AMD XCV600-6FG680C

Overview

XCV600-6FG680C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 user I/O pins in a 680-ball fine-pitch BGA package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance for high-speed embedded control and digital signal processing applications.

For engineers reviewing the XCV600-6FG680C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV600-6FG680C implements a hierarchical routing architecture with a General Routing Matrix (GRM), local VersaBlock interconnect, and periphery VersaRing I/O routing - enabling pin-locking and PCB layout reuse across logic revisions. Its CLBs contain dual-slice logic cells with dedicated carry chains, F5/F6 multiplexers for 5–19-input functions, and BUFT-driven horizontal busses.

Each IOB supports 16 SelectIO™ standards including LVTTL, LVCMOS2, HSTL Class IV, SSTL3, and GTL+, with independent VCCO per I/O bank (3.3 V, 2.5 V, or 1.5 V), programmable slew rate, drive strength up to 24 mA source / 48 mA sink, and IEEE 1149.1 boundary-scan. Eight I/O banks enforce voltage domain separation for VREF and VCCO.

Key Specifications

Pinout & Package

Package: Fine-pitch Ball Grid Array (FG680) with 680 solder balls, 1.0 mm pitch, and 27 mm × 27 mm body size. Thermal pad on underside; requires controlled-impedance PCB layout with strict decoupling near power/ground balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV600-6FG680C, the -5 variant trades 8% timing margin for reduced dynamic power, while the XCV800-6FG680C offers 34% more logic capacity with identical pinout and thermal profile - enabling scalable design reuse without layout revision.

Availability

XCV600-6FG680C is available at Aetrix Electronics and suitable for industrial motion control, PCI-compliant instrumentation, and high-speed data acquisition systems requiring stable component supply across extended product lifecycles.

Supply support for XCV600-6FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and development tools for reconfigurable computing.

The Virtex family - including XCV600-6FG680C - was designed for high-performance, high-density system integration in telecommunications infrastructure, test equipment, and industrial automation where ASIC flexibility and rapid iteration are critical.

FAQ

What is the maximum operating temperature range for XCV600-6FG680C?

The XCV600-6FG680C is rated for commercial temperature operation (0°C to +85°C junction temperature), as indicated by the "C" suffix in its ordering code. It does not support industrial (-40°C to +100°C) or extended ranges. Thermal design must ensure junction temperature remains within this limit under full logic and I/O loading.

Does XCV600-6FG680C support JTAG configuration?

Yes, XCV600-6FG680C supports IEEE 1149.1 JTAG configuration mode using TCK, TMS, TDI, and TDO pins. This enables in-system programming, boundary-scan testing, and readback of configuration bitstreams - critical for production test and field updates without requiring external PROMs.

How many dedicated clock nets does XCV600-6FG680C provide?

XCV600-6FG680C provides four primary low-skew global clock distribution nets (GCLK0–GCLK3), each driven by a dedicated DLL, plus 24 secondary local clock nets for regional timing distribution. This hierarchy ensures minimal skew for high-frequency synchronous logic across large designs.

Can XCV600-6FG680C interface directly with 5 V TTL logic?

XCV600-6FG680C supports 5 V-tolerant inputs for LVTTL, LVCMOS2, and PCI 5 V standards, but only when VCCO = 3.3 V and appropriate I/O banking rules are followed. Outputs are not 5 V tolerant - they swing between 0 V and VCCO (2.5 V or 3.3 V), requiring external level-shifting for true 5 V drive.

Is XCV600-6FG680C still in active production?

No, XCV600-6FG680C is obsolete per Xilinx documentation DS003-1 (v4.0, March 2013), which states "The products listed in this data sheet are obsolete. See XCN10016 for further information." Aetrix Electronics supplies remaining inventory with full traceability and lifecycle support for legacy system maintenance.