AMD XCV600-4HQ240C

Overview

XCV600-4HQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 maximum user I/O pins in a 240-pin High Heat Dissipation QFP package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI-compliant interfaces for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV600-4HQ240C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB-level timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV600-4HQ240C implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bussing.

I/O functionality is organized into eight banks with per-bank VCCO and VREF constraints; each IOB supports selectable standards including LVTTL, LVCMOS2, HSTL Class I/III/IV, SSTL2/3, GTL/GTL+, and PCI 3.3 V/5 V, with programmable drive strength (up to 24 mA source / 48 mA sink) and slew rate control.

Key Specifications

Pinout & Package

HQ240 is a 240-pin High Heat Dissipation QFP package with 0.5 mm pitch, exposed thermal pad, and 166 user I/O pins arranged in four sides. Pin numbering follows standard QFP convention (pin 1 corner marked, counter-clockwise). I/O banks are assigned per edge (Bank 0–7), with VCCO and VREF pins grouped by bank; all VCCO pins are internally bonded together in HQ240, requiring single-supply voltage per device.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV600-4HQ240C, the -5 variant improves timing margin without changing layout, while the XCV800-4HQ240C offers scalable logic density within the same mechanical and thermal envelope - both preserve JTAG, SelectMAP, and slave serial configuration modes.

Availability

XCV600-4HQ240C is available at Aetrix Electronics and suitable for industrial motion control, high-speed data acquisition, PCI bridge development, and digital video processing requiring stable component supply across extended product lifecycles.

Supply support for XCV600-4HQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex family was designed for high-end applications demanding high logic density, fast I/O, and advanced clock management - targeting communications infrastructure, test equipment, and military/aerospace systems where reconfigurability and performance are critical.

FAQ

What is the maximum operating frequency supported by XCV600-4HQ240C?

XCV600-4HQ240C supports synchronous system clock rates up to 200 MHz, verified under worst-case timing conditions (2.5 V core supply, 85°C junction temperature, speed grade -4). This includes register-to-register paths and I/O interfaces compliant with 66-MHz PCI specifications. Actual achievable frequency depends on design complexity, placement, and routing.

Does XCV600-4HQ240C support hot-swapping in Compact PCI systems?

Yes, XCV600-4HQ240C is explicitly designed for hot-swappable Compact PCI applications. Its I/O structure, power sequencing behavior, and robust ESD protection (per DS003-1) meet the electrical and timing requirements defined in the PICMG 2.1 specification for safe insertion/removal under power.

How many block RAMs does XCV600-4HQ240C contain, and what are their configurations?

XCV600-4HQ240C contains 24 block SelectRAMs totaling 98,304 bits. Each block is a fully synchronous dual-ported 4096-bit RAM with independently configurable port widths (1–16 bits) and depths (256–4096), supporting built-in bus-width conversion and true dual-port read/write operations without arbitration logic.

Can XCV600-4HQ240C interface directly with DDR SDRAM?

XCV600-4HQ240C supports DDR SDRAM interfacing via its SelectIO™ I/O standards, specifically SSTL2 Class I/II (for 2.5 V DDR) and SSTL3 Class I/II (for 3.3 V SDR). While not natively supporting DDR2/3 protocols, it can implement DDR controller logic using CLB resources, DLLs for clock forwarding, and block RAM for command queues - confirmed in Xilinx Application Note XAPP200.

Is XCV600-4HQ240C still in active production or obsolete?

XCV600-4HQ240C is listed as obsolete per Xilinx documentation DS003-1 (v4.0, March 2013) and XCN10016. However, Aetrix Electronics maintains legacy inventory with full traceability and provides lifecycle coordination support, including last-time-buy planning and cross-reference assistance for migration to Spartan-7 or Kintex UltraScale+ platforms.