AMD XCV600E-7BG560I

Overview

XCV600E-7BG560I from Xilinx is a 1.8 V SRAM-based Field Programmable Gate Array (FPGA) with 985,882 system gates and 15,552 logic cells in a 48 × 72 CLB array. It delivers 130 MHz internal performance (four LUT levels), supports up to 404 user I/Os in the BG560 package, and features eight digital Delay-Locked Loops (DLLs) for clock management. It is used in high-speed communication interfaces requiring LVDS, LVPECL, or PCI-compliant I/O.

For engineers reviewing the XCV600E-7BG560I datasheet, pinout, applications, or equivalent options, key selection considerations include its -7 speed grade (4.3 ns register-to-register delay), 1.8 V core voltage, 3.3 V tolerant I/O banks, dual-port block RAM capacity (294,912 bits), and industrial temperature range (–40 °C to +100 °C).

Technical Context

The XCV600E-7BG560I implements a flexible architecture built around configurable logic blocks (CLBs) containing four logic cells each, with dedicated carry chains for arithmetic and F5/F6 multiplexers enabling up to 19-input functions. Its IOBs support 20 interface standards including LVDS (622 Mb/s), LVPECL, and PCI 33/66 MHz, with per-bank VCCO and VREF control.

It integrates 72 block RAMs (4096-bit True Dual-Port), 221,184 bits of distributed RAM, and eight fully digital DLLs offering clock multiply/divide, 50% duty cycle synthesis for DDR, and zero-delay conversion of high-speed differential clocks. Configuration is SRAM-based via JTAG, SelectMAP™, or slave serial modes.

Key Specifications

Pinout & Package

Package: 560-ball Fine-Pitch Ball Grid Array (BG560), 1.27 mm pitch, RoHS-compliant, thermally enhanced for industrial operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based system integration applications.

Compared with XCV600E-7BG560I, the -8 variant improves timing margin without changing layout or power delivery, while the XCV800E-7 offers scalable logic capacity within identical mechanical and thermal constraints-enabling forward-compatible design without sacrificing industrial qualification.

Availability

XCV600E-7BG560I is available at Aetrix Electronics and suitable for high-reliability communication infrastructure, industrial control systems, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XCV600E-7BG560I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-E family was designed for high-performance, high-density system integration in telecom, military, and industrial applications-emphasizing speed, I/O flexibility, and low-power 1.8 V operation on a 0.18 μm process.

FAQ

What is the maximum differential I/O pair count supported by XCV600E-7BG560I?

XCV600E-7BG560I supports up to 247 differential I/O pairs, as confirmed in Table 1 of DS022-1 (v2.3). This capacity enables full utilization of LVDS or BLVDS interfaces in high-speed backplane or camera-link applications without external transceivers. The BG560 package allocates pins to meet this requirement while maintaining signal integrity through controlled impedance routing.

Does XCV600E-7BG560I support PCI-X 133 MHz operation?

No, XCV600E-7BG560I is specified only for PCI 33/66 MHz compliance per its datasheet. It meets PCI Local Bus Specification Rev 2.2 for 32/64-bit, 33/66 MHz operation but lacks timing certification or I/O drive strength for PCI-X 133 MHz. For PCI-X, designers must use later-generation Virtex-II or dedicated PCI-X bridge ICs.

Can XCV600E-7BG560I be configured via JTAG in-system?

Yes, XCV600E-7BG560I supports IEEE 1149.1 JTAG boundary scan for in-system configuration, debugging, and verification. Its TCK/TMS/TDI/TDO pins implement full JTAG functionality, allowing bitstream loading, readback, and device identification without requiring external configuration PROMs during development or field updates.

What is the block RAM depth/width configuration flexibility of XCV600E-7BG560I?

XCV600E-7BG560I's 4096-bit block RAMs support independent port widths (1–32 bits per port) and depths (128–4096 words), enabling true dual-port operation with asymmetric addressing. This allows simultaneous read/write at different addresses-critical for ping-pong buffering, FIFOs, and memory-mapped peripheral interfaces without external SRAM.

Is XCV600E-7BG560I pin-compatible with Virtex-E XCV600E-7FG680I?

No, XCV600E-7BG560I and XCV600E-7FG680I are not pin-compatible due to differing package types (BG560 vs. FG680) and ball/pad layouts. While both share the same logic resources and speed grade, their physical pinouts, thermal pads, and I/O bank mappings differ significantly-requiring separate PCB designs and layout validation.