AMD XCV600E-7BG560C

Overview

XCV600E-7BG560C from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array with 985,882 system gates, 15,552 logic cells, and 404 user I/O pins in a 560-ball BGA package. It features eight digital Delay-Locked Loops (DLLs), up to 294,912 bits of synchronous block RAM, and supports LVDS (622 Mb/s), LVPECL, and PCI 3.3 V 66 MHz interfaces for high-speed communication subsystems.

For engineers reviewing the XCV600E-7BG560C datasheet, pinout, applications, or equivalent options, key selection criteria include its -7 speed grade (4.3 ns register-to-register delay), 1.8 V core voltage with 3.3 V I/O tolerance, dual-port block RAM configuration, DLL-based clock management, and compatibility with Xilinx Foundation/Alliance design tools.

Technical Context

The XCV600E-7BG560C implements a regular array architecture of Configurable Logic Blocks (CLBs) and Input/Output Blocks (IOBs), interconnected via a General Routing Matrix and VersaRing I/O routing. Each CLB contains four logic cells with 4-input LUTs, dedicated carry chains, and dual flip-flops per slice with independent clock enable and synchronous/asynchronous set/reset.

Its IOBs support 20 interface standards-including LVTTL, LVCMOS2, SSTL3, HSTL, LVDS, and LVPECL-organized across eight I/O banks with bank-specific VCCO and VREF requirements. All I/Os are 3.3 V tolerant; 5 V tolerance requires external 100 Ω resistors, and PCI 5 V is not supported.

Key Specifications

Pinout & Package

The XCV600E-7BG560C is housed in a 560-ball Fine-Pitch Ball Grid Array (BG560) package with 1.27 mm pitch, designed for high-density PCB layouts and thermal performance in industrial and telecom applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV600E-7BG560C, the -6 variant trades 7% timing margin for lower cost and power, while the -8 variant adds 7% margin for demanding clock-domain crossing or ultra-low-latency applications-both share identical pinout, memory, I/O, and toolchain support.

Availability

XCV600E-7BG560C is available at Aetrix Electronics and suitable for high-speed data acquisition, telecom line card interface, PCI bus bridging, and industrial motion control applications requiring stable component supply across extended product lifecycles.

Supply support for XCV600E-7BG560C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and developed the Virtex family as high-performance programmable logic solutions for communications, aerospace, and industrial markets.

The Virtex-E product line was engineered to deliver higher logic density, faster I/O (622 Mb/s LVDS), and lower 1.8 V core power versus prior Virtex devices-targeting reconfigurable computing, protocol adaptation, and real-time signal processing.

FAQ

What is the maximum differential I/O data rate supported by the XCV600E-7BG560C?

The XCV600E-7BG560C supports LVDS signaling at up to 622 Mb/s per differential pair, as confirmed in DS022-1 Section "Differential Signalling Support". This rate applies to both input and output directions and is achievable using source-synchronous architectures with DLL-managed clock recovery. The device's 247 differential I/O pairs provide aggregate bandwidth exceeding 100 Gb/s.

Does the XCV600E-7BG560C support 5 V tolerant I/O?

The XCV600E-7BG560C does not natively support 5 V tolerant I/O. Its I/O pins are rated for 3.3 V operation and tolerate up to 3.6 V absolute maximum. However, 5 V tolerance can be achieved externally using a 100 Ω series resistor per I/O line, as documented in DS022-1 Section "Virtex-E Compared to Virtex Devices". PCI 5 V signaling is explicitly unsupported.

How many block RAMs does the XCV600E-7BG560C contain, and what is their configuration capability?

The XCV600E-7BG560C contains 72 block RAMs totaling 294,912 bits. Each block is a true dual-port 4096-bit memory with independently configurable read/write widths per port (e.g., 256×16 on port A, 512×8 on port B), enabling built-in bus-width conversion and simultaneous access for pipelined data flow-critical for video frame buffering and packet buffering applications.

Is the XCV600E-7BG560C pin-compatible with other Virtex-E devices in the BG560 package?

Yes, the XCV600E-7BG560C shares identical pinout with other Virtex-E devices offered in the BG560 package, including XCV400E-7BG560C and XCV600E variants of different speed grades. Pin compatibility is confirmed in DS022-4 (Pinout Tables Module), and Table 3 in DS022-1 shows consistent 404-user-I/O count across all BG560 Virtex-E devices.

What development tools are officially supported for the XCV600E-7BG560C?

The XCV600E-7BG560C is fully supported by the Xilinx Foundation Series and Alliance Series development systems, as stated in DS022-1 Section "Supported by Xilinx Foundation™ and Alliance Series™ Development Systems". These tools provide behavioral/schematic entry, simulation, automatic place-and-route, and bitstream generation-enabling complete design flow from RTL to configuration download.