AMD XCV600-5FG680C

Overview

XCV600-5FG680C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 680-pin Fine-pitch Ball Grid Array (FBGA) package. It integrates four delay-locked loops (DLLs), 4 primary global clock nets plus 24 local clock nets, and 98,304 bits of block SelectRAM for high-speed synchronous dual-port memory applications in PCI-compliant systems.

For engineers reviewing the XCV600-5FG680C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB-level timing parameters, and migration guidance from Virtex-1 generation FPGAs to compatible successors.

Technical Context

The XCV600-5FG680C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaBlock-local interconnect, and VersaRing peripheral I/O routing - enabling pin-locking and PCB reuse across logic iterations. Its CLBs contain four logic cells each, with dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register.

Each IOB supports 16 SelectIO™ standards including LVTTL, LVCMOS2, PCI 3.3 V/5 V, HSTL Class I/III/IV, SSTL3/SSTL2, GTL/GTL+, and CTT, with independent programmable drive strength (up to 24 mA source / 48 mA sink), slew rate control, weak-keeper, and IEEE 1149.1 boundary-scan. I/O banks enforce shared VCCO and single-VREF per bank, with eight banks defined per device edge.

Key Specifications

Pinout & Package

Package: FG680 - 680-ball Fine-pitch Ball Grid Array (1.0 mm pitch), RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV600-5FG680C, XC2V6000-4FG676C offers greater scalability but demands full hardware requalification, while XC3S500E-4FG320C reduces BOM cost at the expense of PCI compliance, DLL-based timing control, and block memory depth - making it unsuitable for legacy bus bridging or high-throughput acquisition.

Availability

XCV600-5FG680C is available at Aetrix Electronics and suitable for industrial control systems, telecom infrastructure upgrades, legacy test equipment refurbishment, and aerospace ground support requiring stable component supply across extended product lifecycles.

Supply support for XCV600-5FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGA architecture and established industry standards for programmable logic design tools, IP cores, and silicon efficiency.

The Virtex family was designed for high-performance, high-density reconfigurable computing in applications demanding PCI compliance, multi-standard I/O, and deterministic timing - targeting communications infrastructure, military systems, and scientific instrumentation.

FAQ

What is the maximum operating frequency supported by XCV600-5FG680C?

XCV600-5FG680C supports synchronous system clock rates up to 200 MHz when using its internal delay-locked loops (DLLs) and worst-case timing parameters. This includes I/O timing closure for 66 MHz PCI and HSTL Class IV interfaces. The -5 speed grade guarantees register-to-register delays of ≤5.0 ns under commercial temperature conditions.

Does XCV600-5FG680C support hot-swap functionality for Compact PCI systems?

Yes, XCV600-5FG680C is explicitly designed for hot-swappable Compact PCI applications. Its I/O structure, power sequencing behavior, and IEEE 1149.1 boundary-scan support meet the mechanical and electrical requirements for safe insertion/removal while the backplane remains powered. This capability is documented in DS003-1 Section "Features" and validated in Xilinx Application Note XAPP151.

How many block RAMs does XCV600-5FG680C include, and what configurations are supported?

XCV600-5FG680C includes 24 block SelectRAM units totaling 98,304 bits. Each block is a fully synchronous dual-ported 4,096-bit RAM with independent address, data, and control lines per port. Supported configurations include 1×4096, 2×2048, 4×1024, 8×512, and 16×256 - enabling flexible bus-width conversion and asynchronous FIFO implementation without external memory.

Can XCV600-5FG680C operate with mixed I/O standards on the same device?

Yes, XCV600-5FG680C supports mixed I/O standards across its eight I/O banks, provided each bank uses a single VCCO voltage and - where required - a single VREF. For example, Bank 0 can run LVTTL (3.3 V VCCO) while Bank 1 runs SSTL2 (2.5 V VCCO). Standards sharing the same VCCO (e.g., LVTTL and PCI 3.3 V) may coexist within one bank, per Table 2 in DS003-2.

Is XCV600-5FG680C still in active production, and what lifecycle support does Aetrix Electronics provide?

XCV600-5FG680C is marked obsolete per Xilinx documentation (DS003-1 v4.0, March 2013), but Aetrix Electronics maintains traceable inventory with full lot-level documentation and offers extended lifecycle support including obsolescence forecasting, last-time-buy coordination, and cross-reference engineering for migration paths to Virtex-II or Spartan-3E alternatives.