AMD XCV600-5FG676C

Overview

XCV600-5FG676C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 676-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304 bits of block SelectRAM+™), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV600-5FG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex-1 generation devices.

Technical Context

The XCV600-5FG676C implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, or 16-bit shift registers, plus dedicated carry chains and F5/F6 multiplexers for wide-input logic synthesis.

I/O functionality is organized into eight independent banks, each supporting mixed voltage standards (e.g., LVTTL, HSTL Class IV, SSTL3) under shared VCCO and single VREF per bank. Each IOB includes three storage elements with independent clock enable, synchronous/asynchronous set/reset, and programmable polarity on all control signals and output buffers.

Key Specifications

Pinout & Package

Package: FG676 - 676-ball Fine-pitch Ball Grid Array (1.0 mm pitch), RoHS-compliant, with eight I/O banks (Bank 0–7) arranged around device periphery. Each bank has dedicated VCCO and VREF pins; VCCO must be uniform within a bank, and only one VREF voltage allowed per bank.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV600-5FG676C, the -6 variant offers improved timing margin without resource or footprint change, while the XCV800-5FG676C delivers scalable logic capacity within identical mechanical and thermal constraints-both enabling incremental upgrades without PCB redesign.

Availability

XCV600-5FG676C is available at Aetrix Electronics and suitable for industrial motion controllers, PCI-based test equipment, high-speed data acquisition systems, and communications protocol gateways requiring stable component supply throughout extended product lifecycles.

Supply support for XCV600-5FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed foundational FPGA architectures and design toolchains widely adopted in aerospace, defense, and industrial markets.

The Virtex family-including XCV600-5FG676C-was engineered for high-performance, high-density logic replacement in systems demanding 200 MHz operation, multi-standard I/O, and deterministic clock management, targeting communications infrastructure and embedded computing.

FAQ

Is XCV600-5FG676C still in production or obsolete?

XCV600-5FG676C is marked as obsolete per Xilinx documentation (DS003-1 v4.0, March 2013). However, Aetrix Electronics maintains legacy inventory with full traceability and offers lifecycle support including obsolescence forecasting, cross-reference assistance, and last-time-buy coordination for ongoing production programs.

What configuration modes does XCV600-5FG676C support?

XCV600-5FG676C supports four configuration modes: Master Serial (reads bitstream from external PROM), Slave Serial, SelectMAP™ (8- or 16-bit parallel), and JTAG (boundary scan programming). All modes load SRAM-based configuration, enabling unlimited reprogramming without hardware changes.

Can XCV600-5FG676C interface directly with 3.3 V PCI slots?

Yes, XCV600-5FG676C is 66-MHz PCI compliant and supports 3.3 V PCI signaling via its SelectIO™ I/O banks. When configured for PCI 3.3 V mode, it meets PCI specification timing and drive requirements, including hot-swap capability for Compact PCI applications.

Does XCV600-5FG676C include on-chip memory beyond LUT-based RAM?

Yes, XCV600-5FG676C integrates 24 dedicated block SelectRAM+™ modules totaling 98,304 bits of synchronous dual-ported RAM. Each block is independently configurable for depth/width (e.g., 256×16, 1024×4) and supports true dual-clock operation-distinct from distributed LUT RAM.

What thermal management considerations apply to XCV600-5FG676C?

XCV600-5FG676C includes an integrated die-temperature sensor diode for real-time junction temperature monitoring. For sustained operation at 0°C to +85°C, thermal design must ensure case temperature remains ≤85°C using standard FR4 PCBs with 2 oz copper and appropriate thermal vias under the FG676 package.