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AMD XCV600E-6FG676I
- Part No.:
- XCV600E-6FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XCV600E-6FG676I.pdf
- Description:
- IC FPGA 444 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,193
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Product details
Overview
XCV600E-6FG676I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 186,624 logic cells in a 48 × 72 CLB array. It features eight digital Delay-Locked Loops (DLLs), up to 404 user I/O pins in FG676 package, and supports LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz interfaces. It is used in high-speed communication line cards requiring reconfigurable logic and embedded memory.
For engineers reviewing the XCV600E-6FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade (130 MHz internal performance), 1.8 V core voltage, dual-port block RAM capability, differential I/O support, and industrial temperature range (–40°C to +100°C).
Technical Context
The XCV600E-6FG676I implements a flexible CLB architecture with four logic cells per CLB, each containing 4-input LUTs, dedicated carry logic, and edge-triggered D-flip-flops with independent clock enable and synchronous/asynchronous set/reset. Its eight DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×.
I/O functionality is organized into eight banks with bank-specific VCCO and VREF requirements; it supports 20 interface standards including LVTTL, LVCMOS, SSTL, HSTL, GTL+, BLVDS, LVDS, and LVPECL - all with programmable drive strength, slew rate, and weak-keeper circuits. Input buffers for LVTTL/LVCMOS/PCI are powered by VCCO, not VCCINT.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| System Gates | 985,882 - defines total logic capacity for gate-equivalent synthesis targeting. |
| Logic Cells | 186,624 - actual configurable units with LUT+FF+carry, used for place-and-route resource estimation. |
| CLB Array | 48 × 72 - fixed grid layout enabling predictable timing closure and floorplanning. |
| Max User I/O | 404 - number of programmable single-ended I/O pins in FG676 package, usable across 8 banks. |
| Block RAM Bits | 294,912 - distributed across 72 × 4096-bit true dual-port blocks for independent read/write access. |
| DLL Count | 8 - fully digital delay-locked loops for clock deskew, phase alignment, and jitter reduction in high-speed I/O domains. |
| Core Voltage (VCCINT) | 1.8 V - enables lower dynamic power vs. 2.5 V Virtex, with 0.18 μm 6-metal process scaling. |
| Speed Grade | -6 - guarantees worst-case internal register-to-register delay ≤ 4.3 ns at 130 MHz operation. |
Pinout & Package
Package: Fine Pitch Ball Grid Array (FG676) with 676 balls, 1.0 mm pitch, RoHS-compliant, industrial-grade thermal profile.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK0–GCLK7 | Global Clock Inputs | Dedicated low-skew routing to all DLLs and CLBs; supports LVPECL/LVDS input conditioning. |
| VCCINT | Core Power Supply | 1.8 V supply for logic and memory arrays; requires local decoupling near center balls. |
| VCCO_0–VCCO_7 | I/O Bank Power | Bank-specific 1.5–3.3 V supplies; each bank must have uniform VCCO for compatible I/O standards. |
| VREF_0–VREF_7 | Input Threshold Reference | Bank-specific reference for SSTL/HSTL/GTL+ inputs; internally tied, must be externally sourced. |
| IO_LxxN/P_yy | Differential I/O Pairs | LVDS/BLEDS-capable pairs; N/P denote true/complement; require matched trace lengths. |
| TCK/TMS/TDI/TDO | JTAG Boundary Scan | IEEE 1149.1 compliant test interface; enables in-system configuration and debug. |
Key Features
| Feature | Design Value |
|---|---|
| True Dual-Port Block RAM | 72 × 4096-bit blocks support simultaneous independent read/write on separate ports - essential for FIFOs and ping-pong buffering. |
| SelectI/O+™ Technology | Supports 20 I/O standards (e.g., LVDS, LVPECL, SSTL3, HSTL IV) with per-pin programmable drive/slew - eliminates level-shifter ICs in mixed-voltage systems. |
| Digital DLLs | Eight DLLs provide deterministic clock deskew, 4× frequency multiplication, and 50% duty cycle correction - critical for source-synchronous DDR interfaces. |
| Distributed RAM | 221,184 bits of LUT-based synchronous RAM (16×1, 16×2, 32×1 configurations) - enables compact register files and small caches without block RAM usage. |
| Configurable I/O Banking | Eight independent I/O banks with isolated VCCO/VREF - allows concurrent use of LVTTL (3.3 V), SSTL2 (2.5 V), and LVCMOS18 (1.8 V) on same device. |
Applications
| High-Speed Serial Line Card | Industrial Motion Control |
|---|---|
Use Scenario: Implementing packet classification, header parsing, and DMA engines in telecom aggregation switches operating at OC-48/STM-16 rates. IC Role / Device Role / Timing Role: Reconfigurable protocol processor interfacing to multiple SerDes PHYs via LVDS and driving DDR SDRAM at 200 Mb/s. Use Value: 622 Mb/s LVDS I/O and 8 DLLs enable deterministic timing for multi-gigabit data paths without external clock clean-up circuitry. | Use Scenario: Real-time closed-loop servo control in CNC machines with synchronized analog I/O, encoder feedback, and PWM generation. IC Role / Device Role / Timing Role: Deterministic logic fabric executing PID algorithms at 50 kHz with sub-microsecond jitter, using internal block RAM for coefficient storage. Use Value: 186,624 logic cells and true dual-port RAM allow parallel execution of control law, safety monitoring, and fieldbus protocol stacks within one device. |
| Medical Imaging Data Acquisition | Radar Signal Processing |
Use Scenario: Digitizing and preprocessing ultrasound echo data from 128-channel transducer arrays with time-gain compensation and beamforming. IC Role / Device Role / Timing Role: High-throughput data concentrator with LVDS input receivers, pipeline FFT engines, and ZBT SRAM interface at 200 MHz. Use Value: 404 I/O pins and SelectRAM+™ hierarchy support simultaneous LVDS capture (≥1 Gb/s aggregate) and burst-mode memory access with <10 ns latency. | Use Scenario: Pulse-Doppler radar front-end processing including STAP, CFAR, and synthetic aperture beamforming in airborne platforms. IC Role / Device Role / Timing Role: Reconfigurable DSP accelerator with 16-bit multiplier support, carry-chain arithmetic, and DDR SDRAM buffering for real-time SAR image formation. Use Value: Dedicated carry logic and 130 MHz internal performance enable >1 GFLOPS fixed-point throughput for adaptive filtering kernels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCV600E-7FG676I | –7 speed grade: 125 MHz max internal performance, 4.4 ns register-to-register delay vs. –6's 4.3 ns. | Suitable for less timing-critical designs where margin is acceptable; identical pinout and feature set. | Select when design meets timing with margin and cost optimization is prioritized over peak performance. |
| XCV800E-6FG676I | Higher density (1.37M system gates, 245,760 logic cells); same FG676 package and –6 speed grade. | Enables larger designs without PCB redesign; requires updated bitstream and toolchain support. | Choose for future-proofing or incremental design growth where additional logic and RAM are needed. |
Compared with XCV600E-6FG676I, the –7 variant trades 0.1 ns timing margin for potential cost savings, while the XCV800E-6FG676I offers 32% more logic resources in identical packaging - both retain full pin compatibility and I/O banking structure.
Availability
XCV600E-6FG676I is available at Aetrix Electronics and suitable for high-reliability industrial motion control, medical imaging subsystems, and aerospace radar signal processing requiring stable component supply across extended lifecycle programs.
Supply support for XCV600E-6FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; headquartered in San Jose, CA, with global design and support infrastructure.
The Virtex-E family was designed for high-performance, high-density reconfigurable computing in communications infrastructure and industrial systems - emphasizing I/O flexibility, embedded memory, and deterministic clock management.
FAQ
What is the maximum differential I/O pair count supported by XCV600E-6FG676I?
XCV600E-6FG676I supports up to 247 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capacity is realized in the FG676 package and enables high-bandwidth LVDS or LVPECL interfaces without external serialization. Each pair uses two physical pins and requires matched PCB trace lengths for signal integrity.
Does XCV600E-6FG676I support JTAG boundary scan?
Yes, XCV600E-6FG676I includes IEEE 1149.1-compliant boundary scan logic across all user I/O and configuration pins. This enables in-system programming, interconnect testing, and debug visibility during development and manufacturing - verified in Module 2 of DS022-2 (v2.8).
What is the block RAM configuration capability of XCV600E-6FG676I?
XCV600E-6FG676I contains 72 block SelectRAM units, each 4096 bits with true dual-port capability. These can be configured as independent 1K×4, 2K×2, or 4K×1 memories, or combined for wider/narrower depths - supporting simultaneous read/write operations critical for real-time buffering and filtering applications.
Can XCV600E-6FG676I operate with 5 V tolerant I/O?
No, XCV600E-6FG676I does not support native 5 V tolerant I/O. Its I/O pins are 3 V tolerant, and 5 V tolerance requires external 100 Ω series resistors per pin - explicitly stated in DS022-1 (v2.3) Section "Virtex-E Compared to Virtex Devices". PCI 5 V signaling is not supported.
Is XCV600E-6FG676I pin-compatible with other Virtex-E devices in FG676 package?
XCV600E-6FG676I shares the FG676 footprint with XCV400E-6FG676I and XCV800E-6FG676I, but pin functions differ due to varying I/O counts and bank allocations. Table 3 in DS022-1 confirms distinct VCCO/VREF pin distributions; migration requires netlist and constraint file updates even when package is identical.
XCV600E-6FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-E
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3456
- Number of Logic Elements/Cells:
- 15552
- Total RAM Bits:
- 294912
- Number of I/O:
- 444
- Number of Gates:
- 985882
- Voltage - Supply:
- 1.71V ~ 1.89V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XCV600E-6FG676I FAQ
1.How can I place an order for XCV600E-6FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XCV600E-6FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XCV600E-6FG676I reliable?
The price and inventory of XCV600E-6FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XCV600E-6FG676I is usually 5 days.
3.What payment methods are accepted for XCV600E-6FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XCV600E-6FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XCV600E-6FG676I?
XCV600E-6FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XCV600E-6FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XCV600E-6FG676I?
For technical support, including XCV600E-6FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XCV600E-6FG676I requirements.
6.How does Aetrix verify that XCV600E-6FG676I is sourced from the original manufacturer or authorized distributors?
All XCV600E-6FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XCV600E-6FG676I meets industry standards.
7.What is the process for return or replacement of XCV600E-6FG676I?
All XCV600E-6FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XCV600E-6FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XCV600E-6FG676I part is unused and in its original packaging.
Return procedure for XCV600E-6FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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