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AMD XCV600E-6FG676C
- Part No.:
- XCV600E-6FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XCV600E-6FG676C.pdf
- Description:
- IC FPGA 444 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,025
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Product details
Overview
XCV600E-6FG676C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 15,552 logic cells in a 676-ball Fine-Pitch BGA package. It delivers 240 MHz synchronous system performance, supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops (DLLs) for clock management - used in high-speed communication interface design and reconfigurable signal processing systems.
For engineers reviewing the XCV600E-6FG676C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, block RAM configuration, DLL timing behavior, and FPGA-specific supply voltage requirements (VCCINT = 1.8 V, VCCO bank-dependent).
Technical Context
The XCV600E-6FG676C implements a regular array of Configurable Logic Blocks (CLBs), each containing four 4-input LUTs with dedicated carry chains and dual flip-flops per slice. Its routing hierarchy includes a General Routing Matrix (GRM) and VersaRing™ I/O interconnect, enabling high place-and-route efficiency for complex synchronous designs.
It features eight fully digital DLLs supporting 50% duty-cycle generation for DDR applications, clock multiplication up to 4×, and zero-delay conversion of LVPECL/LVDS clocks to any I/O standard. Block RAM is organized in 72 columns of 4096-bit True Dual-Port memory, with independent port width configuration and dedicated CLB-to-BRAM routing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 985,882 - defines total logic capacity for gate-equivalent synthesis mapping |
| Logic Cells | 15,552 - base unit for place-and-route resource allocation and timing closure |
| Block RAM Bits | 294,912 - supports up to 72 × 4096-bit True Dual-Port RAM blocks with independent port widths |
| Max User I/O | 512 - configurable as 804 single-ended or 344 differential pairs; constrained by I/O banking rules |
| DLL Count | 8 - enables simultaneous clock domain control, phase alignment, and jitter reduction across multiple interfaces |
| VCCINT | 1.8 V - internal core supply; requires low-noise regulation and decoupling due to SRAM configuration cell sensitivity |
| Speed Grade | -6 - guarantees worst-case timing performance at 240 MHz system clock with DLL enabled |
Pinout & Package
Package: 676-ball Fine-Pitch Ball Grid Array (FG676), 1.0 mm pitch, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.8 V supply for CLBs, LUTs, and flip-flops; must be filtered separately from I/O rails |
| VCCO_0–VCCO_7 | I/O bank power | Bank-specific 1.5–3.3 V supply; determines compatible output standards per bank (e.g., SSTL3, LVCMOS2) |
| VREF_0–VREF_7 | Input threshold reference | User-supplied voltage for input standards requiring reference (e.g., SSTL, HSTL); shared across all pins in same bank |
| GCLK0–GCLK3 | Global clock inputs | Dedicated low-skew clock inputs feeding DLLs; support LVPECL/LVDS up to 300+ MHz |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test access port for configuration, debugging, and in-system verification |
Key Features
| Feature | Design Value |
|---|---|
| SelectI/O+™ Technology | Supports 20 I/O standards including LVDS (622 Mb/s), BLVDS, LVPECL, SSTL, HSTL - enables mixed-voltage board-level interfacing |
| SelectRAM+™ Memory Hierarchy | 294,912 bits of synchronous block RAM + 221,184 bits of distributed RAM - allows true dual-port memory access and embedded FIFO implementation |
| SelectLink™ DDR Link | Double Data Rate interconnect between Virtex-E devices - reduces external memory bandwidth pressure in multi-FPGA systems |
| Digital DLL Clock Management | Eight DLLs with 4× multiplication, duty-cycle correction, and zero-delay clock conversion - eliminates external clock buffers in high-speed serial links |
| Die Temperature Sensor | On-die diode for thermal monitoring - enables dynamic thermal throttling and reliability margining in sealed industrial enclosures |
Applications
| High-Speed Serial Interface | Reconfigurable Digital Signal Processing |
|---|---|
Use Scenario: Implementation of 622 Mb/s LVDS source-synchronous data capture for optical line cards. IC Role / Device Role / Timing Role: FPGA acts as protocol-agnostic serializer/deserializer with real-time clock recovery via DLL-aligned sampling. Use Value: Eliminates need for discrete SerDes ICs; leverages 512 user I/O and 8 DLLs to manage multiple parallel lanes with sub-nanosecond skew control. |
Use Scenario: Real-time adaptive filtering in radar beamforming using pipelined MAC units. IC Role / Device Role / Timing Role: Configurable datapath accelerator with distributed LUT-based arithmetic and block RAM coefficient storage. Use Value: Achieves >311 MHz internal operation on critical paths using dedicated carry logic and 15,552 logic cells - exceeds fixed-function DSP throughput for variable algorithms. |
| PCI Bus Bridge | Memory Controller Interface |
Use Scenario: 66 MHz 32-bit PCI-to-processor bus translation in industrial control backplanes. IC Role / Device Role / Timing Role: Protocol-conforming bridge with timing-compliant setup/hold enforcement and burst transaction handling. Use Value: Meets PCI 2.2 specification with 1.8 V core and 3.3 V I/O; uses VCCO_3.3 banks and dedicated tristate control for safe bus arbitration. |
Use Scenario: High-bandwidth interface to 200 MHz ZBT SRAM and DDR SDRAM in video frame buffer subsystems. IC Role / Device Role / Timing Role: Memory controller with programmable read/write latency, burst length, and address multiplexing. Use Value: Leverages 294,912-bit block RAM for command queue buffering and 200 MHz ZBT SRAM timing compliance via DLL-synchronized strobes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV600E-7FG676C | Higher speed grade (-7 vs. -6); guarantees 260 MHz system clock with tighter timing margins | Required for designs exceeding 240 MHz worst-case path delay or needing additional timing slack | Select when timing closure fails on XCV600E-6FG676C without logic optimization |
| XCV800E-6FG676C | Higher density (1,296,000 system gates, 21,600 logic cells); same package and speed grade | Needed for larger state machines, wider datapaths, or additional IP cores without PCB redesign | Choose for future-proofing or incremental feature expansion within identical footprint |
Compared with XCV600E-6FG676C, the -7 variant improves maximum operating frequency but increases power under full utilization, while the XCV800E-6FG676C adds logic capacity without changing pinout or thermal profile - enabling scalable design reuse.
Availability
XCV600E-6FG676C is available at Aetrix Electronics and suitable for high-speed serial interface design, reconfigurable DSP acceleration, PCI bus bridging, memory controller implementation, and industrial embedded control requiring stable component supply over extended production lifecycles.
Supply support for XCV600E-6FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and AI inference accelerators for aerospace, communications, and industrial markets.
The Virtex-E family was designed for high-performance, low-power reconfigurable computing in telecom infrastructure and test equipment - emphasizing I/O flexibility, clock management, and memory bandwidth over raw logic density.
FAQ
What is the maximum differential I/O pair count supported by XCV600E-6FG676C?
XCV600E-6FG676C supports up to 344 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capacity is realized only when configured with appropriate VCCO/VREF settings per I/O bank and adheres to banking constraints - e.g., LVDS pairs require 2.5 V VCCO and no VREF, while HSTL IV requires 1.5 V VCCO and 0.9 V VREF.
Does XCV600E-6FG676C support IEEE 1149.1 boundary-scan testing?
Yes, XCV600E-6FG676C includes full IEEE 1149.1 boundary-scan logic integrated into all IOBs. The TCK, TMS, TDI, and TDO pins are dedicated JTAG interface terminals, enabling in-system programming, interconnect testing, and debug visibility without requiring external test fixtures.
Can XCV600E-6FG676C operate with 5 V tolerant I/Os?
No, XCV600E-6FG676C does not support native 5 V I/O tolerance. Its I/O pins are rated for 3.3 V operation and can tolerate 5 V only with an external 100 Ω series resistor - per DS022-1 Section "Virtex-E Compared to Virtex Devices". PCI 5 V signaling is explicitly unsupported.
How many block RAM columns are implemented in XCV600E-6FG676C?
XCV600E-6FG676C implements 72 block RAM columns, as specified in Table 3 ("CLB/Block RAM Column Locations") and Table 4 ("Virtex-E Block SelectRAM Amounts") of DS022-2 (v2.8). Each column contains one 4096-bit True Dual-Port RAM block, totaling 294,912 bits of block RAM.
Is XCV600E-6FG676C pin-compatible with earlier Virtex family devices?
XCV600E-6FG676C is pin-compatible with equivalent Virtex devices in the same FG676 package, with minor exceptions documented in DS022-1 Module 4 pinout tables - such as pin J10 designated "No Connect" and pin J30 designated "VREF option only" for XCV600E. Full compatibility requires verifying bank-specific VCCO/VREF assignments.
XCV600E-6FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3456
- Number of Logic Elements/Cells:
- 15552
- Total RAM Bits:
- 294912
- Number of I/O:
- 444
- Number of Gates:
- 985882
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XCV600E-6FG676C FAQ
1.How can I place an order for XCV600E-6FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV600E-6FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV600E-6FG676C reliable?
The price and inventory of XCV600E-6FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600E-6FG676C is usually 5 days.
3.What payment methods are accepted for XCV600E-6FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600E-6FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV600E-6FG676C?
XCV600E-6FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV600E-6FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV600E-6FG676C?
For technical support, including XCV600E-6FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600E-6FG676C requirements.
6.How does Aetrix verify that XCV600E-6FG676C is sourced from the original manufacturer or authorized distributors?
All XCV600E-6FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600E-6FG676C meets industry standards.
7.What is the process for return or replacement of XCV600E-6FG676C?
All XCV600E-6FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XCV600E-6FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV600E-6FG676C part is unused and in its original packaging.
Return procedure for XCV600E-6FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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