AMD XCV600E-7BG432C0773

Overview

XCV600E-7BG432C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 186,624 logic cells, 72 block RAMs (294,912 bits), and 316 user I/O pins in a 432-ball BGA package. It delivers up to 240 MHz system clock performance, supports LVDS/BLVDS/LVPECL differential I/O up to 622 Mb/s, and integrates eight digital Delay-Locked Loops for precise clock management - used in high-speed communication interface bridging and reconfigurable signal processing subsystems.

For engineers reviewing the XCV600E-7BG432C datasheet, pinout, applications, or equivalent options, key selection considerations include its -7 speed grade timing (e.g., 4.3 ns register-to-register delay), 1.8 V core voltage, banked I/O architecture supporting mixed-voltage standards (LVTTL, SSTL, HSTL), and obsolescence status requiring lifecycle-aware sourcing.

Technical Context

The XCV600E-7BG432C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix and VersaRing peripheral routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice.

Its eight fully digital DLLs provide zero-delay clock conversion, 50% duty cycle synthesis for DDR, and frequency multiplication; IOBs support 20 interface standards including LVDS and LVPECL with programmable drive strength (up to 48 mA sink), slew rate control, and bank-specific VCCO/VREF constraints.

Key Specifications

Pinout & Package

Package: 432-ball Fine-Pitch Ball Grid Array (BG432), 1.0 mm pitch, RoHS-compliant, thermal pad optional. Dimensions: 27 mm × 27 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA applications.

Compared with XCV600E-7BG432C, the -8 variant improves maximum operating frequency by ~12% with no change in power or package, while the XCV800E-7BG432C adds 48% more logic cells at identical speed and pinout - enabling scalable architecture evolution without layout revision.

Availability

XCV600E-7BG432C is available at Aetrix Electronics and suitable for industrial control systems, telecom infrastructure hardware, and legacy FPGA replacement programs requiring stable component supply despite its obsolete status.

Supply support for XCV600E-7BG432C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, specializing in FPGAs, adaptive SoCs, and software-defined solutions for aerospace, defense, and high-performance computing.

The Virtex-E family was designed for high-speed, high-density reconfigurable logic in communications infrastructure and compute-accelerated systems - emphasizing I/O flexibility, clock management, and memory hierarchy over raw gate count.

FAQ

Is XCV600E-7BG432C still in production?

No, XCV600E-7BG432C was discontinued per Xilinx Notices XCN09001 and XCN12026, effective March 2014. Aetrix Electronics maintains limited legacy inventory with full traceability and offers lifecycle management support including cross-reference guidance and obsolescence mitigation planning for XCV600E-7BG432C.

What is the maximum differential I/O data rate supported by XCV600E-7BG432C?

XCV600E-7BG432C supports LVDS and LVPECL signaling up to 622 Mb/s per differential pair, verified in DS022-1 Table 2 for source-synchronous architectures. This rate is achievable using DLL-synchronized I/O with proper PCB impedance control (100 Ω differential) and termination.

Can XCV600E-7BG432C operate with 2.5 V I/O standards like SSTL2?

Yes, XCV600E-7BG432C supports SSTL2 Class I/II via its I/O banking architecture: VCCO must be set to 2.5 V for the relevant bank, and VREF supplied at 1.25 V. Table 1 in DS022-2 confirms SSTL2 compatibility, and bank isolation prevents interference with adjacent 1.8 V or 3.3 V I/O sections.

How many DLLs does XCV600E-7BG432C include, and what are their primary functions?

XCV600E-7BG432C integrates eight fully digital Delay-Locked Loops (DLLs). Each provides zero-delay clock conversion, 50% duty cycle correction for DDR interfaces, frequency multiplication (up to 4×), and phase alignment - critical for synchronizing multiple high-speed I/O standards and internal logic domains within the same device.

What package type and ball count does XCV600E-7BG432C use?

XCV600E-7BG432C uses a 432-ball Ball Grid Array (BG432) package with 1.0 mm pitch, as confirmed in Table 3 of DS022-1. This package supports 316 user I/O pins plus power, ground, and configuration signals, and is compatible with standard surface-mount assembly processes.