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AMD XCV600-6FG676C
- Part No.:
- XCV600-6FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XCV600-6FG676C.pdf
- Description:
- IC FPGA 444 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,920
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Product details
Overview
XCV600-6FG676C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 676-ball fine-pitch BGA package. It integrates four delay-locked loops (DLLs), 4 primary + 24 secondary clock nets, and 98,304 bits of block SelectRAM for high-speed digital signal processing, PCI-66 MHz interface design, and reconfigurable embedded control systems.
For engineers reviewing the XCV600-6FG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, CLB-level timing parameters, and obsolescence-aware supply guidance for legacy Virtex migration and industrial system sustainment.
Technical Context
The XCV600-6FG676C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaRing I/O ring, and dedicated horizontal bus lines per CLB row. Its CLBs contain four logic cells each, with dual-slice structure supporting 4-input LUTs configurable as 16-bit RAM, 32-bit RAM, 16-bit dual-ported RAM, or 16-bit shift register.
Each IOB supports 16 SelectIO™ standards including LVTTL, LVCMOS2, HSTL Class IV, SSTL3, and GTL+, with independent VCCO per I/O bank and shared VREF per bank. The device features IEEE 1149.1 boundary-scan, die-temperature sensor diode, and hot-swappable operation compliant with Compact PCI specifications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 661,111 - defines maximum combinational logic capacity for ASIC replacement or complex state-machine implementation |
| Logic Cells | 15,552 - provides discrete, placeable-and-routable units each containing 4-input LUT, carry logic, and storage element |
| User I/O Pins | 512 - enables high-pin-count interface consolidation (e.g., parallel memory buses, multi-channel ADC/DAC control) |
| Block RAM Bits | 98,304 - delivers 24 × 4,096-bit synchronous dual-ported RAM blocks for FIFO buffering or coefficient storage |
| Speed Grade | -6 - guarantees worst-case register-to-register delay ≤ 5.0 ns and 200 MHz system clock performance with DLL |
| Package | FG676 - 676-ball fine-pitch BGA with 1.0 mm ball pitch, optimized for thermal dissipation and high-density PCB routing |
| Operating Voltage | 2.5 V core / 3.3 V or 2.5 V I/O - requires separate VCCINT and VCCO supplies; supports mixed-voltage I/O banking |
Pinout & Package
Package: FG676 (Fine-pitch Ball Grid Array, 676 balls, 1.0 mm pitch, 27×27 array excluding corner balls). Pinout conforms to Xilinx DS003-4 (v4.0) Module 4, with eight I/O banks (Bank 0–7), dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM, CCLK, DIN, DONE), JTAG TDI/TDO/TMS/TCK, and VCCINT/VCCO/VREF/ground balls distributed per bank.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK3 | Global Clock Input | Primary low-skew clock inputs routed to four dedicated DLLs; must be driven by clean, low-jitter source |
| DIN | Configuration Data Input | Serial bitstream input during master serial or slave serial configuration mode |
| DONE | Configuration Status Output | Open-drain output indicating successful configuration completion; pulled high externally after initialization |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| VCCO_0–VCCO_7 | I/O Bank Supply | Separate power pins per I/O bank; voltage sets output swing and input threshold compatibility (e.g., 3.3 V for LVTTL, 2.5 V for LVCMOS2) |
| VREF_0–VREF_7 | I/O Reference Voltage | Input threshold reference for HSTL/SSTL standards; all VREF pins in same bank must share identical external voltage |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated DLLs | Four on-chip delay-locked loops eliminate clock skew across large designs and enable phase-aligned I/O timing for DDR interfaces |
| Configurable LUT RAM | Each 4-input LUT operates as 16×1-bit synchronous RAM or combines with adjacent LUT for 16×2-bit/32×1-bit dual-port RAM - enabling distributed FIFOs without consuming block RAM |
| Carry Chain Logic | Dedicated fast-carry path per CLB slice supports ripple-carry adders up to 64 bits with predictable timing, critical for arithmetic-intensive DSP pipelines |
| I/O Banking | Eight independent I/O banks allow simultaneous use of LVTTL (3.3 V), LVCMOS2 (2.5 V), and HSTL Class IV (1.5 V) on single device - simplifies mixed-standard board design |
| Boundary Scan | Full IEEE 1149.1 compliance enables in-system testability, interconnect verification, and programming via JTAG without external fixtures |
Applications
| PCI-66 MHz Interface Design | Digital Signal Processing Acceleration |
|---|---|
Use Scenario: Implementation of 66 MHz PCI bus master/slave controller in test equipment or data acquisition systems requiring hot-swap capability and strict timing compliance. IC Role / Device Role / Timing Role: FPGA acts as protocol engine and glue logic, managing address/data multiplexing, arbitration, and DLL-synchronized setup/hold timing for PCI signals. Use Value: Native 66-MHz PCI compliance and DLL-controlled clock domain crossing ensure zero-cycle setup violations and guaranteed interoperability with standard PCI chipsets. | Use Scenario: Real-time FIR filter and FFT computation in radar front-end or software-defined radio where fixed-function ASICs lack flexibility. IC Role / Device Role / Timing Role: Configurable datapath processes streaming samples using distributed LUT-RAM for coefficient storage and block RAM for input/output buffers. Use Value: 200 MHz system clock and dedicated carry chains deliver >100 million MAC operations/sec at 16-bit precision without external memory bottlenecks. |
| Reconfigurable Industrial Control | Legacy System Emulation |
Use Scenario: Replacement of aging gate arrays in factory automation PLCs where field-upgradable logic is required for protocol adaptation (e.g., Modbus TCP to EtherCAT). IC Role / Device Role / Timing Role: FPGA serves as real-time I/O processor, executing deterministic ladder logic scans and managing isolated digital/analog I/O via programmable IOBs. Use Value: 512 I/O pins and hot-swap support allow seamless integration into existing backplane architectures without redesigning power or cooling subsystems. | Use Scenario: Emulation of obsolete ASICs in military avionics or telecom infrastructure where original masks are lost and re-spinning is cost-prohibitive. IC Role / Device Role / Timing Role: FPGA replicates gate-level netlist behavior using CLB-based logic and block RAM for internal state registers and lookup tables. Use Value: SRAM-based configuration enables bitstream validation against golden vectors and in-field patching of timing-critical paths without hardware change. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV600-6BG560C | Same logic density and speed grade but in 560-ball BGA (BG560) package with 404 max I/O - smaller footprint, lower I/O count | Suitable for space-constrained designs where 512 I/O is unnecessary; thermal resistance higher due to smaller package | Select when PCB area is limited and I/O count can be reduced by 21% without compromising functionality |
| XCV800-6FG676C | Higher density (888,439 gates, 21,168 logic cells), same FG676 package and pinout - direct upgrade path with no layout change | Enables larger designs (e.g., multi-channel video processing) while retaining identical board footprint and power delivery network | Choose for forward-compatible designs requiring headroom for feature expansion or higher clock rates |
Compared with XCV600-6FG676C, XCV600-6BG560C trades I/O count for compactness, whereas XCV800-6FG676C offers full pin-compatible scalability - both require validation of timing closure and I/O banking constraints specific to the target application.
Availability
XCV600-6FG676C is available at Aetrix Electronics and suitable for industrial control systems, legacy avionics sustainment, and test equipment requiring stable component supply amid obsolescence transitions.
Supply support for XCV600-6FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and tools for high-performance digital system design.
The Virtex family was designed for high-speed, high-capacity reconfigurable computing applications including telecommunications infrastructure, military systems, and scientific instrumentation - targeting designs where ASIC non-recurring engineering costs are prohibitive.
FAQ
Is XCV600-6FG676C still in production or marked obsolete?
Yes, XCV600-6FG676C is officially obsolete per Xilinx documentation (DS003-1 v4.0, March 2013) and superseded by Virtex-II and later families. Aetrix Electronics maintains legacy inventory with full traceability and offers extended-life procurement support for ongoing production and repair programs.
What configuration modes does XCV600-6FG676C support?
XCV600-6FG676C supports four configuration modes: master serial (reads bitstream from external PROM), slave serial (bitstream loaded via FPGA's DIN pin), SelectMAP™ (parallel loading via 8- or 16-bit bus), and JTAG (boundary-scan programming via TDI/TDO). All modes retain SRAM-based volatile configuration requiring re-load on power-up.
Can XCV600-6FG676C interface directly with 3.3 V PCI slots?
Yes, XCV600-6FG676C is fully 66-MHz PCI compliant and supports 3.3 V signaling. Its IOBs implement PCI I/O standards with appropriate drive strength and slew rate control; VCCO must be set to 3.3 V in relevant I/O banks, and VREF is not required for PCI mode.
Does XCV600-6FG676C include on-die temperature sensing?
Yes, XCV600-6FG676C integrates a die-temperature sensor diode as a standard feature. This analog element allows real-time junction temperature monitoring via external circuitry, supporting thermal management in high-power industrial deployments of the XCV600-6FG676C.
What is the maximum operating frequency of internal logic in XCV600-6FG676C?
The XCV600-6FG676C achieves up to 200 MHz system clock performance under worst-case timing conditions when using DLLs. Table 2 in DS003-1 confirms 5.0 ns register-to-register delay for -6 speed grade, enabling synchronous logic operation at 200 MHz including I/O paths.
XCV600-6FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3456
- Number of Logic Elements/Cells:
- 15552
- Total RAM Bits:
- 98304
- Number of I/O:
- 444
- Number of Gates:
- 661111
- Voltage - Supply:
- 2.375V ~ 2.625V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XCV600-6FG676C FAQ
1.How can I place an order for XCV600-6FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV600-6FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV600-6FG676C reliable?
The price and inventory of XCV600-6FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600-6FG676C is usually 5 days.
3.What payment methods are accepted for XCV600-6FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600-6FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV600-6FG676C?
XCV600-6FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV600-6FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV600-6FG676C?
For technical support, including XCV600-6FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600-6FG676C requirements.
6.How does Aetrix verify that XCV600-6FG676C is sourced from the original manufacturer or authorized distributors?
All XCV600-6FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600-6FG676C meets industry standards.
7.What is the process for return or replacement of XCV600-6FG676C?
All XCV600-6FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XCV600-6FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV600-6FG676C part is unused and in its original packaging.
Return procedure for XCV600-6FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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