AMD XCV600-5BG560C

Overview

XCV600-5BG560C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 560-ball BGA package. It integrates four delay-locked loops (DLLs), hierarchical memory (including 98,304-bit block RAM and LUT-based RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV600-5BG560C datasheet, pinout, applications, or equivalent options, key selection criteria include its 200 MHz system performance ceiling, dual-ported 4k-bit synchronous block RAM configuration, SelectIO™ interface support across 16 standards (e.g., HSTL Class IV, SSTL3), and die-temperature sensor diode for thermal monitoring in high-density logic deployments.

Technical Context

The XCV600-5BG560C implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four low-skew global clock distribution networks. Its CLBs contain four logic cells each-each with 4-input LUTs, dedicated carry chains, and configurable storage elements supporting synchronous/asynchronous set/reset.

Each IOB supports programmable drive strength (up to 24 mA source / 48 mA sink), slew rate control, weak-keeper circuitry, and IEEE 1149.1 boundary-scan. I/O banking enforces voltage domain isolation: eight banks require shared VCCO per bank (3.3 V, 2.5 V, or 1.5 V), and VREF-dependent standards (e.g., HSTL, SSTL) are restricted to one VREF per bank.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 27 × 27 array, 1.27 mm pitch, 35 mm × 35 mm body size, RoHS-compliant lead-free finish.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV600-5BG560C, the XCV600-6BG560C delivers higher timing margin for clock-critical paths, while the XCV800-5BG560C offers scalable logic capacity within the same footprint - both preserve I/O banking structure and DLL functionality but differ in gate count, CLB count, and block RAM volume.

Availability

XCV600-5BG560C is available at Aetrix Electronics and suitable for industrial control backplanes, telecom line cards, avionics data concentrators, and high-speed data acquisition systems requiring stable component supply throughout extended product lifecycles.

Supply support for XCV600-5BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it developed foundational FPGA architectures and design toolchains used across aerospace, communications, and industrial markets.

The Virtex family was engineered for high-performance, high-capacity reconfigurable computing - targeting applications demanding ASIC-like density and speed with field-upgradable logic, such as protocol acceleration, real-time signal processing, and adaptive hardware platforms.

FAQ

What is the maximum operating temperature range for the XCV600-5BG560C?

The XCV600-5BG560C is rated for commercial temperature operation: junction temperature (T_J) from 0°C to +85°C. This rating is indicated by the "C" suffix in the part number. Operation outside this range may result in timing violations or configuration loss, and no industrial (–40°C to +100°C) or extended temperature variants exist for this specific BG560 package and speed grade.

Does the XCV600-5BG560C support JTAG configuration mode?

Yes, the XCV600-5BG560C supports IEEE 1149.1 JTAG boundary-scan configuration mode. It uses TCK, TMS, TDI, TDO, and TRESTN pins for programming, debugging, and in-system verification. JTAG mode allows configuration bitstream loading without external PROM and enables readback of configuration status and device identification registers.

How many dedicated clock networks does the XCV600-5BG560C provide?

The XCV600-5BG560C provides four primary low-skew global clock distribution networks (GCLK0–GCLK3) plus 24 secondary local clock nets. These are driven by four integrated delay-locked loops (DLLs), enabling precise clock deskew, phase alignment, and domain crossing control - essential for high-speed I/O interfaces like HSTL and DDR memory controllers.

Can the XCV600-5BG560C implement true dual-port RAM without external logic?

Yes, the XCV600-5BG560C contains 24 dedicated block SelectRAM modules, each a fully synchronous dual-ported 4,096-bit RAM with independent clocks (CLKA/CLKB), addresses (ADDRA/ADDRB), and data buses (DIA/DIB, DOA/DOB). No external logic is needed - both ports operate concurrently with full read/write arbitration handled internally.

Is the XCV600-5BG560C still in active production?

No, the XCV600-5BG560C is obsolete. Per Xilinx DS003-1 (v4.0) dated March 2013, all Virtex devices including XCV600 are listed as "Product Obsolete/Under Obsolescence." Aetrix Electronics maintains legacy inventory and offers lifecycle management support, but new silicon is no longer manufactured by AMD/Xilinx.