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AMD XCV600-6HQ240C

Part No.:
XCV600-6HQ240C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
240-BFQFP Exposed Pad
Datasheet:
AetrixXCV600-6HQ240C.pdf
Description:
IC FPGA 166 I/O 240QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,615

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Product details

Overview

XCV600-6HQ240C from Xilinx is a 2.5 V SRAM-based Field Programmable Gate Array (FPGA) with 661,111 system gates, 15,552 logic cells in a 48×72 CLB array, and 512 maximum user I/O pins in a 240-pin High Heat Dissipation QFP package. It features four delay-locked loops (DLLs), hierarchical memory (including 98,304-bit block RAM and LUT-based RAM/shift register modes), and supports 66-MHz PCI compliance for high-speed embedded control and interface bridging applications.

For engineers reviewing the XCV600-6HQ240C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL jitter specs, CLB timing parameters, and migration guidance from Virtex family documentation DS003-1 through DS003-4 (v4.0, March 2013).

Technical Context

The XCV600-6HQ240C implements a hierarchical routing architecture with General Routing Matrix (GRM), VersaRing I/O interconnect, and dedicated horizontal bus lines per CLB row. Its CLBs contain two slices each with four 4-input LUTs, carry chains, F5/F6 multiplexers for 5–19-input logic, and dual-port synchronous storage elements.

IOBs support 16 SelectIO™ standards-including LVTTL, LVCMOS2, HSTL Class IV, SSTL3, and GTL+-with banked VCCO/VREF constraints, programmable slew rate, drive strength up to 24 mA source / 48 mA sink, and IEEE 1149.1 boundary-scan. Configuration occurs via master serial, slave serial, SelectMAP™, or JTAG modes using external PROM or host controller.

Key Specifications

Parameter Value and Actual Design Meaning
System Gates661,111 - defines total logic capacity for ASIC replacement sizing
Logic Cells15,552 - CLB-based resources enabling complex state machines and datapaths
Max User I/O512 - supports high-pin-count interfaces like parallel buses, video, or multi-protocol I/O
Block RAM98,304 bits (24 × 4096-bit dual-port blocks) - enables on-chip FIFOs, buffers, and lookup tables without external memory
Speed Grade-6 - guarantees ≤6.0 ns pipelined multiplier delay (16×16), ≤5.4 ns 16:1 MUX delay
DLL Count4 - provides advanced clock deskew, phase alignment, and domain crossing for multi-clock systems
PCI Compliance66-MHz - ensures interoperability with CompactPCI backplanes and hot-swap controllers

Pinout & Package

Package: 240-pin High Heat Dissipation Quad Flat Pack (HQ240), 28 mm × 28 mm body, 0.5 mm pitch, lead-free compatible (per DS003-4 Pinout Tables). Thermal pad optional; requires exposed pad soldering for optimal junction temperature control in sustained operation.

Pin/Terminal Circuit Role Design Meaning
GCLK0–GCLK3Global Clock InputDedicated low-skew inputs feeding four primary global clock nets; required for DLL reference and synchronous domain distribution
CCLKConfiguration ClockDrives internal configuration shift register during master/slave serial or SelectMAP™ mode; must be stable before INIT_B deassertion
INIT_BConfiguration StatusOpen-drain output indicating configuration memory readiness; pulled high externally; goes low during reconfiguration or CRC error
DONEConfiguration CompletionOpen-drain output signaling successful bitstream load; requires external pull-up; used for system boot sequencing
TCK/TMS/TDI/TDOJTAG Boundary ScanIEEE 1149.1-compliant test access port; enables in-system programming, debugging, and structural verification
VCCINTCore Supply2.5 V ±3% supply for CLBs, RAM, and routing; decoupling critical due to high dynamic current (ICCINTQ = 1.2 A typical)
VCCO_0–VCCO_7I/O Bank SupplyBank-specific output voltage rails (1.5 V / 2.5 V / 3.3 V); all pins in same bank must share identical VCCO per Table 2 in DS003-2
VREF_0–VREF_7I/O Threshold ReferenceBank-specific input reference voltages (e.g., 0.75 V for HSTL Class I); internally tied within bank; mandatory for SSTL/HSTL/GTL standards

Key Features

Feature Design Value
Dual-Port Block RAM24 independent 4096-bit blocks with configurable port widths (1–16 bits) enable true asynchronous read/write buffering and bus-width conversion
LUT-as-RAM/Shift RegisterEach 4-LUT supports 16×1-bit synchronous RAM, 16×2-bit RAM, or 16-bit shift register - ideal for pipeline registers and burst-mode capture
Carry Chain ArithmeticDedicated 2-bit-per-CLB carry chain with XOR/AND logic accelerates adders, counters, and multipliers without LUT resource consumption
SelectIO™ BankingEight independent I/O banks with segregated VCCO/VREF allow mixed-voltage interfaces (e.g., 3.3 V PCI + 1.5 V HSTL) on single device
Hot-Swap ReadySupports CompactPCI hot-swap protocols via controlled power-up sequencing, weak-keeper retention, and I/O clamp diodes

Applications

Communications Backplane Interface Industrial Motion Control Hub

Use Scenario: Bridging legacy parallel bus (VME, Multibus) to modern serial links (RapidIO, PCIe) in telecom chassis.

IC Role / Device Role / Timing Role: FPGA acts as protocol translator and glue logic; uses DLLs to align 66 MHz PCI clock with 125 MHz RapidIO reference.

Use Value: Eliminates custom ASIC development; 512 I/O supports full 64-bit data bus + address/control; block RAM buffers packet payloads.

Use Scenario: Real-time coordination of multiple servo drives and encoder feedback in CNC machine tool controllers.

IC Role / Device Role / Timing Role: FPGA implements deterministic PWM generators, quadrature decoder pipelines, and safety-critical watchdog timers.

Use Value: CLB carry chains deliver sub-10 ns position loop latency; LUT-as-shift-register captures 20 MHz encoder streams; dual-port RAM stores motion profiles.

Medical Imaging Data Aggregator Defense Radar Signal Preprocessor

Use Scenario: Consolidating parallel ADC outputs (16-bit @ 40 MSPS) from ultrasound transducer arrays into DDR2 memory controller.

IC Role / Device Role / Timing Role: FPGA performs channel gain correction, beamforming weighting, and time-aligned packetization before DRAM write.

Use Value: 98,304-bit block RAM stores 32-sample depth buffers per channel; LUT-based RAM holds calibration coefficients; 66 MHz PCI interface feeds host PC.

Use Scenario: Front-end digital downconversion (DDC) and pulse compression in AESA radar receivers.

IC Role / Device Role / Timing Role: FPGA executes fixed-point FFTs, matched filtering, and CFAR detection at 100+ MHz real-time throughput.

Use Value: Dedicated multiplier logic accelerates 16×16 MAC operations; DLL-controlled clocks synchronize ADC sampling and NCO phases; 512 I/O routes analog front-end signals.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Alternative Part Technical Difference Application Difference Selection Advice
XCV600-6FG680CSame logic density and speed grade, but 680-pin Fine-pitch BGA package with 512 I/O and superior thermal performance (θJA = 12°C/W vs. HQ240's 28°C/W)Better suited for high-power, high-density PCBs with multilayer routing and thermal vias; not pin-compatible with HQ240Select when board space allows BGA and thermal budget requires <75°C junction under full load
XCV800-6HQ240CHigher density (888,439 gates, 21,168 logic cells), same HQ240 package and pinout; requires updated place-and-route constraints and larger bitstreamEnables feature expansion (e.g., added Ethernet MAC, more SERDES lanes) without PCB redesign; higher static/dynamic powerChoose for forward-compatible upgrades where logic utilization exceeds 85% on XCV600-6HQ240C

Compared with XCV600-6HQ240C, the XCV600-6FG680C offers better thermal management in compact systems, while the XCV800-6HQ240C provides headroom for logic growth without layout changes - both require validation of timing closure, power delivery, and signal integrity against original design constraints.

Availability

XCV600-6HQ240C is available at Aetrix Electronics and suitable for industrial motion control hubs, medical imaging aggregators, communications backplane interfaces, and defense radar preprocessor designs requiring stable component supply amid obsolescence transitions.

Supply support for XCV600-6HQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The XCV600-6HQ240C belongs to the Virtex family - Xilinx's flagship high-performance FPGA line designed for demanding applications requiring high logic density, fast I/O, integrated memory, and advanced clock management in 2.5 V systems.

FAQ

What is the maximum operating junction temperature for XCV600-6HQ240C?

The XCV600-6HQ240C is rated for commercial temperature range (0°C to +85°C ambient), with maximum junction temperature of +100°C under specified thermal conditions. Its HQ240 package has θJA = 28°C/W; maintaining Tj ≤ 100°C requires ≤ 2.1 W power dissipation with 200 LFM airflow and 4-layer PCB with thermal vias. Derating applies above 70°C ambient.

Does XCV600-6HQ240C support JTAG boundary scan for production testing?

Yes, XCV600-6HQ240C fully complies with IEEE 1149.1 boundary-scan architecture. Pins TCK, TMS, TDI, and TDO implement mandatory test access port functionality, enabling board-level interconnect testing, in-system programming, and debug visibility. BSDL files for XCV600-6HQ240C are available in Xilinx Answer Record AR# 11221.

Can XCV600-6HQ240C interface directly with 5 V TTL logic?

No, XCV600-6HQ240C IOBs are not 5 V tolerant in output mode. While LVTTL inputs are 5 V tolerant (per Table 1 in DS003-2), outputs must be driven at VCCO = 3.3 V max. Direct connection to 5 V loads requires level-shifting buffers or open-drain configurations with external pull-ups to 5 V - never direct drive.

How many DLLs does XCV600-6HQ240C include, and what clock frequencies do they support?

XCV600-6HQ240C integrates four dedicated delay-locked loops (DLLs), each supporting input frequencies from 10 MHz to 200 MHz. They provide zero-delay buffering, duty-cycle correction, and phase shifting - essential for synchronizing PCI, SDRAM, and high-speed I/O interfaces. DLL lock time is typically 50 μs after power-on or reset.

Is XCV600-6HQ240C still in active production or subject to obsolescence?

XCV600-6HQ240C is marked "Product Obsolete/Under Obsolescence" per DS003-1 (v4.0, March 2013). Xilinx discontinued manufacturing in 2013; Aetrix Electronics supplies remaining factory-new stock with full traceability and extended lifecycle support, including bitstream compatibility assurance and migration path guidance to Spartan-7 or Artix-7 families.

XCV600-6HQ240C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®
Package/Case:
240-BFQFP Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
3456
Number of Logic Elements/Cells:
15552
Total RAM Bits:
98304
Number of I/O:
166
Number of Gates:
661111
Voltage - Supply:
2.375V ~ 2.625V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
240-PQFP (32x32)

XCV600-6HQ240C FAQ

1.How can I place an order for XCV600-6HQ240C through Aetrix?

Please submit a Request for Quotation (RFQ) for XCV600-6HQ240C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XCV600-6HQ240C reliable?

The price and inventory of XCV600-6HQ240C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600-6HQ240C is usually 5 days.

3.What payment methods are accepted for XCV600-6HQ240C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600-6HQ240C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XCV600-6HQ240C?

XCV600-6HQ240C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XCV600-6HQ240C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XCV600-6HQ240C?

For technical support, including XCV600-6HQ240C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600-6HQ240C requirements.

6.How does Aetrix verify that XCV600-6HQ240C is sourced from the original manufacturer or authorized distributors?

All XCV600-6HQ240C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600-6HQ240C meets industry standards.

7.What is the process for return or replacement of XCV600-6HQ240C?

All XCV600-6HQ240C units undergo pre-shipment inspection (PSI). If there is an issue with XCV600-6HQ240C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XCV600-6HQ240C part is unused and in its original packaging.

Return procedure for XCV600-6HQ240C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XCV600-6HQ240C Tags

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