AMD XCV600-5FG676I

Overview

XCV600-5FG676I from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 676-ball Fine-pitch Ball Grid Array (FBGA) package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304 bits of block SelectRAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV600-5FG676I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV600-5FG676I implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaBlock-local interconnect, and VersaRing peripheral I/O routing - enabling high place-and-route efficiency for complex synchronous designs. Its CLBs contain four logic cells each, with dedicated carry chains per slice, F5/F6 multiplexers for 5–19-input logic, and dual-port 4k-bit block RAMs configurable across 16 depth/width combinations.

Each IOB supports 16 SelectIO™ standards including LVTTL, LVCMOS2, HSTL Class I/III/IV, SSTL2/3, GTL/GTL+, and PCI (3.3 V and 5 V tolerant variants), subject to strict VCCO/VREF banking rules across eight independent I/O banks. All IOBs include programmable input delay, weak-keeper, pull-up/pull-down, and IEEE 1149.1 boundary-scan logic.

Key Specifications

Pinout & Package

Package: 676-ball Fine-pitch Ball Grid Array (FG676), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Pinout defined in DS003-4 (v4.0) Pinout Tables module; includes 512 user I/O pins distributed across eight I/O banks (Bank 0–7), four dedicated global clock inputs (GCLK0–GCLK3), JTAG boundary-scan pins (TCK/TMS/TDI/TDO/TRST), configuration pins (INIT, PROGRAM, CCLK, DIN, DOUT), and multiple VCCINT/VCCO/VREF/GND balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based logic implementation applications.

Compared with XCV600-5FG676I, the XCV600-6FG676I delivers higher timing margin for aggressive clock rates, while the XCV800-5FG676I offers 34% more logic capacity within identical mechanical and I/O constraints - enabling either performance tuning or functional expansion without layout change.

Availability

XCV600-5FG676I is available at Aetrix Electronics and suitable for industrial control systems, legacy telecom infrastructure upgrades, and aerospace avionics retrofit programs requiring stable component supply and long-term obsolescence management.

Supply support for XCV600-5FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; founded in 1984, it pioneered the FPGA architecture and tools ecosystem.

The Virtex family - including XCV600-5FG676I - was designed for high-performance, high-density system-level logic replacement in networking, computing, and signal processing applications demanding reconfigurable hardware acceleration.

FAQ

Is XCV600-5FG676I still in production or supported by Xilinx/AMD?

No - XCV600-5FG676I is officially obsolete per Xilinx document XCN10016 and DS003-1 (v4.0, March 2013). It is no longer manufactured or supported with new silicon, but Aetrix Electronics maintains legacy inventory with full traceability and offers engineering support for sustainment programs.

What configuration modes does XCV600-5FG676I support?

XCV600-5FG676I supports four configuration modes: master serial (reads bitstream from external PROM), slave serial (bitstream loaded via dedicated serial pins), SelectMAP™ (parallel loading at up to 20 MHz), and JTAG (boundary-scan programming and debug). Mode selection is controlled by mode pins M0–M2 during power-up.

Can XCV600-5FG676I interface with both 3.3 V and 1.5 V I/O standards simultaneously?

Yes - XCV600-5FG676I supports concurrent 3.3 V (e.g., LVTTL, PCI) and 1.5 V (e.g., HSTL Class I/III/IV) I/O standards, but only if assigned to separate I/O banks with independent VCCO supplies. Mixing standards within one bank is prohibited unless they share identical VCCO and VREF requirements.

Does XCV600-5FG676I include on-die temperature sensing?

Yes - XCV600-5FG676I integrates a calibrated die-temperature sensor diode, accessible via dedicated analog monitor pins and readable through Xilinx's Hardware Debugger (IMPACT) or custom logic using the XADC primitive (if available in later toolchains); accuracy is ±5°C over the industrial range.

What is the maximum clock frequency achievable with XCV600-5FG676I's DLLs?

XCV600-5FG676I's four DLLs support input clock frequencies up to 200 MHz and provide phase-aligned, low-jitter outputs for internal logic and I/O. Worst-case system clock rate (register-to-register) is 200 MHz per DS003-2 timing tables, assuming proper placement, routing, and -5 speed grade constraints.