AMD XCV600E-6HQ240I

Overview

XCV600E-6HQ240I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 15,552 logic cells in a 48 × 72 CLB array. It delivers up to 240 MHz synchronous system performance, supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops (DLLs) for clock management. It is used in high-speed communications infrastructure and reconfigurable computing systems requiring PCI-compliant 3.3 V I/O and embedded memory hierarchy.

For engineers reviewing the XCV600E-6HQ240I datasheet, pinout, applications, or equivalent options, this page provides verified architecture details, I/O banking constraints, DLL timing behavior, block RAM configuration options, and industrial-temperature (-40°C to +100°C) operation guidance specific to the HQ240 package.

Technical Context

The XCV600E-6HQ240I implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix (GRM) and VersaRing™ peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable, synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, PCI33_3, LVDS, and LVPECL-with banked VCCO (1.5 V–3.3 V) and VREF (0.75 V–1.5 V) domains. Eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication up to 4×, all operating at 1.8 V core voltage.

Key Specifications

Pinout & Package

Package: 240-pin High Heat Dissipation (HQ) plastic quad flat pack (PQFP), 0.5 mm pitch, body size 32.0 × 32.0 mm, JEDEC MS-026AC compliant. Thermal pad on underside not electrically connected.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV600E-6HQ240I, the -7 variant improves worst-case timing margin without changing pinout or power envelope, while XCV800E-6HQ240I offers headroom for logic growth within identical mechanical and thermal constraints.

Availability

XCV600E-6HQ240I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and high-speed test equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XCV600E-6HQ240I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance programmable logic solutions for demanding compute and signal processing applications.

The Virtex-E product line was engineered specifically for high-speed communications and reconfigurable computing, emphasizing I/O flexibility, clock management, and memory-rich architectures at 1.8 V core voltage.

FAQ

What is the maximum differential I/O bandwidth supported by XCV600E-6HQ240I?

XCV600E-6HQ240I supports up to 247 differential I/O pairs, enabling aggregate differential bandwidth exceeding 100 Gb/s when operating LVDS at 622 Mb/s per pair. This bandwidth is realized using source-synchronous architectures with DLL-aligned clocks and requires strict PCB trace length matching per differential pair.

Does XCV600E-6HQ240I support true dual-port block RAM operation?

Yes, XCV600E-6HQ240I includes 72 block SelectRAM units, each configured as a true dual-port 4096-bit RAM with independent address, data, and control lines for Port A and Port B. This allows simultaneous read and write operations at different addresses, essential for ping-pong buffering and FIFO implementations.

How many DLLs does XCV600E-6HQ240I integrate, and what are their key functions?

XCV600E-6HQ240I integrates eight fully digital Delay-Locked Loops (DLLs). Each provides zero-delay clock conversion, 4× frequency multiplication, 50% duty cycle correction for DDR interfaces, and phase alignment across multiple clock domains-critical for high-speed I/O and synchronous system timing.

Can XCV600E-6HQ240I operate with mixed I/O standards on the same device?

Yes, XCV600E-6HQ240I supports mixed I/O standards through eight independent I/O banks. Each bank accepts only standards sharing the same VCCO and, where required, the same VREF voltage-e.g., LVTTL and PCI33_3 can coexist in a 3.3 V bank, but not with SSTL3 which requires 1.5 V VREF.

What is the industrial temperature rating for XCV600E-6HQ240I, and how is it validated?

XCV600E-6HQ240I carries the 'I' suffix indicating industrial temperature operation from -40°C to +100°C junction temperature. This rating is validated per DS022-1 (v2.3) Production Product Specification, with 100% factory testing at temperature extremes and characterization of timing parameters across the full range.