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AMD XCV600-4FG676I
- Part No.:
- XCV600-4FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XCV600-4FG676I.pdf
- Description:
- IC FPGA 444 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,757
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Product details
Overview
XCV600-4FG676I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 676-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.
For engineers reviewing the XCV600-4FG676I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and industrial-temperature (-40°C to +100°C) operation guidance - all critical for legacy system sustainment, reconfiguration planning, and obsolescence-mitigated FPGA replacement.
Technical Context
The XCV600-4FG676I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock networks fed by dedicated DLLs. Its CLBs contain dual-slice logic cells with 4-input LUTs, carry chains, and configurable storage elements supporting synchronous/asynchronous set/reset.
I/O functionality is organized into eight banks with per-bank VCCO and VREF constraints; supported standards include LVTTL (5 V tolerant), LVCMOS2, PCI 3.3 V, HSTL Class IV (200 MHz), and SSTL2/3 - each requiring strict voltage domain separation and bank-specific termination.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 661,111 - defines total logic capacity for ASIC replacement or complex digital subsystem implementation |
| Logic Cells | 15,552 - provides granular, place-and-route-efficient resources for pipelined datapaths and state machines |
| User I/O Pins | 512 - enables high-pin-count interface consolidation (e.g., memory buses, parallel video, multi-protocol I/O) |
| Block RAM | 98,304 bits across 24 dual-ported 4k-bit blocks - supports independent read/write ports with bus-width conversion for FIFOs and buffering |
| Max System Clock | 200 MHz - achievable with register-to-register paths under worst-case timing, including I/O setup/hold margins |
| PCI Compliance | 66-MHz PCI - meets electrical and protocol timing requirements for add-in card designs without external glue logic |
| Operating Temp | -40°C to +100°C (Industrial) - validated for extended thermal environments in industrial automation and telecom infrastructure |
Pinout & Package
The XCV600-4FG676I is housed in a 676-ball Fine-pitch Ball Grid Array (FG676) package with 0.8 mm ball pitch, designed for high-density PCB layouts and thermal reliability in industrial systems. Pin functions follow Xilinx's standardized Virtex IOB architecture with eight I/O banks, each requiring dedicated VCCO and optional VREF supply routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Dedicated low-skew inputs feeding four primary clock distribution networks; must be driven by clean, low-jitter sources |
| CCLK | Configuration Clock | Serial configuration clock input during master serial mode; drives internal bitstream loading sequence |
| DIN | Configuration Data In | Serial data input for master serial configuration; synchronized to CCLK edge |
| PROGRAM_B | Initiate Configuration | Active-low asynchronous reset that clears configuration memory and restarts startup sequence |
| INIT_B | Configuration Status | Open-drain output indicating configuration completion (high) or error/failure (low) |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification |
Key Features
| Feature | Design Value |
|---|---|
| Four DLLs | Enables zero hold-time I/O timing, clock deskewing across large die, and phase-aligned domain crossing for multi-clock systems |
| LUT-as-RAM | Each 4-input LUT configures as 16×1-bit synchronous RAM, 16×2-bit, 32×1-bit, or 16×1-bit dual-port RAM - ideal for small buffers and register files |
| Dedicated Carry Logic | Two per CLB slice enables high-speed arithmetic (e.g., 32-bit adders in <8 ns) without consuming LUT resources |
| SelectIO™ Interface | Supports 16 I/O standards including HSTL Class IV (200 MHz) and SSTL3 - allows direct interfacing to DDR SDRAM, QDR SRAM, and ASICs |
| Die Temperature Sensor | On-die diode enables real-time thermal monitoring via external ADC - critical for fan control and thermal throttling in sealed enclosures |
Applications
| Telecom Line Card | Industrial Motion Controller |
|---|---|
|
Use Scenario: High-density packet processing and SerDes-to-parallel bus bridging in modular telecom chassis. IC Role / Device Role / Timing Role: FPGA fabric implements protocol translation, header parsing, and DMA arbitration between multiple PHY interfaces and host processor. Use Value: 512 I/O and 200 MHz system clock enable concurrent 66-MHz PCI, HSTL memory, and LVDS SerDes links - eliminating discrete glue logic and reducing BOM count. |
Use Scenario: Real-time closed-loop servo control with multi-axis encoder capture and PWM generation in CNC machinery. IC Role / Device Role / Timing Role: Configurable logic executes position loop calculations, generates synchronized 100 kHz PWM outputs, and samples quadrature encoders at 20 MHz. Use Value: Dedicated carry chains and 4-LUT arithmetic deliver deterministic <5 ns adder latency; on-die temperature sensor ensures safe operation during sustained motor drive duty cycles. |
| Medical Imaging Backend | Military Data Recorder |
|
Use Scenario: Raw sensor data aggregation and preprocessing from ultrasound transducer arrays before compression and storage. IC Role / Device Role / Timing Role: FPGA performs pixel-level filtering, histogram equalization, and burst-mode DDR2 memory write control using block RAM FIFOs. Use Value: 98,304-bit block RAM supports dual-port 256-word deep FIFOs for seamless data flow between ADC interfaces and memory controllers - preventing frame drops at 120 fps. |
Use Scenario: Secure, tamper-resistant recording of encrypted telemetry streams in airborne avionics platforms. IC Role / Device Role / Timing Role: FPGA handles AES-128 encryption, CRC-32 integrity checking, and hot-swappable CompactFlash interface management. Use Value: Industrial temperature rating (-40°C to +100°C) and 66-MHz PCI compliance ensure reliable operation in uncontrolled cabin environments and compatibility with legacy flight computer backplanes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV600-5FG676I | Higher speed grade (-5 vs. -4): 15% faster CLB timing, lower DLL jitter, improved I/O slew rate control | Required for designs targeting >180 MHz system clocks or sub-6 ns register-to-register paths | Select only if timing closure fails with XCV600-4FG676I; identical pinout and configuration interface |
| XCV800-4FG676I | Higher density (888,439 gates, 21,168 logic cells), same FG676 package and industrial temp rating | Needed when design exceeds XCV600 resource utilization (e.g., >95% CLB usage or >90% block RAM) | Drop-in upgrade path with no PCB change; verify power delivery and thermal margin for increased ICCINT |
Compared with XCV600-4FG676I, the -5 speed grade offers tighter timing margins for high-frequency control loops, while the XCV800-4FG676I provides headroom for feature expansion without layout revision - both retain identical I/O banking rules, DLL configuration, and JTAG debug infrastructure.
Availability
XCV600-4FG676I is available at Aetrix Electronics and suitable for industrial motion control, telecom line card sustainment, medical imaging backend processing, and military data recorder applications requiring stable component supply amid obsolescence transitions.
Supply support for XCV600-4FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration solutions since 1984.
The Virtex family - including the XCV600-4FG676I - was engineered for high-performance, high-capacity digital system integration in telecommunications, aerospace, and industrial automation, emphasizing place-and-route efficiency and silicon utilization.
FAQ
What is the maximum operating frequency of the XCV600-4FG676I?
The XCV600-4FG676I achieves up to 200 MHz for register-to-register paths under worst-case timing conditions, including I/O setup and hold margins. This performance is enabled by its 0.22 μm process, dedicated carry logic, and four low-skew global clock networks. Actual system frequency depends on design topology, placement, and routing - verified via Xilinx ISE timing analysis tools using the -4 speed grade constraint files.
Does the XCV600-4FG676I support hot-swap operation?
Yes, the XCV600-4FG676I supports hot-swappable operation in Compact PCI systems per its 66-MHz PCI compliance and robust I/O protection circuitry. Its IOBs include ESD protection, 5 V-tolerant LVTTL inputs, and configurable weak-keeper circuits to maintain signal integrity during insertion/removal. External power sequencing and voltage ramp control remain essential for full hot-swap reliability.
Can the XCV600-4FG676I be configured via JTAG only?
No - the XCV600-4FG676I supports four configuration modes: JTAG, master serial (via on-chip oscillator and external PROM), slave serial, and SelectMAP™ parallel. JTAG is used for programming, debugging, and boundary-scan testing but does not replace dedicated configuration pins (CCLK, DIN, PROGRAM_B, INIT_B) required for full bitstream loading in production systems.
What I/O standards are supported by the XCV600-4FG676I?
The XCV600-4FG676I supports 16 SelectIO™ standards including LVTTL (5 V tolerant), LVCMOS2, PCI 3.3 V, HSTL Class I/III/IV, SSTL3 Class I/II, SSTL2 Class I/II, GTL, GTL+, and CTT. Each I/O bank requires dedicated VCCO and - where applicable - shared VREF; mixing incompatible standards within one bank violates voltage domain rules and risks functional failure.
Is the XCV600-4FG676I still in production?
No - the XCV600-4FG676I is obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). It is classified as "Product Obsolete/Under Obsolescence" with no active manufacturing. Aetrix Electronics supplies remaining authorized inventory with full traceability and offers engineering support for legacy system sustainment, migration paths, and cross-reference alternatives.
XCV600-4FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3456
- Number of Logic Elements/Cells:
- 15552
- Total RAM Bits:
- 98304
- Number of I/O:
- 444
- Number of Gates:
- 661111
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XCV600-4FG676I FAQ
1.How can I place an order for XCV600-4FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV600-4FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV600-4FG676I reliable?
The price and inventory of XCV600-4FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600-4FG676I is usually 5 days.
3.What payment methods are accepted for XCV600-4FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600-4FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV600-4FG676I?
XCV600-4FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV600-4FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV600-4FG676I?
For technical support, including XCV600-4FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600-4FG676I requirements.
6.How does Aetrix verify that XCV600-4FG676I is sourced from the original manufacturer or authorized distributors?
All XCV600-4FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600-4FG676I meets industry standards.
7.What is the process for return or replacement of XCV600-4FG676I?
All XCV600-4FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XCV600-4FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV600-4FG676I part is unused and in its original packaging.
Return procedure for XCV600-4FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XCV600-4FG676I Tags
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