AMD XCV600E-6FG900I

Overview

XCV600E-6FG900I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 186,624 logic cells in a 48 × 72 CLB array. It delivers up to 240 MHz synchronous system performance, supports LVDS/BLVDS/LVPECL differential I/O at 622 Mb/s, and integrates eight digital Delay-Locked Loops (DLLs) for clock management. It is used in high-speed communications infrastructure and reconfigurable computing platforms requiring PCI-compliant 3.3 V I/O and embedded memory hierarchy.

For engineers reviewing the XCV600E-6FG900I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration options, and industrial-temperature (-40°C to +100°C) operation guidance specific to the FG900 fine-pitch BGA package.

Technical Context

The XCV600E-6FG900I implements a regular FPGA architecture with configurable logic blocks (CLBs), input/output blocks (IOBs), and a programmable routing matrix. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice-enabling high-speed arithmetic and wide-input logic functions.

Its IOBs support 20 interface standards including LVTTL, SSTL, HSTL, LVDS, and LVPECL, with I/O banks requiring shared VCCO and single VREF per bank. Eight fully digital DLLs provide clock multiply/divide, zero-delay conversion of LVPECL/LVDS clocks, and 50% duty-cycle synthesis for DDR applications.

Key Specifications

Pinout & Package

Package: Fine Pitch Ball Grid Array (FG900) with 0.8 mm pitch, 900-ball I/O count, and 35 mm × 35 mm body size. Pinout conforms to Xilinx DS022-4 Module 4 pin tables for XCV600E in FG900; includes 8 global clock pins (GCLK0–GCLK7), 512 user I/Os grouped into 8 I/O banks, 12 VCCINT pins (1.8 V core), 24 VCCO pins (bank-specific I/O supply), and 12 VREF pins (one per bank, internally tied).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV600E-6FG900I, the -7 variant improves worst-case timing margin without layout change, while XCV800E-6FG900I offers scalable logic density within identical mechanical and thermal constraints-both retain full toolchain compatibility with Xilinx Foundation/Alliance Series.

Availability

XCV600E-6FG900I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and high-speed test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XCV600E-6FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and tools for high-performance digital system design.

The Virtex-E family was designed for high-speed, high-density reconfigurable logic applications demanding advanced I/O flexibility, embedded memory, and deterministic clock management-targeting communications, computing, and industrial systems.

FAQ

What is the maximum differential I/O pair count supported by XCV600E-6FG900I?

XCV600E-6FG900I supports up to 344 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capacity is enabled by its 512-user-I/O FG900 package and SelectI/O+™ architecture, allowing simultaneous LVDS, BLVDS, or LVPECL signaling across multiple banks with proper VCCO/VREF assignment.

Does XCV600E-6FG900I support true dual-port block RAM operation?

Yes, XCV600E-6FG900I includes 72 block SelectRAM units, each configured as a true dual-port 4096-bit RAM with independent address, data, and control lines per port. This allows concurrent read and write operations at different addresses-critical for FIFOs, ping-pong buffers, and memory-mapped peripherals in XCV600E-6FG900I designs.

Can XCV600E-6FG900I operate with 5 V-tolerant I/Os?

No, XCV600E-6FG900I I/Os are not 5 V tolerant by default. They support 3.3 V PCI and LVTTL but require external 100 Ω resistors for limited 5 V tolerance-only on pins configured as inputs. The datasheet explicitly states "PCI 5 V is not supported," and no internal 5 V tolerance circuitry exists in XCV600E-6FG900I's IOB structure.

How many Delay-Locked Loops (DLLs) does XCV600E-6FG900I integrate?

XCV600E-6FG900I integrates eight fully digital Delay-Locked Loops (DLLs), doubling the count found in prior Virtex devices. Each DLL supports clock multiply (up to 4×), divide, duty-cycle correction, and zero-delay conversion of high-speed LVPECL/LVDS inputs-enabling precise timing control across multiple clock domains in XCV600E-6FG900I implementations.

Is XCV600E-6FG900I pin-compatible with other Virtex-E devices in the FG900 package?

XCV600E-6FG900I shares the FG900 package footprint with XCV400E, XCV800E, and XCV1000E variants, but pin compatibility is conditional. While power, ground, and global clock pins align, I/O pin functions differ across densities due to CLB array scaling and bank allocation. Migration requires verification against DS022-4 pinout tables-not automatic drop-in replacement.