Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XCV600-5BG432C

Part No.:
XCV600-5BG432C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
432-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV600-5BG432C.pdf
Description:
IC FPGA 316 I/O 432MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,730

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XCV600-5BG432C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory including 98,304 bits of block RAM and LUTs configurable as RAM or shift registers, and supports 66-MHz PCI compliance for high-speed embedded control and signal processing applications.

For engineers reviewing the XCV600-5BG432C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV600-5BG432C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaRing I/O ring, and dedicated horizontal bus lines per CLB row. Its CLBs contain two slices each with four 4-input LUTs, carry chains, F5/F6 multiplexers for 5–19 input logic, and dual-port block RAMs organized in two full-height columns totaling 24 blocks (98,304 bits).

I/O functionality is partitioned into eight banks with independent VCCO and VREF supply domains; each bank supports mixed standards only if sharing VCCO voltage (e.g., LVTTL and SSTL3 at 3.3 V), and requires one VREF pin per ~6 I/Os when used. The device includes IEEE 1149.1 boundary-scan, die-temperature sensor diode, and hot-swap capability for Compact PCI systems.

Key Specifications

ParameterValue and Actual Design Meaning
System Gates661,111 - defines logic capacity for complex digital systems such as protocol bridges or DSP accelerators
Logic Cells15,552 - provides fine-grained programmable resources for synchronous state machines and arithmetic pipelines
User I/O Pins512 - enables high-pin-count interfaces including parallel buses, DDR memory controllers, and multi-channel ADC/DAC links
Block RAM Bits98,304 - supports dual-port, synchronous 4k-bit RAM blocks with independent address/data widths for FIFOs and buffering
CLB Array48 × 72 - determines physical layout density and influences place-and-route efficiency for large datapaths
Clock Resources4 DLLs + 4 global clock nets - delivers low-jitter, skew-compensated clock distribution for multi-domain synchronization
Process Technology0.22 μm 5-layer metal CMOS - enables high-speed operation up to 200 MHz system clock with predictable timing closure

Pinout & Package

Package: 432-ball Fine-pitch Ball Grid Array (BG432), RoHS-compliant, commercial temperature range (0°C to +85°C), 2.5 V core supply.

Pin/TerminalCircuit RoleDesign Meaning
GCLK0–GCLK3Global Clock InputDedicated low-skew inputs feeding four primary clock distribution networks
IO_LxxN/IO_LxxPConfigurable I/O Bank PinDifferential or single-ended I/O grouped in eight voltage-isolated banks with shared VCCO/VREF
M0–M2Configuration Mode SelectThree-pin encoding for master serial, slave serial, SelectMAP™, or JTAG configuration modes
CCLKConfiguration ClockInput clock during configuration; becomes user I/O after successful bitstream load
DIN/DOUTSerial Configuration DataAsynchronous serial interface for PROM-based configuration or readback
TCK/TMS/TDI/TDOJTAG Boundary-ScanIEEE 1149.1 test access port supporting programming, debugging, and interconnect verification

Key Features

FeatureDesign Value
Multi-standard SelectIO™Supports 16 I/O standards (LVTTL, HSTL, SSTL, GTL+) across eight isolated banks with per-bank VCCO/VREF control
Configurable LUT RAMEach 4-input LUT acts as 16×1-bit synchronous RAM, 16×2-bit or 32×1-bit RAM, or 16-bit shift register for data capture
Dedicated Carry LogicTwo independent carry chains per CLB enable high-speed arithmetic (e.g., 32-bit adders ≤ 8 ns) without LUT resource consumption
Internal 3-State BussingFour partitionable horizontal bus lines per CLB row allow efficient on-chip tri-state bus implementation without GRM congestion
SRAM-Based ReconfigurationUnlimited in-system reprogramming via JTAG, SelectMAP™, or serial PROM; supports dynamic partial reconfiguration in later toolflows

Applications

High-Speed Communications InterfacePCI Bus Controller

Use Scenario: Implementing a custom 66-MHz PCI-X bridge between legacy peripherals and modern FPGA-accelerated subsystems.

IC Role / Device Role / Timing Role: Configurable protocol engine handling address decoding, burst arbitration, and parity generation with deterministic setup/hold timing.

Use Value: Full 66-MHz PCI compliance eliminates external glue logic; DLL-controlled clock domain crossing ensures reliable data capture across asynchronous domains.

Use Scenario: Real-time packet inspection and filtering in network line cards requiring deep packet buffers and parallel pattern matching.

IC Role / Device Role / Timing Role: High-density logic fabric hosting TCAM-like search engines, 512-pin I/O driving multiple PHYs and memory interfaces simultaneously.

Use Value: 512 user I/O and 98,304 bits of dual-port block RAM enable concurrent ingress/egress buffering and stateful inspection without external SRAM.

DSP Acceleration CoreIndustrial Motion Control

Use Scenario: Offloading FFT, FIR filter, and motor control algorithms from a host processor in radar or medical imaging systems.

IC Role / Device Role / Timing Role: Programmable datapath with dedicated multiplier support and carry chains executing fixed-point arithmetic at >100 MHz.

Use Value: LUT-as-RAM and shift-register modes provide low-latency sample buffering; 200 MHz system clock sustains real-time loop closure.

Use Scenario: Closed-loop servo drive controller synchronizing encoder feedback, PWM generation, and safety monitoring in CNC machinery.

IC Role / Device Role / Timing Role: Deterministic logic fabric managing 16-channel PWM with sub-100 ns jitter, quadrature decoding, and fault response within 2 µs.

Use Value: Four DLLs enable independent clock domains for encoder sampling (50 MHz), PWM (20 kHz), and communication (1 Mbps), all phase-aligned and jitter-controlled.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCV600-6BG432CFaster speed grade (-6 vs. -5); achieves higher clock frequencies (e.g., 200 MHz vs. 180 MHz register-to-register) with identical pinout and memory resourcesBetter suited for timing-critical datapaths requiring maximum frequency margin or lower clock skewSelect when design timing closure fails at -5 grade or when future-proofing for higher-performance variants
XCV800-5BG432CHigher density (888,439 gates, 21,168 logic cells), same BG432 package and I/O count, but larger CLB array (56×84)Enables more complex designs (e.g., multi-core SoC prototypes) without PCB redesign, though power and thermal management increaseChoose for scalability path where logic utilization exceeds 85% on XCV600 or when integrating additional IP cores

Compared with XCV600-5BG432C, the -6 variant improves worst-case timing margins without changing footprint or power envelope, while the XCV800-5 offers headroom for logic expansion within identical board space-both require no layout changes but differ in thermal budget and toolchain timing constraints.

Availability

XCV600-5BG432C is available at Aetrix Electronics and suitable for high-reliability industrial control, legacy telecom infrastructure, and aerospace avionics programs requiring stable component supply amid obsolescence transitions.

Supply support for XCV600-5BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architectures for reconfigurable computing.

The Virtex family was designed for high-performance, high-capacity logic implementation in applications demanding both speed and flexibility-such as communications infrastructure, military systems, and scientific instrumentation-leveraging aggressive 0.22 μm process and hierarchical routing.

FAQ

What is the maximum operating frequency of the XCV600-5BG432C?

The XCV600-5BG432C supports synchronous system clock rates up to 200 MHz, including I/O paths. This figure reflects worst-case timing under commercial temperature conditions (0°C to +85°C) and accounts for internal register-to-register paths, carry-chain propagation, and I/O interface delays. Actual achievable frequency depends on design topology, placement, and routing; typical high-utilization designs operate reliably at 120–160 MHz. The -5 speed grade is validated against DS003-3 timing models.

Does the XCV600-5BG432C support hot-swap operation?

Yes, the XCV600-5BG432C supports hot-swappable operation for Compact PCI systems, as confirmed in DS003-1 Section "Features". This capability relies on its robust I/O structure-including 5 V-tolerant LVTTL inputs, controlled slew-rate drivers, and IEEE 1149.1 boundary-scan-which allows safe insertion/removal while the backplane remains powered. Implementation requires adherence to Compact PCI mechanical and electrical hot-swap specifications.

How many block RAMs does the XCV600-5BG432C contain?

The XCV600-5BG432C contains 24 block SelectRAM memory units, totaling 98,304 bits of dedicated dual-port synchronous RAM. Each block is a fully independent 4k-bit resource configurable for depths from 1 to 4096 and widths from 1 to 16 bits per port, enabling flexible FIFO, buffer, and lookup table implementations without consuming CLB-based LUT RAM resources.

Is the XCV600-5BG432C still in production?

No, the XCV600-5BG432C is obsolete per Xilinx documentation DS003-1 (v4.0, March 2013), which states "The products listed in this data sheet are obsolete. See XCN10016 for further information." Aetrix Electronics maintains limited legacy inventory and supports lifecycle management, including cross-reference guidance to Virtex-II or Spartan-3 alternatives where technically feasible.

What configuration modes does the XCV600-5BG432C support?

The XCV600-5BG432C supports four configuration modes: master serial (loads bitstream from external PROM), slave serial (configured by external controller), SelectMAP™ (8-bit parallel interface), and JTAG (boundary-scan programming). Mode selection is controlled by M0–M2 pins at power-up; all modes use SRAM-based configuration, allowing unlimited reprogramming. JTAG mode remains active post-configuration for debug and verification.

XCV600-5BG432C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
432-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Total RAM Bits:
98304
Number of I/O:
316
Number of Gates:
661111
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
432-MBGA (40x40)

XCV600-5BG432C FAQ

1.How can I place an order for XCV600-5BG432C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV600-5BG432C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV600-5BG432C reliable?

The price and inventory of XCV600-5BG432C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600-5BG432C is usually 5 days.

3.What payment methods are accepted for XCV600-5BG432C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600-5BG432C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV600-5BG432C?

XCV600-5BG432C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV600-5BG432C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV600-5BG432C?

For technical support, including XCV600-5BG432C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600-5BG432C requirements.

6.How does Aetrix verify that XCV600-5BG432C is sourced from the original manufacturer or authorized distributors?

All XCV600-5BG432C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600-5BG432C meets industry standards.

7.What is the process for return or replacement of XCV600-5BG432C?

All XCV600-5BG432C units undergo pre-shipment inspection (PSI). If there is an issue with XCV600-5BG432C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV600-5BG432C part is unused and in its original packaging.

Return procedure for XCV600-5BG432C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV600-5BG432C Tags

  • XCV600-5BG432C
  • XCV600-5BG432C PDF
  • XCV600-5BG432C Datasheet
  • XCV600-5BG432C Specifications
  • XCV600-5BG432C Images
  • AMD
  • AMD XCV600-5BG432C
  • Buy XCV600-5BG432C
  • XCV600-5BG432C Price
  • XCV600-5BG432C Distributor
  • XCV600-5BG432C Supplier
  • XCV600-5BG432C Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER