AMD XCV600E-6BG560C

Overview

XCV600E-6BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 15,552 logic cells in a 48 × 72 CLB array. It features eight digital Delay-Locked Loops (DLLs), 294,912 bits of synchronous block RAM, and supports LVDS, LVPECL, and PCI-compliant 3.3 V I/O up to 622 Mb/s - deployed in high-speed communications infrastructure and test equipment.

For engineers reviewing the XCV600E-6BG560C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration modes, and package-specific routing limitations for production-level FPGA integration.

Technical Context

The XCV600E-6BG560C implements a regular array architecture with Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, set/reset, and polarity control.

I/O functionality is organized into eight banks, each requiring shared VCCO and at most one VREF voltage. Supported standards include LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL - with differential I/O pairs limited to 247 per device and maximum user I/O count of 404 in the BG560 package.

Key Specifications

Pinout & Package

The XCV600E-6BG560C uses a 560-ball Ball Grid Array (BG560) package with 1.27 mm pitch, 35 × 35 mm body size, and eight I/O banks distributed across four edges (two banks per edge). Power delivery includes multiple VCCINT, VCCO, and ground balls; dedicated global clock inputs (GCLK0–GCLK3) are located in Bank 0 and Bank 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based programmable logic applications.

Compared with XCV600E-7BG560C, the XCV600E-6BG560C trades 15% timing margin for lower static power and thermal load; compared with XCV800E-6BG560C, it provides identical footprint and I/O compatibility but restricts scalability to 985k gates and 15.5k logic cells.

Availability

XCV600E-6BG560C is available at Aetrix Electronics and suitable for high-speed test equipment, optical line card control, PCI Express Gen1 endpoint designs, and industrial motion controllers requiring stable component supply across extended product lifecycles.

Supply support for XCV600E-6BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered SRAM-based FPGA architectures and tools for electronic system design.

The Virtex-E family was designed for high-performance, high-density reconfigurable logic in communications infrastructure and computing - emphasizing I/O flexibility, clock management, and memory hierarchy over cost-optimized logic density.

FAQ

What is the maximum differential I/O pair count supported by XCV600E-6BG560C?

The XCV600E-6BG560C supports up to 247 differential I/O pairs as specified in Table 1 of DS022-1. This count is fixed for the XCV600E device regardless of package; the BG560 variant realizes all 247 pairs within its 404-user-I/O limit using pin-pair allocation per I/O banking rules.

Does XCV600E-6BG560C support 5 V tolerant I/O?

No, XCV600E-6BG560C does not support native 5 V tolerant I/O. Its I/O pins are 3 V tolerant, and can be made 5 V tolerant only with an external 100 Ω series resistor per pin - but PCI 5 V signaling is explicitly unsupported per DS022-1 Section "Virtex-E Compared to Virtex Devices".

How many DLLs are integrated into XCV600E-6BG560C and what are their key functions?

The XCV600E-6BG560C integrates eight fully digital Delay-Locked Loops (DLLs). Their key functions include zero-delay clock conversion from LVPECL/LVDS inputs, 50% duty-cycle synthesis for DDR interfaces, integer clock multiplication (up to 4×), and deterministic deskew across global clock networks - all without external PLL components.

Can XCV600E-6BG560C be configured via JTAG in-system?

Yes, XCV600E-6BG560C supports IEEE 1149.1 boundary-scan JTAG configuration in-system. The TCK, TMS, TDI, and TDO pins enable bitstream loading, debug access, and verification without requiring external SPI PROM or SelectMAP interface hardware.

What is the block RAM organization in XCV600E-6BG560C and how is it accessed?

XCV600E-6BG560C contains 72 block RAMs, each 4096 bits with true dual-port capability. Each block supports independent read/write addresses, clocks, and enables on Port A and Port B - enabling simultaneous access for applications like FIFO buffering or frame store without external memory controllers.