AMD XCV600E-6BG560I

Overview

XCV600E-6BG560I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 985,882 system gates, 15,552 logic cells, and 72 block RAMs (294,912 bits), designed for high-speed digital signal processing, telecom infrastructure, and embedded reconfigurable computing requiring PCI-compliant I/O and DDR clock management.

For engineers reviewing the XCV600E-6BG560I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O banking constraints, DLL timing behavior, SelectRAM+ memory configuration, and industrial-temperature (-40°C to +100°C) operation under 1.8 V core supply.

Technical Context

The XCV600E-6BG560I implements a regular array of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains, dual flip-flops per slice, and F5/F6 multiplexers enabling up to 19-input logic functions. It integrates eight fully digital Delay-Locked Loops (DLLs) supporting 300+ MHz LVPECL/LVDS clock inputs and zero-delay conversion to any I/O standard.

I/O is organized into eight banks with independent VCCO and VREF supplies; each bank supports mixed standards only if sharing VCCO voltage (e.g., LVTTL/PCI33_3 at 3.3 V), while LVDS and LVPECL require 2.5 V and 3.3 V VCCO respectively and no VREF. The BG560 package provides 404 user I/O pins across these banks.

Key Specifications

Pinout & Package

The XCV600E-6BG560I uses a 560-ball fine-pitch Ball Grid Array (BG560) package with 404 user I/O pins distributed across eight I/O banks, plus dedicated global clock inputs (GCLK0–GCLK3), configuration pins (INIT, PROGRAM_B, CCLK), JTAG boundary-scan pins (TCK/TMS/TDI/TDO), and multiple VCCINT/VCCO/VREF supply balls. Thermal pad is not present; thermal dissipation relies on solder ball thermal conduction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV600E-6BG560I, the -7 variant offers tighter timing slack at identical density, while the XCV800E-6BG560I extends logic and memory capacity within the same footprint-both preserve full pin compatibility, I/O banking rules, and DLL functionality for seamless migration.

Availability

XCV600E-6BG560I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging backend, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XCV600E-6BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions with industry-leading FPGA architectures, process leadership, and integrated development tools.

The Virtex-E family was engineered for high-performance reconfigurable computing demanding PCI compliance, DDR memory interfacing, and low-power 1.8 V operation in telecom and instrumentation applications.

FAQ

What is the maximum supported I/O standard speed for XCV600E-6BG560I?

XCV600E-6BG560I supports LVDS signaling at up to 622 Mb/s and LVPECL clock inputs exceeding 300 MHz, enabled by its differential I/O architecture and DLL-based clock deskew. These speeds are achievable using source-synchronous data transmission and proper PCB layout with controlled impedance traces.

Does XCV600E-6BG560I support true dual-port block RAM operation?

Yes, XCV600E-6BG560I contains 72 block RAMs, each configured as a true dual-port 4096-bit memory with independent address, write enable, and clock signals per port. This allows simultaneous read and write operations at different addresses, essential for ping-pong buffering and real-time data streaming applications.

How many Delay-Locked Loops (DLLs) does XCV600E-6BG560I integrate?

XCV600E-6BG560I integrates eight fully digital Delay-Locked Loops (DLLs), each capable of clock multiplication (up to 4×), duty-cycle correction to 50%, and zero-delay conversion of high-speed LVPECL/LVDS inputs to any I/O standard. These DLLs operate independently and support concurrent multi-domain clocking.

What is the core supply voltage requirement for XCV600E-6BG560I?

XCV600E-6BG560I requires a regulated 1.8 V ±3% supply on all VCCINT pins for core logic, CLBs, and internal RAM. This lower voltage versus earlier Virtex families reduces dynamic power consumption and enables higher integration density using the 0.18 μm process node.

Is XCV600E-6BG560I pin-compatible with other Virtex-E devices in the BG560 package?

Yes, XCV600E-6BG560I is pin-compatible with other Virtex-E devices offered in the BG560 package, including XCV400E-6BG560I and XCV800E-6BG560I. All share identical ball map, I/O bank assignments, and power pin locations-enabling hardware reuse across density tiers.