speed Grade | -8 - guarantees worst-case register-to-register delay ≤ 4.3 ns and 133 MHz system clock operation |
| VCCINT | 1.8 V - core supply voltage enabling lower dynamic power vs. 2.5 V Virtex family; requires dedicated low-noise regulation |
| I/O Voltage Support | 3.3 V tolerant (LVTTL/PCI), 2.5 V (SSTL2/HSTL), 1.8 V (LVCMOS18), and differential LVDS/LVPECL - enables direct interfacing to diverse memory and bus standards |
Pinout & Package
PQ240 refers to a 240-pin Plastic Quad Flat Package (PQFP) with 0.5 mm pitch, 32.5 mm × 32.5 mm body size, and exposed thermal pad. Pin assignment follows Xilinx's standardized Virtex-E PQ240 pinout layout with dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, DONE), JTAG boundary-scan (TCK/TMS/TDI/TDO), and banked VCCO/VREF pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Inputs | Low-skew dedicated clock routing paths into DLLs; required for synchronous system timing integrity |
| IO_LxxN/IO_LxxP | Differential I/O Pairs | LVDS/LVPECL-capable pins supporting 622 Mb/s source-synchronous data capture |
| VCCO_0–VCCO_7 | I/O Bank Power Supplies | Independent 3.3 V / 2.5 V / 1.8 V supplies per I/O bank; mixing standards within bank requires matching VCCO |
| VREF_0–VREF_7 | Input Threshold Reference | Required for SSTL/HSTL/GTL input standards; one shared VREF per bank constrains mixed-standard placement |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for programming, debugging, and production verification |
| PROGRAM_B/DONE/INIT_B | Configuration Control | Active-low signals managing master serial SPROM loading, configuration status, and initialization reset |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards (LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, LVPECL) with banked VCCO/VREF - enables mixed-voltage board design without level shifters |
| SelectRAM+™ Memory Hierarchy | 65,536-bit block RAM + 24,576-bit distributed RAM - provides true dual-port, variable-width memory for real-time buffering and protocol translation |
| SelectLink™ DDR Interface | Double Data Rate link between FPGA fabric and external memory controllers - enables 200 Mb/s DDR SDRAM interfacing with minimal logic overhead |
| Digital DLL Clock Management | Eight fully digital DLLs with 4× multiplication, duty-cycle correction, and zero-delay LVPECL/LVDS clock conversion - eliminates external clock synthesizers for multi-domain systems |
| SRAM-Based Configuration | Unlimited in-system reprogramming via JTAG or SelectMAP™ - supports field-upgradable logic, partial reconfiguration, and secure bitstream encryption |
| Die Temperature Sensor | On-die diode for thermal monitoring - enables closed-loop thermal management in high-density embedded systems |
Applications
| High-Speed Protocol Bridging | Real-Time Video Processing |
|---|---|
Use Scenario: Converting between Gigabit Ethernet MAC and PCI-X host interface in network appliances. IC Role / Device Role / Timing Role: FPGA acts as glue logic and packet buffer controller; DLLs synchronize 125 MHz GMII with 66 MHz PCI-X clock domains. Use Value: 176 I/Os accommodate full 32-bit PCI-X bus plus GMII signals; 65,536-bit block RAM stores 2 KB packet buffers with true dual-port access for concurrent read/write. | Use Scenario: Implementing color space conversion (YUV to RGB) and scaling for HD video streams in broadcast encoders. IC Role / Device Role / Timing Role: Configurable datapath processes pixel data at 74.25 MHz (1080i); LVDS I/O transmits serialized video to panel drivers. Use Value: 622 Mb/s LVDS output supports 10-bit pixel serialization; distributed RAM provides line buffers for horizontal filtering without external memory latency. |
| Industrial Motion Control | Test Equipment Signal Generation |
Use Scenario: Closed-loop servo motor control with encoder feedback and PWM generation in CNC machinery. IC Role / Device Role / Timing Role: FPGA implements PID algorithm, quadrature decoder, and 100 kHz PWM modulator; DLL ensures deterministic interrupt latency. Use Value: Dedicated carry logic accelerates arithmetic; 20,736 logic cells host multiple parallel control loops; 1.8 V core reduces thermal load in sealed enclosures. | Use Scenario: Generating multi-channel arbitrary waveforms (AWG) with synchronized triggers in automated test systems. IC Role / Device Role / Timing Role: FPGA serves as waveform sequencer and DAC controller; LVPECL clock inputs drive 300+ MHz sampling clocks. Use Value: Eight DLLs generate phase-aligned clocks for four 16-bit DACs; true dual-port RAM stores waveform segments for seamless looping and modulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV50E-7PQ240C | Slower -7 speed grade (4.6 ns register-to-register delay vs. 4.3 ns); same logic cells, I/O count, and features | Suitable for designs with relaxed timing closure; lower cost where 133 MHz system clock is not required | Select when budget constraints outweigh marginal timing margin needs; no PCB changes required |
| XCV100E-8PQ240C | Higher density (32,400 logic cells, 196 I/O), same -8 speed grade and PQ240 package footprint | Enables larger designs (e.g., multi-protocol SoC) without changing board layout; requires updated bitstream and timing constraints | Choose for future-proofing or incremental design expansion; identical pinout allows drop-in replacement |
Compared with XCV50E-8PQ240C, the -7 variant trades 7% timing margin for cost savings, while the XCV100E-8PQ240C doubles logic capacity within the same PQ240 footprint - making it ideal for scalable architectures where I/O count and package compatibility are preserved.
Availability
XCV50E-8PQ240C is available at Aetrix Electronics and suitable for high-reliability industrial control, communications infrastructure, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XCV50E-8PQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic solutions for demanding compute and connectivity applications.
The Virtex-E product line was engineered for 1.8 V operation and enhanced I/O flexibility, targeting applications needing PCI compliance, differential signaling, and integrated memory - such as telecom line cards and military avionics.
FAQ
What is the maximum guaranteed system clock frequency for XCV50E-8PQ240C?
The XCV50E-8PQ240C speed grade -8 guarantees a maximum synchronous system clock frequency of 133 MHz under worst-case timing conditions, validated by its 4.3 ns register-to-register delay specification. This applies to internal logic paths; actual achievable frequency depends on design complexity, placement, and routing. The device supports higher I/O rates (e.g., 622 Mb/s LVDS) using source-synchronous techniques independent of the system clock.
Does XCV50E-8PQ240C support true dual-port block RAM?
Yes, XCV50E-8PQ240C includes 16 block RAM units totaling 65,536 bits, each configured as true dual-port synchronous RAM with independent read/write addresses, enables, and clocks per port. This allows concurrent access for applications like FIFOs, frame buffers, or lookup tables without arbitration logic - a key differentiator from single-port or pseudo-dual-port alternatives.
Can XCV50E-8PQ240C interface directly with 3.3 V PCI buses?
Yes, XCV50E-8PQ240C is fully compliant with 3.3 V PCI specifications for both 33 MHz and 66 MHz operation. Its I/O buffers support LVTTL and PCI signaling standards at 3.3 V, with 10 mA drive strength and fast slew rate control. No external level shifters are needed, though proper termination and noise suppression per PCI spec must be implemented on the PCB.
How many differential I/O pairs does XCV50E-8PQ240C support?
XCV50E-8PQ240C supports up to 83 differential I/O pairs in the PQ240 package, corresponding to 166 pins used for LVDS, BLVDS, or LVPECL signaling. These are allocated across I/O banks with shared VCCO and VREF constraints; actual usable count depends on bank partitioning and voltage assignments per design requirements.
Is XCV50E-8PQ240C pin-compatible with other Virtex-E devices in PQ240 package?
Yes, XCV50E-8PQ240C shares identical pinout with XCV100E-8PQ240C and XCV200E-8PQ240C in the PQ240 package, as confirmed in Xilinx DS022-4 (Pinout Tables). All three devices use the same 240-pin mapping, enabling hardware reuse across density tiers - though higher-density variants may leave some pins as no-connect or require updated I/O banking constraints.
XCV50E-8PQ240C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 240-BFQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 384
- Number of Logic Elements/Cells:
- 1728
- Total RAM Bits:
- 65536
- Number of I/O:
- 158
- Number of Gates:
- 71693
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 240-PQFP (32x32)
XCV50E-8PQ240C FAQ
1.How can I place an order for XCV50E-8PQ240C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV50E-8PQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV50E-8PQ240C reliable?
The price and inventory of XCV50E-8PQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV50E-8PQ240C is usually 5 days.
3.What payment methods are accepted for XCV50E-8PQ240C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV50E-8PQ240C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV50E-8PQ240C?
XCV50E-8PQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV50E-8PQ240C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV50E-8PQ240C?
For technical support, including XCV50E-8PQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV50E-8PQ240C requirements.
6.How does Aetrix verify that XCV50E-8PQ240C is sourced from the original manufacturer or authorized distributors?
All XCV50E-8PQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV50E-8PQ240C meets industry standards.
7.What is the process for return or replacement of XCV50E-8PQ240C?
All XCV50E-8PQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV50E-8PQ240C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV50E-8PQ240C part is unused and in its original packaging.
Return procedure for XCV50E-8PQ240C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV50E-8PQ240C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
