AMD XCV600E-6FG680C

Overview

XCV600E-6FG680C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 985,882 system gates, 15,552 logic cells, and 512 user I/O pins in a 680-ball Fine-Pitch Ball Grid Array (FG680) package. It integrates eight digital Delay-Locked Loops (DLLs), supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and delivers internal performance up to 130 MHz (four LUT levels), targeting high-speed communication and signal processing systems.

For engineers reviewing the XCV600E-6FG680C datasheet, pinout, applications, or equivalent options, this device is selected for designs requiring PCI-compliant 33/66-MHz interfaces, DDR memory controllers, source-synchronous data capture at >240 MHz system clock rates, and flexible multi-standard I/O banking with VCCO/VREF management.

Technical Context

The XCV600E-6FG680C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, PCI, LVDS, and LVPECL-organized across eight I/O banks. Each bank requires shared VCCO and a single VREF voltage, with input buffers for LVTTL/LVCMOS2/PCI powered by VCCO (not VCCINT), enabling mixed-voltage I/O operation within bank constraints.

Key Specifications

Pinout & Package

Package: 680-ball Fine-Pitch Ball Grid Array (FG680), 1.0 mm pitch, RoHS-compliant, commercial temperature range (0°C to +85°C).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV600E-6FG680C, the -7 variant improves timing margin without changing layout, while XCV800E-6FG680C expands logic capacity within the same footprint-both retain identical I/O standards support, DLL architecture, and configuration methodology.

Availability

XCV600E-6FG680C is available at Aetrix Electronics and suitable for high-speed communication backplanes, PCI-compliant add-in cards, DDR SDRAM memory controllers, and reconfigurable DSP platforms requiring stable component supply over extended production lifecycles.

Supply support for XCV600E-6FG680C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architecture and development tool ecosystems.

The Virtex-E family was designed for high-performance, high-density system-on-chip replacements in telecommunications infrastructure, military/aerospace avionics, and industrial control where SRAM-based reconfigurability, multi-standard I/O, and embedded memory hierarchy are critical.

FAQ

What is the maximum differential I/O data rate supported by XCV600E-6FG680C?

XCV600E-6FG680C supports LVDS differential signaling at up to 622 Mb/s, as confirmed in DS022-1 Table 2 and the Features section. This rate applies to source-synchronous architectures using dedicated differential I/O pairs (IO_LxxN/IO_LxxP) with DLL-synchronized capture clocks, and is validated under worst-case timing conditions for the -6 speed grade.

Does XCV600E-6FG680C support PCI 66 MHz operation?

Yes, XCV600E-6FG680C is PCI-compliant for both 33 MHz and 66 MHz operation at 3.3 V, as stated in the Features section and verified in DS022-1 Module 1. Its I/O buffers meet PCI specification requirements for drive strength, slew rate, and timing, and it supports PCI bus mastering and target functions via configurable logic implementation.

How many Block RAMs does XCV600E-6FG680C contain, and what is their configuration capability?

XCV600E-6FG680C contains 72 Block RAMs totaling 294,912 bits, each structured as a 4096-bit true dual-port memory. As documented in DS022-2 Module 2 Table 4 and Figure 6, each block supports independent read/write addresses and widths per port, enabling built-in bus-width conversion (e.g., 32-bit write / 8-bit read) without external logic.

Is XCV600E-6FG680C pin-compatible with other Virtex-E devices in the FG680 package?

XCV600E-6FG680C shares the FG680 package footprint with XCV400E-6FG680C and XCV800E-6FG680C, but pin assignments differ due to varying I/O counts and bank layouts. DS022-1 Module 4 pinout tables confirm that only devices with identical I/O counts (e.g., XCV600E and XCV800E) have overlapping pin functions; migration requires netlist and constraint file updates.

What voltage supplies are required for XCV600E-6FG680C operation?

XCV600E-6FG680C requires two primary supplies: VCCINT = 1.8 V for core logic and memory, and bank-specific VCCO (1.5 V to 3.3 V) for I/O buffers. Per DS022-2 Module 2, input standards like LVTTL and PCI use VCCO-supplied input buffers, and VREF (0.75–1.5 V) is needed only for SSTL/HSTL banks-no external 5 V supply is supported.