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Home > Products > Integrated Circuits (ICs) > Embedded > FPGAs (Field Programmable Gate Array)

AMD XCV600-4BG560I

Name: XCV600-4BG560I
Brand: AMD
SKU: XCV600-4BG560I
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: XCV600-4BG560I

Manufacturer:: AMD

Category:: FPGAs (Field Programmable Gate Array)

Package:: 560-LBGA Exposed Pad, Metal

Datasheet:: XCV600-4BG560I.pdf

Description:: IC FPGA 404 I/O 560MBGA

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Product details

Overview

XCV600-4BG560I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) delivering 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304 bits of block SelectRAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV600-4BG560I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV600-4BG560I implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight banks with per-bank VCCO and VREF constraints; each IOB supports programmable slew rate, drive strength (up to 24 mA source / 48 mA sink), synchronous/asynchronous set/reset, and IEEE 1149.1 boundary scan. Supported standards include LVTTL, LVCMOS2, PCI 3.3 V/5 V, HSTL Class I/III/IV, SSTL2/3, GTL/GTL+, and CTT - subject to bank voltage compatibility per Table 2 in DS003-2.

Key Specifications

Parameter	Value and Actual Design Meaning
System Gates	661,111 - defines total logic capacity for gate-equivalent synthesis mapping
Logic Cells	15,552 - actual count of configurable logic cells (4 per CLB × 3,888 CLBs)
User I/O Pins	512 - maximum available bidirectional user I/O in BG560 package
Block RAM Bits	98,304 - distributed across 24 dual-ported 4k-bit SelectRAM blocks (4096 × 2 ports each)
Speed Grade	-4 - worst-case 200 MHz system performance with 66-MHz PCI compliance
Operating Temperature	–40°C to +100°C (Industrial) - validated thermal range for sustained operation
Supply Voltage	2.5 V core (VCCINT), 3.3 V/2.5 V/1.5 V I/O (VCCO) - multi-voltage I/O banking support

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 27 × 27 mm body, 1.27 mm pitch, RoHS-compliant lead-free finish. Pinout defined in DS003-4 (v4.0) Module 4; includes 512 user I/O pins distributed across eight I/O banks (Bank 0–7), four dedicated global clock inputs (GCLK0–GCLK3), JTAG TDI/TDO/TMS/TCK, configuration pins (INIT, PROGRAM, DONE), and multiple VCCINT/VCCO/VREF/GND balls.

Pin/Terminal	Circuit Role	Design Meaning
GCLK0–GCLK3	Global Clock Input	Dedicated low-skew inputs feeding four primary clock distribution networks
TDI/TDO/TMS/TCK	JTAG Boundary Scan	IEEE 1149.1-compliant test access port for programming and debug
INIT, PROGRAM, DONE	Configuration Control	Asynchronous initialization, reconfiguration trigger, and configuration completion status
VCCINT	Core Power Supply	2.5 V supply for CLB, RAM, and routing logic; requires tight regulation (±3%)
VCCO_0–VCCO_7	I/O Bank Power	Independent 1.5/2.5/3.3 V supplies per bank; determines compatible I/O standards
VREF_0–VREF_7	I/O Threshold Reference	Per-bank reference voltage for SSTL/HSTL/GTL input receivers; shared across bank

Key Features

Feature	Design Value
Four DLLs	Enables zero hold-time pad-to-pad paths and precise clock domain alignment across large designs
Configurable LUT RAM	Each 4-input LUT operates as 16×1-bit synchronous RAM, 16×2-bit, 32×1-bit, or 16-bit shift register
Dual-ported Block RAM	24 × 4096-bit RAM blocks with independent read/write clocks, widths, and enables per port
SelectIO™ Interface	Supports 16 I/O standards including HSTL Class IV (200 MHz), SSTL3, and PCI 66 MHz with hot-swap capability
Dedicated Carry Logic	Two-bit-per-CLB carry chain per slice enables high-speed arithmetic without LUT resource consumption

Applications

PCI 66 MHz Interface	High-Speed Memory Controller
Use Scenario: Implementing a 66-MHz 32-bit PCI bus master interface in industrial control backplane systems. IC Role / Device Role / Timing Role: FPGA acts as PCI bus controller with strict setup/hold timing compliance, DLL-synchronized clock domain crossing, and hot-swap state management. Use Value: Meets PCI Local Bus Specification Rev 2.2 timing requirements including tSA, tHD, and tCO at 66 MHz using on-chip DLL compensation.	Use Scenario: Building a DDR SDRAM controller for video frame buffering in broadcast equipment. IC Role / Device Role / Timing Role: FPGA manages address/command strobes, data capture, and write leveling using block SelectRAM for command FIFOs and LUT RAM for deskew buffers. Use Value: 98,304 bits of block RAM plus distributed LUT RAM enable dual-port buffering and 200 MHz clock domain bridging between SDRAM and processing logic.
Telecom Line Card Logic	Test Equipment Pattern Generator
Use Scenario: Replacing ASICs in T1/E1 framer and HDLC processor modules for carrier-grade access devices. IC Role / Device Role / Timing Role: FPGA implements multi-channel serial framing, CRC generation, and jitter-tolerant clock recovery using DLL-locked clock trees. Use Value: Four DLLs allow independent clock domains for line-rate (1.544/2.048 MHz), system (50–100 MHz), and host interface (PCI 33/66 MHz) subsystems.	Use Scenario: Generating high-fidelity digital stimulus waveforms for ATE systems requiring sub-nanosecond edge placement. IC Role / Device Role / Timing Role: FPGA serves as deterministic pattern sequencer with deep on-chip memory, precise output timing control, and programmable slew rate per pin. Use Value: 512 user I/O pins with individually programmable drive strength and fast/slow slew options enable simultaneous multi-channel waveform synthesis up to 200 MHz.

PCI 66 MHz Interface

High-Speed Memory Controller

Use Scenario: Implementing a 66-MHz 32-bit PCI bus master interface in industrial control backplane systems.

IC Role / Device Role / Timing Role: FPGA acts as PCI bus controller with strict setup/hold timing compliance, DLL-synchronized clock domain crossing, and hot-swap state management.

Use Value: Meets PCI Local Bus Specification Rev 2.2 timing requirements including tSA, tHD, and tCO at 66 MHz using on-chip DLL compensation.

Use Scenario: Building a DDR SDRAM controller for video frame buffering in broadcast equipment.

IC Role / Device Role / Timing Role: FPGA manages address/command strobes, data capture, and write leveling using block SelectRAM for command FIFOs and LUT RAM for deskew buffers.

Use Value: 98,304 bits of block RAM plus distributed LUT RAM enable dual-port buffering and 200 MHz clock domain bridging between SDRAM and processing logic.

Telecom Line Card Logic

Test Equipment Pattern Generator

Use Scenario: Replacing ASICs in T1/E1 framer and HDLC processor modules for carrier-grade access devices.

IC Role / Device Role / Timing Role: FPGA implements multi-channel serial framing, CRC generation, and jitter-tolerant clock recovery using DLL-locked clock trees.

Use Value: Four DLLs allow independent clock domains for line-rate (1.544/2.048 MHz), system (50–100 MHz), and host interface (PCI 33/66 MHz) subsystems.

Use Scenario: Generating high-fidelity digital stimulus waveforms for ATE systems requiring sub-nanosecond edge placement.

IC Role / Device Role / Timing Role: FPGA serves as deterministic pattern sequencer with deep on-chip memory, precise output timing control, and programmable slew rate per pin.

Use Value: 512 user I/O pins with individually programmable drive strength and fast/slow slew options enable simultaneous multi-channel waveform synthesis up to 200 MHz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA logic and I/O applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
XCV600-5BG560I	Higher speed grade (-5 vs. -4); 10–15% faster CLB timing and reduced clock-to-out delays	Required for designs exceeding 180 MHz system clock or demanding tighter PCI 66 MHz setup margins	Select when timing closure fails on XCV600-4BG560I or when migrating from XCV400-6 with headroom needs
XCV800-4BG560I	Larger device: 888,439 gates, 21,168 logic cells, same BG560 package and pinout	Provides additional CLBs and block RAM (114,688 bits) without PCB redesign; identical footprint and I/O banking	Choose for design scalability where future logic expansion is anticipated but package constraint remains fixed

Compared with XCV600-4BG560I, the -5 speed grade delivers measurable timing margin improvement for high-frequency control paths, while XCV800-4BG560I offers direct pin-compatible upgrade path with +34% logic capacity and +17% block RAM - both preserving existing board layout and I/O voltage planning.

Availability

XCV600-4BG560I is available at Aetrix Electronics and suitable for industrial control backplanes, telecom line cards, broadcast video processors, and automated test equipment requiring stable component supply amid long product lifecycles.

Supply support for XCV600-4BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, it developed foundational FPGA architectures and design tools.

The Virtex family - including XCV600-4BG560I - was engineered for high-performance, high-density system integration in wired infrastructure, military/aerospace, and compute-acceleration applications requiring reconfigurable logic, embedded memory, and multi-standard I/O.

FAQ

Is XCV600-4BG560I still in production or supported?

XCV600-4BG560I is obsolete per Xilinx Notice XCN10016 (2013). No new manufacturing occurs, but Aetrix Electronics maintains legacy inventory with full traceability. Engineering support relies on archived DS003 documentation suite (v4.0), and no firmware or toolchain updates are provided beyond ISE 14.7.

What development tools are required to program XCV600-4BG560I?

XCV600-4BG560I requires Xilinx ISE Design Suite 14.7 or earlier; later versions (Vivado) do not support Virtex E/Family. Programming modes include JTAG, Slave Serial, SelectMAP, and Master Serial PROM loading. Configuration bitstreams must be generated using Foundation or Alliance software targeting the -4 speed grade.

Can XCV600-4BG560I interface directly with 3.3 V PCI slots?

Yes - XCV600-4BG560I is 66-MHz PCI compliant and supports PCI 3.3 V signaling when configured with VCCO = 3.3 V in applicable I/O banks. It meets PCI Local Bus Specification Rev 2.2 timing (tSA, tHD, tCO) using on-chip DLLs for clock deskew, and supports hot-swap via INIT and PROGRAM pin sequencing.

How many block RAMs does XCV600-4BG560I contain, and what configurations are supported?

XCV600-4BG560I contains 24 block SelectRAM units, each providing 4,096 bits of synchronous dual-ported memory. Supported configurations include depths of 1–16 and widths of 1–16 bits per port (e.g., 256×16, 512×8, 1024×4, 2048×2, 4096×1), with independent clock, enable, and reset per port as defined in DS003-2 Table 4.

What are the I/O banking constraints for mixing HSTL and SSTL signals on XCV600-4BG560I?

HSTL Class I (VCCO = 1.5 V, VREF = 0.75 V) and SSTL3 Class I (VCCO = 3.3 V, VREF = 1.5 V) cannot share an I/O bank due to incompatible VCCO and VREF requirements. Each bank must use uniform VCCO; VREF is shared across all pins in the bank. Mixing is only allowed within compatible groups per DS003-2 Table 2 - e.g., HSTL III/IV (1.5 V) together, or SSTL3 I/II (3.3 V) together.

XCV600-4BG560I Specifications

Product attributes: Attribute value

Manufacturer:: AMD

Series:: Virtex®

Package/Case:: 560-LBGA Exposed Pad, Metal

Packaging:: Tray

Product Status:: Obsolete

Programmable:: Not Verified

Number of LABs/CLBs:: 3456

Number of Logic Elements/Cells:: 15552

Total RAM Bits:: 98304

Number of I/O:: 404

Number of Gates:: 661111

Voltage - Supply:: 2.375V ~ 2.625V

Mounting Type:: Surface Mount

Operating Temperature:: -40°C ~ 100°C (TJ)

Grade:: -

Qualification:: -

Supplier Device Package:: 560-MBGA (42.5x42.5)

XCV600-4BG560I FAQ

1.How can I place an order for XCV600-4BG560I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV600-4BG560I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV600-4BG560I reliable?

The price and inventory of XCV600-4BG560I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600-4BG560I is usually 5 days.

3.What payment methods are accepted for XCV600-4BG560I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600-4BG560I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV600-4BG560I?

XCV600-4BG560I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV600-4BG560I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV600-4BG560I?

For technical support, including XCV600-4BG560I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600-4BG560I requirements.

6.How does Aetrix verify that XCV600-4BG560I is sourced from the original manufacturer or authorized distributors?

All XCV600-4BG560I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600-4BG560I meets industry standards.

7.What is the process for return or replacement of XCV600-4BG560I?

All XCV600-4BG560I units undergo pre-shipment inspection (PSI). If there is an issue with XCV600-4BG560I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV600-4BG560I part is unused and in its original packaging.

Return procedure for XCV600-4BG560I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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