AMD XCV600-4FG676C

Overview

XCV600-4FG676C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 676-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304 bits of block SelectRAM and LUTs configurable as RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV600-4FG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB-level timing parameters, and migration guidance from Virtex-1 family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV600-4FG676C implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 local clock nets, and VersaRing I/O routing to support pin-locking and PCB reuse. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bussing.

Each IOB supports 16 SelectIO™ standards-including LVTTL, LVCMOS2, HSTL Class IV, SSTL3, and GTL+-with independent programmable drive strength (up to 24 mA source / 48 mA sink), slew rate control, weak-keeper, and IEEE 1149.1 boundary-scan. I/O banks enforce shared VCCO (3.3 V / 2.5 V / 1.5 V) and single-VREF per bank constraints.

Key Specifications

Pinout & Package

Package: 676-ball Fine-pitch Ball Grid Array (FG676), 27 × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Pinout defined in DS003-4 (v4.0), with eight I/O banks (Bank 0–7), four global clock inputs (GCLK0–GCLK3), dedicated configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), and JTAG boundary-scan interface (TCK, TMS, TDI, TDO).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV600-4FG676C, the -5 variant offers improved timing margin for high-frequency designs, while the XCV800-4FG676C provides scalable logic capacity with full pin compatibility-both preserve identical I/O banking structure, DLL count, and SelectIO™ standard support.

Availability

XCV600-4FG676C is available at Aetrix Electronics and suitable for industrial motion control hubs, telecom line cards, PCI 66 MHz interface cards, and high-speed data acquisition systems requiring stable component supply amid long-life product cycles.

Supply support for XCV600-4FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered SRAM-based FPGA architectures and EDA toolchains for high-performance digital system design.

The Virtex family was designed as a high-capacity, high-speed alternative to mask-programmed gate arrays-targeting communications infrastructure, test equipment, and compute-accelerated embedded systems demanding reconfigurable logic density and I/O flexibility.

FAQ

What is the maximum system clock frequency supported by XCV600-4FG676C?

XCV600-4FG676C supports synchronous system clock rates up to 200 MHz, including I/O paths, as confirmed in DS003-1 (v4.0) Table 2 and architectural benchmarks. This applies under worst-case timing conditions at commercial temperature range (0°C to +85°C) and 2.5 V core supply. The -4 speed grade guarantees timing closure for designs meeting these constraints.

Does XCV600-4FG676C support hot-swap operation in Compact PCI systems?

Yes, XCV600-4FG676C is explicitly designed for hot-swappable Compact PCI applications, as stated in DS003-1 (v4.0) Features section. Its I/O architecture meets PCI electrical specifications, and its configuration logic ensures safe insertion/removal without disrupting backplane signaling or adjacent slots.

How many block SelectRAM modules does XCV600-4FG676C contain, and what is their configuration flexibility?

XCV600-4FG676C contains 24 block SelectRAM modules totaling 98,304 bits (24 × 4,096). Each block is a fully synchronous dual-ported RAM with independently configurable port widths (1–16 bits) and depths (4096–256), enabling built-in bus-width conversion and efficient FIFO or buffer implementation without external memory.

Can XCV600-4FG676C operate with mixed I/O voltage standards on the same device?

Yes, XCV600-4FG676C supports mixed I/O standards via eight independent I/O banks. Each bank enforces a single VCCO voltage (e.g., 3.3 V, 2.5 V, or 1.5 V) and one VREF voltage, allowing coexistence of LVTTL (3.3 V), SSTL2 (2.5 V), and HSTL Class IV (1.5 V) on different banks-subject to bank-specific pin assignments in DS003-4.

Is XCV600-4FG676C still in active production, and what is its lifecycle status?

XCV600-4FG676C is marked as obsolete/under obsolescence per DS003-1 (v4.0) revision history (March 2013) and Xilinx advisory XCN10016. Aetrix Electronics maintains legacy supply channels with traceable, tested inventory for continued support in maintenance and long-lifecycle deployments.