AMD XCV600-4BG432I

Overview

XCV600-4BG432I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304-bit block RAM and LUT-based RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV600-4BG432I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV600-4BG432I implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaBlock-local interconnect, and VersaRing I/O ring for pin-locking. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and configurable storage elements supporting synchronous/asynchronous set/reset.

It integrates 24 × 4,096-bit dual-ported block RAMs (98,304 total bits), each configurable for independent port widths (1–16 bits) and depths (4096–256), plus LUTs usable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register. Four DLLs provide clock deskew across four global low-skew clock nets and 24 secondary local nets.

Key Specifications

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 35 mm × 35 mm, 1.27 mm pitch, industrial temperature range (–40°C to +100°C). Pinout conforms to DS003-4 (v4.0) Module 4 - Pinout Tables, with eight I/O banks (Bank 0–7), dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG boundary-scan pins (TCK, TMS, TDI, TDO), and bank-specific VCCO/VREF supply pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV600-4BG432I, the -5 variant improves timing margin for high-frequency control paths, while the XCV800-4BG432I offers headroom for logic growth - both preserve identical I/O voltage planning, DLL usage, and configuration methodology.

Availability

XCV600-4BG432I is available at Aetrix Electronics and suitable for industrial control, telecom line card, high-speed data acquisition, and reconfigurable protocol processing applications requiring stable component supply and long-term lifecycle support.

Supply support for XCV600-4BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design toolchains widely adopted in aerospace, defense, and communications.

The Virtex family, including XCV600-4BG432I, was engineered for high-performance system-level integration - delivering ASIC-like density and speed with field-upgradable flexibility for demanding embedded and infrastructure applications.

FAQ

What is the maximum operating frequency supported by the XCV600-4BG432I?

The XCV600-4BG432I supports synchronous system clock rates up to 200 MHz, including I/O timing. This is achieved using its four DLLs for clock deskew and its optimized routing hierarchy. Worst-case register-to-register delay is specified at 5.0 ns for speed grade -4, consistent with Table 2 in DS003-1 (v4.0). Actual achievable frequency depends on design placement, routing, and clock domain structure.

Does the XCV600-4BG432I support hot-swap functionality for Compact PCI systems?

Yes, the XCV600-4BG432I is explicitly designed to meet Compact PCI hot-swap requirements, as confirmed in DS003-1 (v4.0) Module 1. Its I/O architecture supports live insertion/removal sequencing, and its configuration circuitry (including INIT and PROGRAM pins) handles power-rail ramping and state retention during hot-swap events without corruption.

How many block RAMs does the XCV600-4BG432I contain, and what are their configurations?

The XCV600-4BG432I contains 24 block SelectRAM units, totaling 98,304 bits. Each block is a fully synchronous dual-ported 4,096-bit RAM with independent address and data buses per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible FIFO depth/width trade-offs and on-chip buffering without external memory.

Can the XCV600-4BG432I interface directly with DDR SDRAM using SSTL2 standards?

Yes, the XCV600-4BG432I supports SSTL2 Class I and II standards per Table 1 in DS003-2 (v4.0), with VCCO = 2.5 V and VREF = 1.25 V. Its I/O banking architecture allows grouping DDR DQ/DQS lines in a single bank, ensuring matched VCCO/VREF and minimizing signal integrity risk. Timing closure requires adherence to bank-specific slew rate and drive strength settings.

Is the XCV600-4BG432I still in active production, or is it obsolete?

The XCV600-4BG432I is marked as obsolete/under obsolescence per DS003-1 (v4.0) Revision History (March 2013) and Xilinx Notice XCN10016. However, Aetrix Electronics maintains legacy inventory with full traceability and supports lifecycle management, including cross-reference guidance and migration paths to newer Virtex families or AMD/Xilinx alternatives.