AMD XCV600-6BG432C

Overview

XCV600-6BG432C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 316 user I/O pins in a 432-ball BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304 bits of block SelectRAM+™), and supports 66-MHz PCI compliance and hot-swappable Compact PCI operation.

For engineers reviewing the XCV600-6BG432C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV600-6BG432C implements a hierarchical routing architecture with General Routing Matrix (GRM), 24 local clock nets, and four primary low-skew global clock distribution networks. Its CLBs contain dual-slice logic cells with 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register.

I/O functionality is organized into eight banks with independent VCCO and VREF supply domains; each bank supports mixed standards only when sharing VCCO voltage (e.g., LVTTL and SSTL3 at 3.3 V), and includes IEEE 1149.1 boundary-scan logic, programmable slew rate, and drive strength up to 24 mA source / 48 mA sink.

Key Specifications

Pinout & Package

The XCV600-6BG432C uses a 432-ball fine-pitch Ball Grid Array (BG432) package with 316 user I/O pins distributed across eight I/O banks. Each bank requires dedicated VCCO and (where applicable) VREF supplies, and supports mixed signaling standards only within compatible voltage groups per Table 2 of DS003-2.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV600-6BG432C, the -5 variant trades 0.4 ns timing margin for reduced power, while the XCV800-6BG432C offers 34% more logic cells in pin-compatible form-making both viable alternatives depending on whether timing headroom or resource headroom is the dominant constraint.

Availability

XCV600-6BG432C is available at Aetrix Electronics and suitable for industrial control backplanes, broadcast video infrastructure, communications transceivers, and radar signal processing systems requiring stable component supply amid obsolescence transitions.

Supply support for XCV600-6BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and introduced the Virtex family as high-performance, high-density programmable logic solutions targeting ASIC replacement and system acceleration.

The Virtex family-including XCV600-6BG432C-was designed for demanding applications requiring high-speed I/O, embedded memory, and advanced clock management, such as telecom infrastructure, military avionics, and scientific instrumentation.

FAQ

What is the maximum operating temperature range for XCV600-6BG432C?

The XCV600-6BG432C is rated for commercial temperature range: junction temperature (T_J) from 0°C to +85°C. This is indicated by the "C" suffix in the ordering code per Figure 1 of DS003-1. Operation outside this range may cause configuration loss, timing violations, or permanent damage.

Does XCV600-6BG432C support JTAG boundary-scan testing?

Yes, XCV600-6BG432C includes full IEEE 1149.1-compliant boundary-scan logic. Pins TCK, TMS, TDI, and TDO are dedicated for this function, enabling in-circuit testing, device programming, and interconnect verification without physical probe access.

Can XCV600-6BG432C interface directly with 5 V TTL devices?

XCV600-6BG432C supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards per Table 1 of DS003-2-but only when VCCO = 3.3 V and appropriate clamping is enabled. Outputs are not 5 V tolerant; external level-shifting is required for driving 5 V loads.

How many block SelectRAM+™ modules does XCV600-6BG432C contain?

XCV600-6BG432C contains 24 block SelectRAM+™ modules totaling 98,304 bits, as confirmed in Table 3 of DS003-2. Each module is a fully synchronous, dual-ported 4096-bit RAM with independent address/data width configuration per port.

Is XCV600-6BG432C still in active production?

No-XCV600-6BG432C is obsolete. DS003-1 (v4.0, March 2013) explicitly states "The products listed in this data sheet are obsolete. See XCN10016 for further information." Aetrix Electronics provides legacy supply chain support but does not recommend new designs.