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AMD XCV600-5BG560I

Part No.:
XCV600-5BG560I
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
560-LBGA Exposed Pad, Metal
Datasheet:
AetrixXCV600-5BG560I.pdf
Description:
IC FPGA 404 I/O 560MBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,012

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Product details

Overview

XCV600-5BG560I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells, and 512 user I/O pins in a 560-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304-bit block RAM and LUT-based RAM/shift registers), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV600-5BG560I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing behavior, SelectIO™ standard compatibility, and obsolescence-aware selection guidance for legacy Virtex system upgrades and industrial control rework.

Technical Context

The XCV600-5BG560I implements a hierarchical routing architecture with a General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic with 4-input LUTs, dedicated carry chains, F5/F6 multiplexers for 5–19 input functions, and BUFTs for internal 3-state bus driving.

I/O functionality is organized into eight banks, each requiring shared VCCO and single VREF voltage; supported standards include LVTTL (5 V tolerant), LVCMOS2, HSTL Class I/III/IV, SSTL3/SSTL2, GTL/GTL+, and PCI 3.3 V. Configuration occurs via master serial, slave serial, SelectMAP™, or JTAG modes using external PROM or host controller.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates 661,111 - defines total logic capacity for ASIC replacement sizing
Logic Cells 15,552 - provides granular resource count for place-and-route estimation
User I/O Pins 512 - enables high-pin-count interface consolidation (e.g., parallel buses, multi-standard I/O)
Block RAM 98,304 bits - supports dual-port synchronous memory at up to 200 MHz system clock
Speed Grade -5 - guarantees 5.0 ns register-to-register delay under worst-case industrial conditions
Operating Voltage 2.5 V core / 3.3 V or 2.5 V I/O (VCCO) - requires separate power domains and I/O banking planning
Temperature Range –40°C to +100°C (Industrial) - validated for extended thermal environments without derating

Pinout & Package

Package: 560-ball Fine-pitch Ball Grid Array (FBGA), 27 × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Pinout defined across eight I/O banks with dedicated VCCO and VREF per bank; global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG TDI/TDO/TMS/TCK, and dual-purpose M0/M1/M2 mode select pins.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3 Global Clock Input Low-skew entry points for primary clock domains; routed to four DLLs for phase alignment
VCCO_0–VCCO_7 I/O Bank Power Supply Separate 3.3 V or 2.5 V supply per bank; determines compatible output standards (e.g., LVTTL vs. HSTL)
VREF_0–VREF_7 I/O Threshold Reference Single externally supplied voltage per bank for input standards requiring threshold (e.g., SSTL2, HSTL)
DIN, CCLK, INIT, DONE Configuration Interface Master serial mode signals; CCLK drives bitstream load; DONE indicates configuration completion
TCK, TMS, TDI, TDO JTAG Boundary Scan IEEE 1149.1-compliant test access port for programming, debugging, and interconnect verification

Key Features

Feature Design Value
Four Dedicated DLLs Enables zero hold-time I/O timing, clock deskew across large designs, and jitter-compensated domain crossing
Configurable LUT RAM/Shift Register Each 4-input LUT acts as 16×1-bit RAM or 16-bit shift register - eliminates external FIFOs in data capture paths
Dual-Port Block RAM (4k × 24) Provides true dual-clock, independent-width memory ports - supports simultaneous read/write for video frame buffers or protocol engines
SelectIO™ Multi-Standard I/O Supports 16 standards including 5 V-tolerant LVTTL and PCI 3.3 V - allows mixed-voltage board design without level shifters
Hierarchical Carry Logic Dedicated 2-bit-per-CLB carry chain enables >200 MHz arithmetic pipelines - critical for real-time DSP and motor control

Applications

Industrial Motion Control Legacy Telecom Line Card

Use Scenario: Real-time servo loop execution with encoder feedback, PWM generation, and safety monitoring on a single FPGA.

IC Role / Device Role / Timing Role: Configurable logic fabric implementing closed-loop PID, position interpolation, and ISO 13849-compliant safe torque off (STO) state machine.

Use Value: 512 I/O pins enable direct connection to multiple axes, encoders, and fieldbus interfaces; -5 speed grade ensures sub-5 ns timing closure for 200 kHz PWM update rates.

Use Scenario: Replacing obsolete gate arrays in E1/T1 framer and HDLC controller modules within deployed telecom chassis.

IC Role / Device Role / Timing Role: Protocol processing engine handling framing, CRC, and channelized time-slot mapping with deterministic latency.

Use Value: 66-MHz PCI compliance allows seamless integration into existing PCI backplane infrastructure; 98,304-bit block RAM stores full-frame buffers for jitter tolerance.

Test Equipment Digital Pattern Generator Avionics Data Concentrator

Use Scenario: High-speed digital stimulus generation for ATE systems requiring synchronized multi-channel vector patterns at 100+ MHz.

IC Role / Device Role / Timing Role: Parallel pattern sequencer with deep on-chip memory, precise clock domain crossing, and programmable slew-rate outputs.

Use Value: Four DLLs align multiple clock domains for glitch-free vector transitions; LUT-based shift registers capture and replay burst-mode test vectors without external memory.

Use Scenario: ARINC 429 and MIL-STD-1553B bus aggregation in airborne mission computers with strict DO-254 compliance requirements.

IC Role / Device Role / Timing Role: Deterministic bridge between legacy avionics buses and modern Ethernet/AFDX endpoints, enforcing time-triggered scheduling.

Use Value: Industrial temperature rating (–40°C to +100°C) meets extended environmental qualification; IEEE 1149.1 boundary scan supports in-system testability per DO-254 tool qualification.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system logic applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV600-6BG560I Faster –6 speed grade (4.4 ns register-to-register); identical pinout and architecture Better suited for designs requiring >180 MHz system clocks or tighter setup/hold margins Select when timing closure fails on XCV600-5BG560I and PCB layout cannot be modified
XCV800-5BG560I Higher density (888,439 gates, 21,168 logic cells); same BG560 package and pinout Enables feature expansion (e.g., added protocol stacks, larger buffer memory) without board redesign Choose for forward-compatible upgrades where additional logic resources are needed post-deployment

Compared with XCV600-5BG560I, the XCV600-6BG560I offers higher performance within identical footprint and power envelope, while the XCV800-5BG560I provides scalable logic capacity-both retain full pin compatibility and I/O banking structure, enabling drop-in migration paths for timing-critical or resource-constrained legacy systems.

Availability

XCV600-5BG560I is available at Aetrix Electronics and suitable for industrial motion control, legacy telecom infrastructure, test equipment digital pattern generation, and avionics data concentrators requiring stable component supply amid obsolescence transitions.

Supply support for XCV600-5BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGA architecture and developed the Virtex family as its flagship high-performance programmable logic platform for demanding system-on-chip applications.

The Virtex family was designed for high-speed, high-density digital system integration - targeting applications requiring PCI compliance, multi-standard I/O, deterministic timing, and reconfigurable hardware acceleration in industrial, aerospace, and communications equipment.

FAQ

Is XCV600-5BG560I still in production?

No - XCV600-5BG560I is officially obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). Aetrix Electronics maintains limited legacy inventory with full traceability and provides engineering support for sustainment and last-time-buy programs. Replacement guidance and migration paths are available upon request.

What configuration modes does XCV600-5BG560I support?

XCV600-5BG560I supports four configuration modes: master serial (loads bitstream from external PROM), slave serial (host-driven), SelectMAP™ (8-bit parallel interface), and JTAG (boundary-scan programming). All modes use the same dedicated pins (DIN, CCLK, INIT, DONE, PROGRAM), with mode selected by M0/M1/M2 strap pins during power-up.

Can XCV600-5BG560I interface directly with 5 V logic?

Yes - XCV600-5BG560I IOBs are 5 V tolerant in LVTTL, PCI 5 V, and LVCMOS2 input configurations. However, output drivers require VCCO = 3.3 V for 5 V-tolerant operation, and VREF must be unconnected or grounded when using 5 V–compatible inputs. Mixing 5 V–tolerant and non-tolerant standards within the same I/O bank is prohibited.

How many clock domains can XCV600-5BG560I manage simultaneously?

XCV600-5BG560I supports up to four independent clock domains via its four dedicated DLLs, each capable of phase alignment, duty-cycle correction, and frequency synthesis. Additional domains may be implemented using local clock nets (24 secondary nets), though without DLL-level jitter suppression or skew control.

What is the maximum operating frequency of XCV600-5BG560I's block RAM?

XCV600-5BG560I block RAM operates synchronously at up to 200 MHz - matching the device's maximum system clock rate. Dual-port access allows concurrent read and write operations at full speed, with setup/hold times fully characterized in DS003-3 (DC and Switching Characteristics, Module 3).

XCV600-5BG560I Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
560-LBGA Exposed Pad, Metal
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Total RAM Bits:
98304
Number of I/O:
404
Number of Gates:
661111
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
-40°C ~ 100°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
560-MBGA (42.5x42.5)

XCV600-5BG560I FAQ

1.How can I place an order for XCV600-5BG560I through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV600-5BG560I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV600-5BG560I reliable?

The price and inventory of XCV600-5BG560I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600-5BG560I is usually 5 days.

3.What payment methods are accepted for XCV600-5BG560I?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600-5BG560I transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV600-5BG560I?

XCV600-5BG560I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV600-5BG560I order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV600-5BG560I?

For technical support, including XCV600-5BG560I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600-5BG560I requirements.

6.How does Aetrix verify that XCV600-5BG560I is sourced from the original manufacturer or authorized distributors?

All XCV600-5BG560I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600-5BG560I meets industry standards.

7.What is the process for return or replacement of XCV600-5BG560I?

All XCV600-5BG560I units undergo pre-shipment inspection (PSI). If there is an issue with XCV600-5BG560I, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV600-5BG560I part is unused and in its original packaging.

Return procedure for XCV600-5BG560I:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV600-5BG560I Tags

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