My Inquiry
My Account
AMD XCV600-4BG560C
- Part No.:
- XCV600-4BG560C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 560-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV600-4BG560C.pdf
- Description:
- IC FPGA 404 I/O 560MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,366
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XCV600-4BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.
For engineers reviewing the XCV600-4BG560C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).
Technical Context
The XCV600-4BG560C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaRing I/O ring, and dedicated horizontal bus lines per CLB row. Its CLBs contain four logic cells each, with dual-slice structure supporting 4-input LUTs, carry chains, F5/F6 multiplexers for 5–19 input functions, and configurable storage elements with synchronous/asynchronous set/reset.
I/O functionality is organized into eight banks, each requiring shared VCCO and (where applicable) single VREF voltage. Supported SelectIO standards include LVTTL, LVCMOS2, PCI 3.3 V, HSTL Class I/III/IV, SSTL3/SSTL2, GTL/GTL+, and CTT - with 5 V tolerance only on LVTTL, LVCMOS2, and PCI 5 V inputs. Output drivers support up to 24 mA source / 48 mA sink with programmable slew and drive strength.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 661,111 - defines logic capacity for complex digital systems including protocol engines and DSP pipelines |
| Logic Cells | 15,552 - provides granular, place-and-route efficient resources for synchronous state machines and arithmetic units |
| User I/O Pins | 512 - enables high-pin-count interfaces such as DDR memory controllers, multi-lane serial bridges, and parallel bus expansion |
| Block RAM | 98,304 bits (24 × 4096-bit dual-port blocks) - supports independent read/write ports with configurable depth/width for FIFOs and frame buffers |
| CLB Array | 48 × 72 - determines physical layout density and influences critical path length for timing closure |
| Speed Grade | -4 - specifies worst-case internal timing performance (e.g., register-to-register delay ≤ 5.4 ns at 200 MHz system clock) |
| Supply Voltage | 2.5 V core (VCCINT), 3.3 V/2.5 V/1.5 V I/O (VCCO) - requires separate power domains and sequencing for reliable configuration and operation |
Pinout & Package
The XCV600-4BG560C uses a 560-ball fine-pitch Ball Grid Array (FBGA) package with 35 × 35 ball array, 1.0 mm pitch, and thermal pad. Pinout follows Xilinx DS003-4 (v4.0) Module 4, with eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), dedicated JTAG pins (TCK/TMS/TDI/TDO), and dual-purpose configuration pins (INIT, PROGRAM, CCLK, DIN, DONE).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Low-skew primary clock distribution network inputs feeding four DLLs; essential for synchronous domain partitioning |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port enabling in-system programming and structural verification |
| INIT | Configuration Status | Open-drain output indicating configuration failure or successful completion; used for system reset coordination |
| PROGRAM | Configuration Reset | Active-low asynchronous signal forcing reinitialization of configuration memory and resetting all CLBs/IOBs |
| CCLK | Configuration Clock | Input-driven clock for master serial PROM mode; also used as output during slave serial or SelectMAP configuration |
| DIN/DONE | Data In / Configuration Done | DIN accepts serial bitstream; DONE signals completion and releases I/O pins from high-impedance state |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero hold-time I/O paths and phase-aligned clock domain crossing between external memory and internal logic |
| Configurable LUT RAM | Each 4-LUT can operate as 16×1-bit synchronous RAM, 16×2-bit or 32×1-bit RAM, or 16-bit shift register - ideal for pipeline registers and burst capture |
| Dual-Port Block RAM | 24 independent 4096-bit blocks with fully asynchronous read/write ports and programmable aspect ratios (1×4096 to 16×256) - supports simultaneous data ingestion and processing |
| I/O Banking | Eight isolated voltage domains allow mixed-signaling standards (e.g., HSTL + LVTTL) on same device if assigned to separate banks |
| Carry Chain Logic | Dedicated two-bit-per-CLB carry chain enables high-speed arithmetic (e.g., 32-bit adders in <8 ns) without consuming LUT resources |
Applications
| High-Speed Communications Interface | PCI Bus Controller |
|---|---|
Use Scenario: Implementing a 66-MHz PCI-X compliant bridge between legacy PCI peripherals and modern FPGA-based processing subsystems. IC Role / Device Role / Timing Role: XCV600-4BG560C serves as the protocol translation and timing management unit, handling address/data multiplexing, arbitration, and setup/hold timing compensation via DLLs. Use Value: Enables direct integration of PCI-compliant peripherals without external glue logic, reducing BOM count and PCB area while maintaining full 66-MHz throughput. | Use Scenario: Building a custom PCI host controller for industrial motion control systems requiring deterministic real-time response and local DMA engine. IC Role / Device Role / Timing Role: XCV600-4BG560C implements the PCI transaction layer, configuration space decoder, and scatter-gather DMA controller with synchronized access to on-chip block RAM. Use Value: Delivers sub-microsecond interrupt latency and 200 MB/s sustained transfer rate using dedicated carry logic for address calculation and dual-port RAM for descriptor buffering. |
| Memory Interface Accelerator | Protocol Conversion Gateway |
Use Scenario: Accelerating DDR SDRAM access in video processing systems where frame buffers require concurrent read/write operations at 133 MHz. IC Role / Device Role / Timing Role: XCV600-4BG560C acts as a memory controller with calibrated delay lines, write leveling, and bank management logic tightly coupled to 98,304-bit block RAM for command queueing. Use Value: Achieves 1.06 GB/s peak bandwidth using HSTL Class IV I/O and eliminates external FIFOs by leveraging distributed LUT RAM for data staging. | Use Scenario: Converting between Gigabit Ethernet MAC frames and proprietary sensor bus protocols in smart grid monitoring equipment. IC Role / Device Role / Timing Role: XCV600-4BG560C performs packet parsing, CRC generation/checking, and format translation using LUT-based state machines and block RAM for buffer management. Use Value: Supports line-rate 1 Gbps processing with <2 μs end-to-end latency by exploiting parallelizable logic cells and dedicated carry chains for checksum computation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV600-5BG560C | Higher speed grade (-5 vs. -4); 10–15% faster internal timing (e.g., register-to-register delay 4.8 ns vs. 5.4 ns) | Suitable for designs requiring tighter timing margins or higher clock frequencies beyond 160 MHz | Select when targeting >180 MHz system clocks or when migrating from -4 to meet revised timing closure goals |
| XCV800-4BG560C | Larger capacity (888,439 gates, 21,168 logic cells, 114,688-bit block RAM) in identical BG560 package | Enables more complex designs (e.g., dual-core soft processor + peripherals) without PCB redesign | Choose for design scalability where future feature expansion is anticipated and pin compatibility is mandatory |
Compared with XCV600-4BG560C, the XCV600-5BG560C offers improved timing headroom for frequency-critical paths, while the XCV800-4BG560C provides additional logic and memory resources within the same footprint - both retain identical I/O banking structure and DLL configuration, simplifying migration.
Availability
XCV600-4BG560C is available at Aetrix Electronics and suitable for high-reliability industrial control, legacy telecom infrastructure, and aerospace avionics programs requiring stable component supply and long-term obsolescence management.
Supply support for XCV600-4BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered SRAM-based FPGA architectures and advanced design toolchains for complex digital system implementation.
The Virtex family, including XCV600-4BG560C, was engineered for high-performance, high-density logic replacement of ASICs in communications, computing, and signal processing - emphasizing place-and-route efficiency, clock management, and I/O flexibility.
FAQ
What is the maximum operating temperature range for the XCV600-4BG560C?
The XCV600-4BG560C is rated for commercial temperature range: junction temperature (TJ) from 0°C to +85°C. This is indicated by the "C" suffix in the part number per Xilinx ordering convention (Figure 1, DS003-1). Operation outside this range may result in configuration loss, timing violation, or permanent damage. Thermal management must ensure die temperature remains within specification under full I/O and logic utilization.
Does the XCV600-4BG560C support hot-swapping in Compact PCI systems?
Yes, the XCV600-4BG560C supports hot-swapping requirements for Compact PCI as stated in DS003-1 (v4.0) Module 1. Its I/O architecture includes robust ESD protection, programmable weak-keeper circuits to maintain bus states during insertion/removal, and configurable I/O standards compatible with Compact PCI signaling levels. Implementation requires adherence to Xilinx's hot-swap design guidelines, including proper sequencing of VCCINT/VCCO and use of INIT/PROGRAM for safe reconfiguration.
How many dedicated delay-locked loops (DLLs) does the XCV600-4BG560C contain?
The XCV600-4BG560C contains four dedicated delay-locked loops (DLLs), as confirmed in DS003-1 Module 1 Features section and DS003-2 Architectural Description. These DLLs provide advanced clock control for input deskew, output phase alignment, and zero hold-time I/O paths. Each DLL operates independently and can be configured via configuration bitstream to manage multiple clock domains across the device.
Can the XCV600-4BG560C be configured via JTAG interface only?
No, the XCV600-4BG560C supports four programming modes: JTAG, master serial PROM, slave serial, and SelectMAP™. JTAG is one valid method - primarily used for debugging, boundary scan, and in-system programming - but not the sole option. Master serial mode uses an external PROM to auto-load configuration on power-up, while SelectMAP allows high-speed parallel configuration via microprocessor bus interface. Mode selection depends on system architecture and startup requirements.
What is the total block RAM capacity of the XCV600-4BG560C?
The XCV600-4BG560C provides 98,304 bits of block RAM, implemented as 24 independent 4096-bit dual-port synchronous RAM blocks (DS003-2 Table 3). Each block supports configurable port widths (1–16 bits) and depths (256–4096), enabling flexible memory structures such as FIFOs, dual-clock buffers, and lookup tables. This capacity is separate from distributed LUT RAM resources and is optimized for high-bandwidth, low-latency access in data-intensive applications.
XCV600-4BG560C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 560-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3456
- Number of Logic Elements/Cells:
- 15552
- Total RAM Bits:
- 98304
- Number of I/O:
- 404
- Number of Gates:
- 661111
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 560-MBGA (42.5x42.5)
XCV600-4BG560C FAQ
1.How can I place an order for XCV600-4BG560C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV600-4BG560C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV600-4BG560C reliable?
The price and inventory of XCV600-4BG560C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600-4BG560C is usually 5 days.
3.What payment methods are accepted for XCV600-4BG560C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600-4BG560C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV600-4BG560C?
XCV600-4BG560C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV600-4BG560C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV600-4BG560C?
For technical support, including XCV600-4BG560C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600-4BG560C requirements.
6.How does Aetrix verify that XCV600-4BG560C is sourced from the original manufacturer or authorized distributors?
All XCV600-4BG560C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600-4BG560C meets industry standards.
7.What is the process for return or replacement of XCV600-4BG560C?
All XCV600-4BG560C units undergo pre-shipment inspection (PSI). If there is an issue with XCV600-4BG560C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV600-4BG560C part is unused and in its original packaging.
Return procedure for XCV600-4BG560C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV600-4BG560C Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
