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AMD XCV600-5BG432I
- Part No.:
- XCV600-5BG432I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 432-LBGA Exposed Pad, Metal
- Datasheet:
-
XCV600-5BG432I.pdf
- Description:
- IC FPGA 316 I/O 432MBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,726
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Product details
Overview
XCV600-5BG432I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304-bit block RAM and LUT-based RAM/shift registers), and supports 66-MHz PCI compliance for high-speed embedded control and signal processing applications.
For engineers reviewing the XCV600-5BG432I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).
Technical Context
The XCV600-5BG432I implements a hierarchical routing architecture with general-purpose routing matrix (GRM), local VersaBlock interconnect, and peripheral VersaRing I/O routing - enabling pin-locking and PCB reuse across logic revisions. Its CLBs contain dual-slice structures with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and configurable storage elements with synchronous/asynchronous set/reset.
Each IOB supports multi-standard SelectIO™ interfaces including LVTTL, LVCMOS2, SSTL2/3, HSTL Classes I/III/IV, GTL/GTL+, and PCI (3.3 V and 5 V tolerant variants), subject to strict I/O banking rules: eight independent banks, each requiring shared VCCO and single VREF voltage, with bank-specific pin assignments confirmed in DS003-4 Module 4 pinout tables.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 661,111 - defines logic capacity for complex digital systems such as protocol bridges or real-time DSP pipelines |
| Logic Cells | 15,552 - corresponds to 4.5 logic cells per CLB in 48×72 array, enabling fine-grained resource allocation |
| User I/O Pins | 512 - available in BG432 package; actual usable count depends on I/O banking and VCCO/VREF pin allocation |
| Block RAM | 98,304 bits - organized as twenty-four 4k-bit dual-ported synchronous RAM blocks, supporting independent read/write widths |
| Speed Grade | -5 - specifies worst-case timing performance: e.g., register-to-register delay ≤ 5.0 ns at 200 MHz system clock |
| DLL Count | 4 - provides advanced clock deskew, phase alignment, and domain crossing for multi-clock designs |
| Operating Voltage | 2.5 V core / 3.3 V or 2.5 V I/O - requires separate VCCINT and VCCO supplies; VCCO per bank must be uniform |
Pinout & Package
Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 35 mm × 35 mm, 1.27 mm pitch, RoHS-compliant. Pinout conforms to DS003-4 (v4.0) Module 4 - includes 512 user I/O pins distributed across eight I/O banks, four dedicated global clock inputs (GCLK0–GCLK3), JTAG boundary-scan pins (TCK/TMS/TDI/TDO/TRST), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), and power/ground balls grouped by bank and function.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Low-skew primary clock nets feeding DLLs; required for synchronous timing closure of high-speed interfaces |
| TCK/TMS/TDI/TDO/TRST | JTAG Boundary-Scan | IEEE 1149.1-compliant test access port; enables in-system programming and post-configuration verification |
| INIT_B/PROGRAM_B/DONE | Configuration Control | Active-low signals managing power-on reset, reconfiguration initiation, and bitstream load completion status |
| VCCINT | Core Power Supply | 2.5 V ± 3% supply for CLB and routing logic; decoupling required per DS003-3 layout guidelines |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific output voltage rails (2.5 V or 3.3 V); all pins in same bank must share identical VCCO |
| VREF_0–VREF_7 | I/O Reference Voltage | Bank-specific input threshold reference (e.g., 0.75 V for HSTL Class I); one VREF per bank, externally supplied |
Key Features
| Feature | Design Value |
|---|---|
| SRAM-based Configuration | Enables unlimited in-system reprogramming via JTAG, SelectMAP™, or master serial modes - critical for field-upgradable systems |
| Dual-Port Block RAM | Twenty-four 4k-bit RAM blocks support simultaneous read/write operations with independent address/data widths - ideal for FIFOs and frame buffers |
| SelectIO™ Interface Flexibility | Supports 16 I/O standards (e.g., HSTL Class IV at 200 MHz, SSTL3 at 180 MHz) within single device - reduces need for external level shifters |
| Dedicated Carry Logic | Two per CLB slice enables high-speed arithmetic (e.g., pipelined adders/multipliers) without consuming LUT resources |
| Die-Temperature Sensor Diode | On-die thermal monitoring enables dynamic thermal management in industrial or telecom chassis environments |
Applications
| PCI Bridge Controller | High-Speed Data Acquisition |
|---|---|
Use Scenario: Implementing a custom PCI-to-parallel bus bridge in industrial automation equipment requiring deterministic latency and hot-swap capability. IC Role / Device Role / Timing Role: XCV600-5BG432I serves as the protocol translation and arbitration engine, managing 66-MHz PCI transactions while synchronizing to local 50-MHz control logic using DLL-controlled clocks. Use Value: Eliminates ASIC development cycle; leverages built-in PCI compliance and DLL deskew to meet <5 ns setup/hold margins across temperature range –40°C to +100°C. | Use Scenario: Capturing 100+ MS/s analog data streams from multiple ADCs in radar signal conditioning subsystems. IC Role / Device Role / Timing Role: XCV600-5BG432I acts as real-time preprocessing unit - performing digital down-conversion, filtering, and buffering using LUT-based shift registers and block RAM FIFOs. Use Value: Achieves 200 MHz system clock operation with sub-5 ns register-to-register paths, enabling >16-bit precision processing at full sample rate without external memory bottlenecks. |
| Telecom Line Card Interface | Reconfigurable Protocol Converter |
Use Scenario: Aggregating T1/E1 and STM-1 signals onto a common backplane in carrier-grade access multiplexers. IC Role / Device Role / Timing Role: XCV600-5BG432I implements framer, mapper, and jitter attenuation logic using HSTL Class IV I/O and DLL-synchronized SerDes-like timing recovery. Use Value: Supports simultaneous 200 MHz HSTL I/O and internal 150 MHz processing - meets GR-1244-CORE jitter transfer requirements without external PLLs. | Use Scenario: Converting between proprietary sensor bus protocols (e.g., CAN FD and SENT) in automotive ECU diagnostic modules. IC Role / Device Role / Timing Role: XCV600-5BG432I hosts dual protocol stacks with isolated clock domains (one DLL per domain), managing bit-level timing, CRC generation, and error recovery. Use Value: Enables firmware-driven reconfiguration of physical layer behavior - supports field updates for new sensor types without hardware change or PCB redesign. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based programmable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV600-6BG432I | Higher speed grade (-6 vs. -5): 0.5 ns faster register-to-register delay, tighter DLL jitter specs | Suitable for designs requiring >180 MHz sustained internal logic frequency or stricter setup/hold margins | Select when timing closure fails on XCV600-5BG432I under worst-case voltage/temperature corners |
| XCV800-5BG432I | Larger capacity (888,439 gates, 21,168 logic cells), same BG432 package footprint and pinout | Provides headroom for design growth or integration of additional IP cores without PCB change | Choose for forward-compatible designs where future feature expansion is anticipated |
Compared with XCV600-5BG432I, the -6 variant improves timing margin for high-frequency control loops, while the XCV800-5BG432I offers scalable logic density within identical mechanical and thermal constraints - both retain full compatibility with Virtex development tools and configuration infrastructure.
Availability
XCV600-5BG432I is available at Aetrix Electronics and suitable for industrial control systems, telecom line cards, high-speed data acquisition, and reconfigurable protocol conversion requiring stable component supply across extended lifecycle planning horizons.
Supply support for XCV600-5BG432I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and toolchain development for high-performance digital system design.
The Virtex family, including XCV600-5BG432I, was engineered for high-speed, high-density applications demanding advanced clock management, flexible I/O, and large on-chip memory - targeting telecom infrastructure, military/aerospace systems, and industrial automation.
FAQ
What is the maximum operating junction temperature for XCV600-5BG432I?
The XCV600-5BG432I is rated for industrial temperature range: –40°C to +100°C junction temperature (TJ). This specification is defined in DS003-3 Module 3 and validated across all speed grades and packages in the Virtex family. Thermal derating applies above 85°C ambient depending on airflow and PCB copper area; the on-die temperature sensor diode enables real-time monitoring in deployed XCV600-5BG432I systems.
Does XCV600-5BG432I support hot-swap operation in Compact PCI systems?
Yes, XCV600-5BG432I supports hot-swappable operation in Compact PCI systems as documented in DS003-1 Module 1. Its I/O structure, power sequencing controls (INIT_B, PROGRAM_B), and robust ESD protection enable safe insertion/removal while the backplane remains powered. Implementation requires adherence to PICMG 2.1 specifications and proper board-level current-limiting circuitry around XCV600-5BG432I power rails.
How many dedicated DLLs does XCV600-5BG432I include, and what are their primary functions?
XCV600-5BG432I includes four dedicated delay-locked loops (DLLs). Each DLL provides zero-delay clock buffering, duty-cycle correction, and phase alignment for up to four independent clock domains. They are used to eliminate clock skew across large CLB arrays, synchronize asynchronous interfaces (e.g., PCI), and generate precise timing for high-speed I/O standards like HSTL Class IV - all without external clock components.
Can XCV600-5BG432I implement true dual-port RAM using its block SelectRAM resources?
Yes, XCV600-5BG432I implements true synchronous dual-port RAM in each of its twenty-four 4k-bit block SelectRAMs. Both ports operate independently with separate clocks (CLKA/CLKB), addresses (ADDRA/ADDRB), write enables (WEA/WEB), and data buses (DIA/DOB). Port widths are configurable (1–16 bits), enabling applications such as ping-pong buffering and simultaneous read/write streaming in XCV600-5BG432I-based video processors.
What I/O standards are supported by XCV600-5BG432I, and how are they constrained by I/O banking?
XCV600-5BG432I supports 16 SelectIO™ standards including LVTTL, LVCMOS2, SSTL2/I/II, HSTL Classes I/III/IV, GTL/GTL+, and PCI (3.3 V and 5 V tolerant). These are constrained by eight I/O banks: each bank requires uniform VCCO voltage and allows only one VREF value. For example, mixing HSTL Class I (VREF = 0.75 V) and SSTL3 (VREF = 1.5 V) in the same bank is prohibited - bank assignment is fixed per DS003-4 pinout tables for XCV600-5BG432I.
XCV600-5BG432I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 432-LBGA Exposed Pad, Metal
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3456
- Number of Logic Elements/Cells:
- 15552
- Total RAM Bits:
- 98304
- Number of I/O:
- 316
- Number of Gates:
- 661111
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 432-MBGA (40x40)
XCV600-5BG432I FAQ
1.How can I place an order for XCV600-5BG432I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV600-5BG432I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV600-5BG432I reliable?
The price and inventory of XCV600-5BG432I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600-5BG432I is usually 5 days.
3.What payment methods are accepted for XCV600-5BG432I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600-5BG432I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV600-5BG432I?
XCV600-5BG432I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV600-5BG432I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV600-5BG432I?
For technical support, including XCV600-5BG432I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600-5BG432I requirements.
6.How does Aetrix verify that XCV600-5BG432I is sourced from the original manufacturer or authorized distributors?
All XCV600-5BG432I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600-5BG432I meets industry standards.
7.What is the process for return or replacement of XCV600-5BG432I?
All XCV600-5BG432I units undergo pre-shipment inspection (PSI). If there is an issue with XCV600-5BG432I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV600-5BG432I part is unused and in its original packaging.
Return procedure for XCV600-5BG432I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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