AMD XCV600E-6HQ240C

Overview

XCV600E-6HQ240C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 15,552 logic cells in a 240-pin High Heat Dissipation (HQ) BGA package. It delivers 130 MHz internal performance (four LUT levels), supports PCI 3.3 V/33–66 MHz compliance, and integrates eight digital Delay-Locked Loops (DLLs) for clock management - used in high-speed communication interface design and reconfigurable signal processing systems.

For engineers reviewing the XCV600E-6HQ240C datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration, and real-world FPGA implementation guidance for industrial embedded control and telecom infrastructure.

Technical Context

The XCV600E-6HQ240C implements a regular array of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs) interconnected by a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells (LCs), each with a 4-input LUT, dedicated carry logic, and dual flip-flops with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards including LVDS (622 Mb/s), LVPECL, BLVDS, SSTL, HSTL, and PCI, with I/O banks requiring shared VCCO and single VREF per bank. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty-cycle synthesis for DDR, and up to 4× frequency multiplication - all operating at 1.8 V core voltage with 3.3 V I/O tolerance.

Key Specifications

Pinout & Package

Package: 240-pin High Heat Dissipation (HQ) Ball Grid Array (BGA), 1.27 mm pitch, RoHS-compliant, thermal pad exposed on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XCV600E-6HQ240C, the -7 variant offers marginal timing headroom without hardware change, while the XCV800E-6HQ240C provides significant logic and memory headroom within identical mechanical and thermal constraints - enabling future-proofing without board revision.

Availability

XCV600E-6HQ240C is available at Aetrix Electronics and suitable for high-reliability industrial control, telecom infrastructure, and defense electronics requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for XCV600E-6HQ240C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and AI inference acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density reconfigurable computing in telecom, military, and scientific applications - emphasizing speed, I/O flexibility, and system-level integration over cost-optimized alternatives.

FAQ

What is the maximum supported I/O standard speed for XCV600E-6HQ240C?

XCV600E-6HQ240C supports LVDS signaling at up to 622 Mb/s and LVPECL clock inputs at 300+ MHz. Its SelectI/O+™ technology enables these speeds through calibrated output drivers, matched trace routing support, and DLL-synchronized sampling - confirmed in DS022-1 Table 2 and DS022-2 I/O timing specifications.

Does XCV600E-6HQ240C support true dual-port block RAM operation?

Yes, XCV600E-6HQ240C includes 72 block RAM units, each configured as a true dual-port 4096-bit memory with independent address, write-enable, and clock signals per port. This allows simultaneous read and write operations at different addresses - verified in DS022-2 Module 2, Table 4 and Figure 6.

Can XCV600E-6HQ240C be configured via JTAG after power-up?

Yes, XCV600E-6HQ240C supports IEEE 1149.1 JTAG configuration in addition to master serial and slave parallel modes. The TCK/TMS/TDI/TDO pins provide full boundary-scan capability and in-system programming - documented in DS022-1 Section "Configuration Modes" and DS022-2 Functional Description.

What is the core supply voltage requirement for XCV600E-6HQ240C?

XCV600E-6HQ240C requires a regulated 1.8 V ± 3% VCCINT supply for its core logic, CLBs, block RAM, and DLLs. Deviation beyond this range risks timing violation or configuration loss - specified in DS022-3 DC Characteristics and reinforced by thermal derating curves in Module 3.

How many DLLs does XCV600E-6HQ240C integrate, and what are their key capabilities?

XCV600E-6HQ240C integrates eight fully digital Delay-Locked Loops (DLLs). Each supports clock multiply/divide, zero-delay conversion of LVPECL/LVDS inputs, 50% duty cycle synthesis for DDR, and clock mirroring - detailed in DS022-1 Features section and DS022-2 Architectural Description.