Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XCV600-4HQ240I

Part No.:
XCV600-4HQ240I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP Exposed Pad
Datasheet:
AetrixXCV600-4HQ240I.pdf
Description:
IC FPGA 166 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,976

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XCV600-4HQ240I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells, and 512 user I/O pins in a 240-pin High Heat Dissipation Quad Flat Pack (HQ240) package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV600-4HQ240I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility (LVTTL, HSTL, SSTL), and industrial-temperature (-40°C to +100°C) operational validation - all critical for legacy rework, obsolescence mitigation, and FPGA-based control system sustainment.

Technical Context

The XCV600-4HQ240I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four global low-skew clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight independent banks, each requiring shared VCCO and (where applicable) single VREF voltage; compatible standards per bank include LVTTL/PCI at 3.3 V, SSTL2 at 2.5 V, and HSTL Classes I/III/IV at 1.5 V. The device uses IEEE 1149.1 boundary-scan and includes a die-temperature sensor diode.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 661,111 - defines total combinational logic capacity for gate-equivalent synthesis mapping
Logic Cells 15,552 - provides count of configurable logic units (each with LUT, flip-flop, carry, and control logic)
User I/O Pins 512 - maximum routable bidirectional signals, constrained by HQ240 package pin count and I/O banking rules
Block RAM Bits 98,304 - distributed across 24 × 4,096-bit synchronous dual-port RAM blocks for data buffering and FIFOs
Speed Grade -4 - specifies worst-case timing performance: 200 MHz system clock achievable with proper placement/routing
Operating Temperature -40°C to +100°C (Industrial) - validated thermal range for sustained operation in embedded control and telecom infrastructure
Supply Voltage 2.5 V core (VCCINT), 3.3 V/2.5 V/1.5 V I/O (VCCO) - requires separate regulated supplies per I/O bank voltage domain

Pinout & Package

Package: 240-pin High Heat Dissipation Quad Flat Pack (HQ240), 32 mm × 32 mm body, 0.5 mm pitch, lead-free (Pb-free) compliant per Xilinx documentation.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Dedicated low-skew inputs feeding four primary global clock networks; must be driven by external clock sources or DLL outputs
PROGRAM_B Configuration Reset Active-low asynchronous reset that clears configuration memory and forces reinitialization on next power-up or release
INIT_B Configuration Status Open-drain output indicating configuration completion (high) or failure/reconfiguration (low)
CCLK Configuration Clock Input clock for master serial mode; drives internal configuration shift register during PROM-based loading
TCK/TMS/TDI/TDO JTAG Boundary Scan IEEE 1149.1-compliant test interface for programming, debugging, and interconnect verification
VCCINT Core Power Supply 2.5 V supply for CLB, BRAM, and routing logic; decoupling required within 1 cm of each pin per Xilinx layout guidelines
VCCO_0–VCCO_7 I/O Bank Power Eight independent VCCO pins (one per I/O bank); each must be tied to same voltage as all other VCCO pins in that bank
VREF_0–VREF_7 I/O Reference Voltage Eight VREF inputs (one per bank); required only for standards like HSTL/SSTL; all VREF pins in a bank share internal node

Key Features

Feature Design Value
Four DLLs Enables zero-hold-time I/O timing, phase alignment across clock domains, and jitter-compensated clock distribution without external PLLs
LUT-as-RAM/Shift Register Each 4-input LUT configures as 16×1-bit RAM, 16×2-bit RAM, 32×1-bit RAM, or 16-bit shift register - enabling compact datapath and pipeline registers
Dual-Port Block RAM 24 × 4,096-bit synchronous dual-port RAM blocks support independent read/write operations per port - ideal for ping-pong buffers and FIFOs
SelectIO™ Interface Supports 16 I/O standards including LVTTL, PCI, HSTL Class IV, and SSTL3 - enables direct interfacing to DDR SDRAM, ZBTRAM, and ASICs
I/O Banking Architecture Eight voltage-isolated banks allow mixed-voltage I/O (e.g., 3.3 V LVTTL + 1.5 V HSTL) on single device - reduces level-shifter count and PCB layer count

Applications

Telecom Line Card Control Industrial Motion Controller

Use Scenario: Real-time protocol bridging between T1/E1 framer ICs and backplane Ethernet MACs in carrier-grade access equipment.

IC Role / Device Role / Timing Role: FPGA acts as deterministic packet scheduler and SERDES interface translator, using DLL-synchronized clocks for jitter-critical TDM timing recovery.

Use Value: 512 I/O and 24 block RAMs enable concurrent handling of 16 T1 channels + 10/100 PHY interface while maintaining sub-100 ns latency guarantees.

Use Scenario: Closed-loop servo positioning in CNC machine tools with analog encoder feedback and PWM motor drive outputs.

IC Role / Device Role / Timing Role: FPGA serves as real-time motion trajectory generator and safety-monitoring unit, executing PID loops at 20 kHz using LUT-based arithmetic pipelines.

Use Value: Dedicated carry chains and 15,552 logic cells deliver deterministic 200 MHz control loop timing; industrial temperature rating ensures reliability in uncooled cabinet environments.

Legacy Military Avionics Upgrade Medical Imaging Data Pipeline

Use Scenario: Replacement of obsolete ASICs in radar signal preprocessing modules requiring long-term component availability and field-reprogrammability.

IC Role / Device Role / Timing Role: FPGA implements configurable digital down-converter (DDC) and pulse compression logic, leveraging block RAM for coefficient storage and LUTs for filter taps.

Use Value: SRAM-based configuration allows in-system updates without hardware change; -40°C to +100°C rating meets MIL-STD-810G environmental requirements.

Use Scenario: High-throughput pixel data aggregation from multiple CT detector arrays before transmission to reconstruction engine.

IC Role / Device Role / Timing Role: FPGA functions as parallel data concentrator and lossless compression preprocessor, using dual-port RAM for frame buffering and DMA arbitration.

Use Value: 98,304-bit block RAM and 661k gate density support simultaneous buffering of three 16-bit 100 MHz pixel streams with real-time run-length encoding.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV600-5HQ240I Higher speed grade (-5 vs. -4): 15% faster worst-case timing, enabling 220+ MHz clock domains with identical pinout and logic resources Required where setup/hold margins are marginal in high-speed I/O interfaces (e.g., 66-MHz PCI with tight trace skew) Select when timing closure fails on XCV600-4HQ240I despite optimization; same footprint and configuration bitstream compatibility
XCV800-4HQ240I Higher density (888k gates, 21,168 logic cells, 114,688 block RAM bits) in identical HQ240 package - no pinout change but increased power and thermal demand Suitable for designs needing >20% more logic or RAM without PCB redesign - e.g., adding encryption co-processing or multi-channel video scaling Choose when future scalability or feature expansion is required; verify thermal management and VCCINT current capability (up to 3.2 A typical)

Compared with XCV600-4HQ240I, the -5 variant improves timing margin without altering design constraints, while the XCV800-4HQ240I extends logic/RAM capacity within the same board footprint - both preserve JTAG, SelectMAP™, and slave serial configuration modes.

Availability

XCV600-4HQ240I is available at Aetrix Electronics and suitable for telecom infrastructure upgrades, industrial motion control systems, and legacy avionics sustainment requiring stable component supply and long-term obsolescence management.

Supply support for XCV600-4HQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and EDA tool ecosystems for high-performance digital logic design.

The Virtex family was designed for high-speed, high-density applications including wired/wireless infrastructure, defense systems, and scientific instrumentation - emphasizing place-and-route efficiency, clock management, and multi-standard I/O flexibility.

FAQ

Is XCV600-4HQ240I still in production or considered obsolete?

XCV600-4HQ240I is officially obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), with no new manufacturing. However, Aetrix Electronics maintains verified, traceable inventory from authorized legacy channels and offers full lifecycle support including configuration file archiving, replacement guidance, and cross-reference validation for the XCV600-4HQ240I.

What configuration modes does XCV600-4HQ240I support?

XCV600-4HQ240I supports four configuration modes: Master Serial (loads from external PROM), Slave Serial (driven by external controller), SelectMAP™ (8- or 16-bit parallel interface), and JTAG (boundary-scan programming). All modes use the same CCLK, DIN/DOUT, and PROGRAM_B signals, with mode selected via M0–M2 pins at power-up.

Can XCV600-4HQ240I interface directly with 3.3 V PCI buses?

Yes, XCV600-4HQ240I is 66-MHz PCI Compliant and supports 3.3 V PCI signaling natively through its SelectIO™ I/O buffers. It meets PCI specification timing and electrical requirements when configured with LVTTL I/O standard, 3.3 V VCCO, and appropriate termination - no level shifters required for standard PCI add-in cards.

Does XCV600-4HQ240I include on-die temperature sensing?

Yes, XCV600-4HQ240I integrates a calibrated die-temperature sensor diode accessible via dedicated analog monitoring pins (TEMP_P/TEMP_N). This allows real-time thermal profiling and dynamic thermal throttling in industrial and telecom applications where ambient conditions exceed commercial temperature ranges.

What is the maximum clock frequency achievable with XCV600-4HQ240I's DLLs?

XCV600-4HQ240I's four DLLs support input clock frequencies up to 200 MHz and provide phase-aligned, low-jitter outputs. When used for clock deskewing or zero-delay buffering, they enable synchronous system operation at 200 MHz - verified in Xilinx benchmark data for register-to-register paths and pipelined multipliers under worst-case industrial conditions.

XCV600-4HQ240I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
240-BFQFP Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Total RAM Bits:
98304
Number of I/O:
166
Number of Gates:
661111
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV600-4HQ240I FAQ

1.How can I place an order for XCV600-4HQ240I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV600-4HQ240I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV600-4HQ240I reliable?

The price and inventory of XCV600-4HQ240I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600-4HQ240I is usually 5 days.

3.What payment methods are accepted for XCV600-4HQ240I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600-4HQ240I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV600-4HQ240I?

XCV600-4HQ240I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV600-4HQ240I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV600-4HQ240I?

For technical support, including XCV600-4HQ240I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600-4HQ240I requirements.

6.How does Aetrix verify that XCV600-4HQ240I is sourced from the original manufacturer or authorized distributors?

All XCV600-4HQ240I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600-4HQ240I meets industry standards.

7.What is the process for return or replacement of XCV600-4HQ240I?

All XCV600-4HQ240I units undergo pre-shipment inspection (PSI). If there is an issue with XCV600-4HQ240I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV600-4HQ240I part is unused and in its original packaging.

Return procedure for XCV600-4HQ240I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV600-4HQ240I Tags

  • XCV600-4HQ240I
  • XCV600-4HQ240I PDF
  • XCV600-4HQ240I Datasheet
  • XCV600-4HQ240I Specifications
  • XCV600-4HQ240I Images
  • AMD
  • AMD XCV600-4HQ240I
  • Buy XCV600-4HQ240I
  • XCV600-4HQ240I Price
  • XCV600-4HQ240I Distributor
  • XCV600-4HQ240I Supplier
  • XCV600-4HQ240I Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER